公开(公告)号：US20080102541A1

公开(公告)日：2008-05-01

申请号：US11924927

申请日：2007-10-26

申请人： Eun Jeong Kang ,  Gi Cherl Kim ,  Moon Hwan Chang ,  Eun Chae Jeon ,  Young Keun Lee

发明人： Eun Jeong Kang ,  Gi Cherl Kim ,  Moon Hwan Chang ,  Eun Chae Jeon ,  Young Keun Lee

IPC分类号： H01L21/66

CPC分类号： H01L33/0095 ,  H01L25/0753 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/00014

摘要： The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.

摘要翻译： 本发明涉及一种制造用于船上芯片的发光二极管（LED）芯片的制造方法和一种以板上芯片制造LED光源模块的方法。 本发明的方法包括在晶片上形成多个LED芯片，模制每个LED芯片的区域，将晶片切割成每个LED芯片，并测试每个LED芯片的操作特性。

公开(公告)号：US08114689B2

公开(公告)日：2012-02-14

申请号：US11924927

申请日：2007-10-26

申请人： Eun Jeong Kang ,  Gi Cherl Kim ,  Moon Hwan Chang ,  Eun Chae Jeon ,  Young Keun Lee

发明人： Eun Jeong Kang ,  Gi Cherl Kim ,  Moon Hwan Chang ,  Eun Chae Jeon ,  Young Keun Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/0095 ,  H01L25/0753 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/00014

摘要： The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board fashion. The method of the present invention includes forming a plurality of LED chips on a wafer, molding a region of each LED chip, cutting the wafer into each LED chip, and testing each LED chip for operating characteristics.

摘要翻译： 本发明涉及一种制造用于船上芯片的发光二极管（LED）芯片的制造方法和一种以板上芯片制造LED光源模块的方法。 本发明的方法包括在晶片上形成多个LED芯片，模制每个LED芯片的区域，将晶片切割成每个LED芯片，并测试每个LED芯片的操作特性。

公开(公告)号：US07738189B2

公开(公告)日：2010-06-15

申请号：US11928717

申请日：2007-10-30

申请人： Se Ki Park ,  Gi Cherl Kim ,  Seock Hwan Kang ,  Eun Jeong Kang

发明人： Se Ki Park ,  Gi Cherl Kim ,  Seock Hwan Kang ,  Eun Jeong Kang

IPC分类号： G02B17/00

CPC分类号： G02B19/0071 ,  G02B3/08 ,  G02B19/0028 ,  G02B19/0061 ,  G02F1/133603 ,  G02F1/133611 ,  G02F2001/133607 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： The present invention provides a side emitting lens that may reduce optical loss and improve light emitting ratios, and a backlight unit and liquid crystal display including the side emitting lens. The side emitting lens may have a substantially dome-shaped body. The body includes a base part on which external light is incident, a refracting part to refract incident light and emit the light from side surfaces, and a reflecting part. The reflecting part is in the shape of a conical recess at a central portion of the refracting part to fully reflect the incident light toward one of the refracting part and the base part and the reflecting part comprises two or more reflecting surfaces. Each of the two or more reflecting surfaces is a curved surface.

摘要翻译： 本发明提供了可以减少光损耗和提高发光比的侧面发射透镜，以及包括侧面发射透镜的背光单元和液晶显示器。 侧面发射透镜可以具有基本上圆顶形的主体。 主体包括外部光入射的基部，折射入射光并从侧面发光的折射部和反射部。 反射部分是在折射部分的中心部分处的锥形凹部的形状，以将入射光全部反射到折射部分和基部之一，并且反射部分包括两个或更多个反射表面。 两个或更多个反射表面中的每一个都是曲面。