摘要:
The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.
摘要:
An air-permeable film is prepared by mono-axially drawing a composition comprising a linear low density polyethylene resin having a mw. distribution from 5 to 20, 1 to 100 parts by weight of propylene resin, 1 to 30 parts by weight of an ethylene-propylene copolymer, 1 to 30 parts by weight of a polyolefin resin which has a melt index of 12 or higher, and 50 to 200 parts by weight of an inorganic filler based on 100 parts by weight of total resin by 1.5 to 3 times.