摘要:
A polyimide fiber having textile physical property characteristics and the process of melt extruding same from a polyimide powder. Polyimide powder formed as the reaction product of the monomers 3,4'-ODA and ODPA, and endcapped with phthalic anhydride to control the molecular weight thereof, is melt extruded in the temperature range of 340.degree. C. to 360.degree. C. and at heights of 100.5 inches, 209 inches and 364.5 inches. The fibers obtained have a diameter in the range of 0.0068 inch to 0.0147 inch; a mean tensile strength in the range of 15.6 to 23.1 ksi; a mean modulus of 406 to 465 ksi; and a mean elongation in the range of 14 to 103%.
摘要:
The invention is a direct process for preparing semi-crystalline polyimides. This process comprises the steps of: providing a polar aprotic solvent, adding a dianhydride and a diamine to the solvent to form a mixture, stirring the mixture at ambient temperature, and adding glacial acetic acid to the mixture to provide a ratio of polar aprotic solvent to glacial acetic acid which ranges from about 90 to 10 to about 75 to 25 by volume to form a solution. The solution was heated to a range from about 110.degree. C. to about 140.degree. C. to form a polyimide precipitate. The polyimide precipitate was recovered as a semi-crystalline polyimide powder.
摘要:
The diamine, 1,3-diamino-5-pentafluorosulfanylbenzene (DASP), was reacted with various dianhydrides to form polyimides containing an SF.sub.5 moiety. These polyimides exhibit high glass transition temperatures, high density, low solubility, and low dielectric properties. These polymers were used to prepare semi-permeable membranes, wire coatings, and films and are useful for electronic, space and piezoelectric applications.
摘要:
A process was developed to prepare 1,3-diamino-5-pentafluorosulfanylbenzene. This process involved two steps: preparing the dinitro compound, 1,3-dinitro-5-pentafluorosulfanylbenzene, and reducing this compound to form the corresponding diamine. This diamine was reacted with various dianhydrides, diacidchlorides, and epoxy resins to form polyimides, polyamides, and crosslinked epoxies. These polymers were used to prepare semi-permeable membranes, wire coatings, and films.
摘要:
The process of the present invention includes first treating a polyamide-acid (such as LARC-TPI polyamide-acid) in an amide-containing solvent (such as N-methylpyrrolidone) with an aprotic organic base (such as triethylamine), followed by dehydrating with an organic dehydrating agent (such as acetic anhydride). The level of crystallinity in the linear aromatic polyimide so produced is maximized without any degradation in the molecular weight thereof.
摘要:
An aromatic condensation polyimide film that is approximately 90% transparent at 500 nm, useful for thermal protective coatings and the like and the process for preparing same are disclosed. An essential feature of the invention for achieving maximum optical transparency films requires utilizing recrystallized and/or sublimated specific aromatic diamines and dianhydride monomers and introducing bulky electron-withdrawing groups and separator groups into the polymer molecular structure. The incorporation of bulky electron-withdrawing groups in the diamine portion of the polymer structure serves to reduce the formation of inter-chain and intra-chain charge transfer complexes which normally cause large absorptions in the UV-visible range. Incorporation of separator atoms into either the diamine or dianhydride monomers serves to reduce the amount of conjugation and inter-and intra-chain electronic interactions and thereby lessen charge transfer complex formation.
摘要:
A process of endcapping a polyimide system with an endcapping agent in order to achieve a controlled decrease in molecular weight and melt viscosity along with predictable fracture resistance of the molded products is disclosed. The uncapped system is formed by combining an equimolar ratio of 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA) and 1,3-bis(aminophenoxy)benzene (APB) dissolved in bis(2-methoxyethyl)ether. The endcapped system is formed by dissolving APB in bis-(2-methoxyethyl)ether, adding the endcapping agent, and then adding the BDSDA. By varying the amount of endcapping from 0 to 4%, molecular weight is decreased from 13,900 to 8660. At a processing temperature of 250.degree. C., there is a linear relationship between molecular weight and viscosity, with the viscosity decreasing by two orders of magnitude as the molecular weight decreased from 13,900 to 8660. A greater drop in viscosity is noted at higher temperatures. Apparent viscosity as a function of molecular weight at 250.degree. C. and at 280.degree. C. is depicted in FIG. 2. Reducing the molecular weight also results in a linear decrease in the fracture resistance from 4100 J/m.sup.2 to 296 J/m.sup.2, as shown in FIG. 1.
摘要翻译:公开了一种使用封端剂封端聚酰亚胺系统以便实现分子量和熔体粘度的受控降低以及模制产品的可预测的耐断裂性的方法。 未封端的体系是通过将等摩尔比的4,4'-双(3,4-二羧基苯氧基)二苯硫醚二酐(BDSDA)和1,3-双(氨基苯氧基)苯(APB))溶于双(2-甲氧基乙基) 醚。 通过将APB溶解在双(2-甲氧基乙基)醚中,加入封端剂,然后加入BDSDA形成封端体系。 通过将封端量从0降低到4%,分子量从13,900降低到8660.在250℃的加工温度下,分子量和粘度之间存在线性关系,粘度降低了两个数量级 随着分子量从13,900降低到8660.在较高的温度下,粘度的下降更大。 在250℃和280℃下作为分子量的函数的表观粘度如图1所示。 降低分子量也导致断裂阻力从4100J / m 2到296J / m 2的线性降低,如图2所示。 1。
摘要:
A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistant which is generally associated with polyimides but not polysulfones. This system is processable in the 250.degree.-350.degree. C. range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.
摘要:
Novel polyphenylene ethers with imide linking units are disclosed. These polymers incorporate the solvent and thermal resistance of polyimides and the processability of polyphenylene ethers. Improved physical properties over those of the prior art are obtained by incorporating meta linked ethers and/or polyphenylene oxides into the polymer backbone. A novel process for making polymers of this type is also disclosed. The process is unique in that the expected need of high process temperatures and/or special atmospheres are eliminated.
摘要:
A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistance which is generally associated with polyimides but not polysulfones. This system is processable in the 250.degree.-350.degree. C. range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.