公开(公告)号：US07695870B2

公开(公告)日：2010-04-13

申请号：US12158936

申请日：2008-03-06

Applicant: Jong-Hyeok Park ,  Sang-Young Lee ,  Jang-Hyuk Hong ,  Moon-Ja Nam ,  Jung-A Yoo ,  Sang-Seop Kim ,  Chang-Hun Han

Inventor： Jong-Hyeok Park ,  Sang-Young Lee ,  Jang-Hyuk Hong ,  Moon-Ja Nam ,  Jung-A Yoo ,  Sang-Seop Kim ,  Chang-Hun Han

IPC: H01M2/16 ,  H01M2/18 ,  H01M10/04 ,  H01M4/48 ,  B05D5/12 ,  B05C5/00

CPC classification number: H01M2/166 ,  H01M2/16 ,  H01M2/1686 ,  H01M10/052

Abstract: An organic/inorganic composite separator includes a porous substrate having a plurality of pores; and a porous coating layer formed on at least one surface of the porous substrate with a plurality of inorganic particles and a binder polymer. The binder polymer is a copolymer including: (a) a first monomer unit having a contact angle to a water drop in the range from 0° to 49°; and (b) a second monomer unit having a contact angle to a water drop in the range from 50° to 130°. This organic/inorganic composite separator has excellent thermal stability, so it may restrain an electric short circuit between a cathode and an anode. In addition, the separator may prevent inorganic particles in the porous coating layer from being extracted during an assembling process of an electrochemical device, thereby improving stability of an electrochemical device.

Abstract translation: 有机/无机复合隔膜包括具有多个孔的多孔基材; 以及在多孔基材的至少一个表面上形成有多个无机颗粒和粘合剂聚合物的多孔涂层。 粘合剂聚合物是共聚物，其包含：（a）与0〜49°的水滴接触角的第一单体单元; 和（b）第二单体单元，其具有与水滴在50°至130°范围内的接触角。 该有机/无机复合隔膜具有优异的热稳定性，因此可以抑制阴极与阳极之间的电短路。 此外，隔膜可以防止多孔涂层中的无机颗粒在电化学装置的组装过程中被提取，从而提高电化学装置的稳定性。

公开(公告)号：US20090166627A1

公开(公告)日：2009-07-02

申请号：US12344438

申请日：2008-12-26

Applicant: Chang-Hun Han

Inventor： Chang-Hun Han

IPC: H01L31/02 ,  H01L31/0376 ,  H01L21/04

CPC classification number: H01L27/14634 ,  H01L27/14643 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor may include a first substrate having circuitry including wires and a silicon layer formed on and/or over the first substrate to selectively contact the wires. The image sensor may include photodiodes bonded to the first substrate while contacting the silicon layer and electrically connected to the wires. Each unit pixel may be implemented having complicated circuitry without a reduction in photosensitivity. Additional on-chip circuitry may also be implanted in the design.

Abstract translation: 图像传感器可以包括具有包括导线的电路的第一基板和形成在第一基板上和/或上方的硅层，以选择性地接触导线。 图像传感器可以包括在与硅层接触并且电连接到电线时结合到第一衬底的光电二极管。 可以实现每个单位像素具有复杂的电路而不降低光敏性。 还可以在设计中植入附加的片上电路。