公开(公告)号：US20090032651A1

公开(公告)日：2009-02-05

申请号：US12184327

申请日：2008-08-01

Applicant: Derek Sayres

Inventor： Derek Sayres

IPC: H02G3/04 ,  G02B6/44 ,  F16L3/26

CPC classification number: G02B6/4459 ,  H02G3/0418

Abstract: A cover for a cable trough system includes a main body that defines a planar surface with a first end and a second end, and a first hinge arrangement at the first end of the main body. The first hinge arrangement includes a planar member that extends from the first end, the planar member including a planar detent, an intermediate member that extends from the planar member, the intermediate member including a first arm with a first intermediate detent and a second arm with a second intermediate detent, and a distal member that extends from a distal end of the planar member, the distal member including a distal detent. The planar member, the intermediate member, and the distal member together define a space sized to receive a portion of a wall of a trough member.

Abstract translation: 用于电缆槽系统的盖包括限定具有第一端和第二端的平面的主体，以及在主体的第一端处的第一铰链装置。 第一铰链装置包括从第一端延伸的平面构件，平面构件包括平面制动器，从平面构件延伸的中间构件，中间构件包括具有第一中间制动器的第一臂和具有第一臂的第二臂， 第二中间制动器和远端构件，其从所述平面构件的远端延伸，所述远端构件包括远端制动器。 平面构件，中间构件和远端构件一起限定了尺寸设置成容纳槽构件的壁的一部分的空间。

公开(公告)号：USD576108S1

公开(公告)日：2008-09-02

申请号：US29276482

申请日：2007-01-26

Applicant: Derek Sayres ,  Thomas C. Tinucci ,  Yilmaz Bayazit

Designer： Derek Sayres ,  Thomas C. Tinucci ,  Yilmaz Bayazit

公开(公告)号：US20080181568A1

公开(公告)日：2008-07-31

申请号：US11698799

申请日：2007-01-26

Applicant: Derek Sayres ,  Thomas C. Tinucci ,  Thomas L. Barnes

Inventor： Derek Sayres ,  Thomas C. Tinucci ,  Thomas L. Barnes

IPC: G02B6/00

CPC classification number: G02B6/4459 ,  H02G3/0437 ,  H02G3/0608

Abstract: A telecommunications cable management system includes trough elements including a planar top surface and sides for cable routing and management. The trough elements are made from separate parts assembled together with a mating arrangement. The mating arrangement allows assembly of the system on site, such as by snapping the parts together. The trough elements are then assembled together to form the cable management system.

公开(公告)号：US07324348B2

公开(公告)日：2008-01-29

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg, Jr. ,  Todd Husom ,  Derek Sayres

IPC: H05K5/00

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：US07245717B2

公开(公告)日：2007-07-17

申请号：US09861187

申请日：2001-05-18

Applicant: Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Derek Sayres ,  Eric Sit

Inventor： Gregory J. Fritz ,  Alejandra Anderson ,  Robin Berg ,  Derek Sayres ,  Eric Sit

IPC: H05K5/02

CPC classification number: H04B1/08 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/15 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/1425 ,  Y10T29/49826

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。

公开(公告)号：US20060002098A1

公开(公告)日：2006-01-05

申请号：US11171081

申请日：2005-06-28

Applicant: Robin Berg ,  Todd Husom ,  Derek Sayres

Inventor： Robin Berg ,  Todd Husom ,  Derek Sayres

IPC: H05K7/18

CPC classification number: H04Q1/10 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/1425 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

公开(公告)号：US20050135770A1

公开(公告)日：2005-06-23

申请号：US11000363

申请日：2004-11-29

Applicant: Brian McClellan ,  Dale Madsen ,  Robin Berg ,  Joseph Czyscon ,  Steven Skradde ,  Derek Sayres ,  Todd Husom

Inventor： Brian McClellan ,  Dale Madsen ,  Robin Berg ,  Joseph Czyscon ,  Steven Skradde ,  Derek Sayres ,  Todd Husom

IPC: G02B6/38 ,  G02B6/44 ,  H05K7/14 ,  G02B6/00

CPC classification number: G02B6/4452 ,  G02B6/3897 ,  H05K7/1448

Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections. Module embodiments may also include circuitry for converting electrical signals to optical and optical signals to electrical, and the circuitry may selectively operate at multiple data rates.

Abstract translation: 公开了与电信机箱一起使用的电信机箱和相关模块。 电信机箱的实施例包括诸如水平通道和/或具有在一个表面中的脊和/或狭槽的水平表面的结构，而另一个的脊是用于接收安装在底盘内的模块的边缘的结构。 实施例的其他结构包括在水平表面中的分隔槽，其接纳分隔壁的边缘以将分隔壁固定就位，包括在底盘内的热障板表面和/或具有半径限制器的电缆引导件。 模块实施例包括诸如具有成角度部分的面板的结构，其中光纤电缆连接指向光纤电缆的行进方向。 其他模块结构包括围绕电路板的壳体和/或提供具有光纤电缆连接的倾斜部分的壳体。 模块实施例还可以包括用于将电信号转换为光信号和光信号到电的电路，并且电路可以以多个数据速率选择性地操作。