公开(公告)号：US20210091529A1

公开(公告)日：2021-03-25

申请号：US16581923

申请日：2019-09-25

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Vipulkumar K. PATEL ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: H01S3/23 ,  H01L31/0304 ,  H01S5/10 ,  H01S5/14 ,  G02B6/12

Abstract: Described herein is a two chip photonic device (e.g., a hybrid master oscillator power amplifier (MOPA)) where a gain region and optical amplifier region are formed on a III-V chip and a variable reflector (which in combination with the gain region forms a laser cavity) is formed on a different semiconductor chip that includes silicon, silicon nitride, lithium niobate, or the like. Sides of the two chips are disposed in a facing relationship so that optical signals can transfer between the gain region, the variable reflector, and the optical amplifier.

公开(公告)号：US20200319416A1

公开(公告)日：2020-10-08

申请号：US16522531

申请日：2019-07-25

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Aparna R. PRASAD ,  Sandeep RAZDAN

IPC: G02B6/42

Abstract: The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.