Polyimide fibers
    1.
    发明授权
    Polyimide fibers 失效
    聚酰亚胺纤维

    公开(公告)号:US5840828A

    公开(公告)日:1998-11-24

    申请号:US858201

    申请日:1997-05-07

    摘要: A polyimide fiber having textile physical property characteristics and the process of melt extruding same from a polyimide powder. Polyimide powder formed as the reaction product of the monomers 3,4'-ODA and ODPA, and endcapped with phthalic anhydride to control the molecular weight thereof, is melt extruded in the temperature range of 340.degree. C. to 360.degree. C. and at heights of 100.5 inches, 209 inches and 364.5 inches. The fibers obtained have a diameter in the range of 0.0068 inch to 0.0147 inch; a mean tensile strength in the range of 15.6 to 23.1 ksi; a mean modulus of 406 to 465 ksi; and a mean elongation in the range of 14 to 103%.

    摘要翻译: 具有纺织物理特性的聚酰亚胺纤维及其从聚酰亚胺粉末熔融挤出的方法。 作为单体3,4'-ODA和ODPA的反应产物形成并与邻苯二甲酸酐封端以控制其分子量的聚酰亚胺粉末在340℃至360℃的温度范围内熔融挤出, 高度为100.5英寸,209英寸和364.5英寸。 所获得的纤维的直径范围为0.0068英寸至0.0147英寸; 平均拉伸强度在15.6至23.1ksi的范围内; 平均模数为406〜465ksi; 平均伸长率在14〜103%的范围内。

    Polyimide fibers
    2.
    发明授权
    Polyimide fibers 失效
    聚酰亚胺纤维

    公开(公告)号:US5670256A

    公开(公告)日:1997-09-23

    申请号:US689760

    申请日:1996-08-13

    IPC分类号: C08G73/10 D01F6/74 D02G3/00

    摘要: A polyimide fiber having textile physical property characteristics and the process of melt extruding same from a polyimide powder. Polyimide powder formed as the reaction product of the monomers 3,4'-ODA and ODPA, and endcapped with phthalic anhydride to control the molecular weight thereof, is melt extruded in the temperature range of 340.degree. C. to 360.degree. C. and at heights of 100.5 inches, 209 inches and 364.5 inches. The fibers obtained have a diameter in the range of 0.0068 inch to 0.0147 inch; a mean tensile strength in the range of 15.6 to 23.1 ksi; a mean modulus of 406 to 465 ksi; and a mean elongation in the range of 14 to 103%.

    摘要翻译: 具有纺织物理特性的聚酰亚胺纤维及其从聚酰亚胺粉末熔融挤出的方法。 作为单体3,4'-ODA和ODPA的反应产物形成并与邻苯二甲酸酐封端以控制其分子量的聚酰亚胺粉末在340℃至360℃的温度范围内熔融挤出, 高度为100.5英寸,209英寸和364.5英寸。 所获得的纤维的直径范围为0.0068英寸至0.0147英寸; 平均拉伸强度在15.6至23.1ksi的范围内; 平均模数为406〜465ksi; 平均伸长率在14〜103%的范围内。

    Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers
    3.
    发明授权
    Liquid crystalline thermosets from ester, ester-imide, and ester-amide oligomers 有权
    来自酯,酯 - 酰亚胺和酯 - 酰胺低聚物的液晶热固性材料

    公开(公告)号:US07507784B2

    公开(公告)日:2009-03-24

    申请号:US11124508

    申请日:2005-04-29

    摘要: Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase. They are highly processable by a variety of melt process shape forming and blending techniques. Once processed and shaped, the end-capped liquid crystal oligomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures.

    摘要翻译: 主链热致液晶酯,酯 - 酰亚胺和酯 - 酰胺由AA,BB和AB型单体材料制备,并用苯乙炔,苯基马来酰亚胺或纳二酰胺反应性端基封端。 封端的液晶低聚物是热致变性的,并且优选分子量在约1000-15,000克/摩尔的范围内。 封端的液晶低聚物具有宽的液晶熔融范围,并且在可接近的温度下表现出高的熔体稳定性和非常低的熔体粘度。 封端的液晶低聚物在熔融相中稳定长达一个小时。 它们通过各种熔体加工形状和混合技术可高度加工。 一旦加工和成形,加热封端的液晶低聚物进一步聚合并形成液晶热固性塑料(LCT)。 完全固化的产品是高于其玻璃化转变温度的橡胶。

    Crosslinked polyimides prepared from N-(3-ethynylphenyl)maleimide
    4.
    发明授权
    Crosslinked polyimides prepared from N-(3-ethynylphenyl)maleimide 失效
    由N-(3-乙炔基苯基)马来酰亚胺制备的交联聚酰亚胺

    公开(公告)号:US5189127A

    公开(公告)日:1993-02-23

    申请号:US801867

    申请日:1991-12-03

    摘要: The compound N-(3-ethynylphenyl)maleimide (NEPMI) was used to prepare thermally stable, glassy polyimides which did not exhibit glass transition temperatures below 500.degree. C. NEPMI was blended with the maleimide of methylene dianiline (BMI) and heated to form the polyimide. NEPMI was also mixed with Thermid 600.RTM., a commercially available bisethynyl oligomeric material, and heated to form a thermally stable, glassy polyimide. Lastly, NEPMI was blended with both BMI and Thermid 600.RTM. to form thermally stable, glassy polyimides.

    摘要翻译: 使用化合物N-(3-乙炔基苯基)马来酰亚胺(NEPMI)制备热稳定的玻璃化聚酰亚胺,其不显示低于500℃的玻璃化转变温度。将NEPMI与亚甲基二苯胺(BMI)的马来酰亚胺共混并加热形成 聚酰亚胺。 NEPMI也与市售的双乙炔基低聚物材料Thermid 600 TM混合,并加热形成热稳定的玻璃状聚酰亚胺。 最后,NEPMI与BMI和Thermid 600 TM混合以形成热稳定的玻璃状聚酰亚胺。

    Polyimide molding powder, coating, adhesive and matrix resin
    5.
    发明授权
    Polyimide molding powder, coating, adhesive and matrix resin 失效
    聚酰亚胺成型粉末,涂料,粘合剂和基体树脂

    公开(公告)号:US5147966A

    公开(公告)日:1992-09-15

    申请号:US560717

    申请日:1990-07-31

    IPC分类号: C08G73/10

    摘要: The invention is a novel polyimide prepared from 3,4'-oxydianiline (3,4'-ODA) and 4,4'-oxydiphthalic anhydride (ODPA), in 2-methoxyethyl ether (diglyme). The polymer has been prepared in ultra high molecular weight and in a controlled molecular weight form which has a 2.5 percent offset is stoichiometry (excess diamine) with a 5.0 percent level of phthalic anhydride as an endcap. This controlled molecular weight form allows for greatly improved processing of the polymer for moldings, adhesive bonding, and composite fabrication. The higher molecular weight version affords tougher films and coatings. The overall polymer structure groups in the dianhydride, the diamine, and a metal linkage in the diamine affords adequate flow properties for making this polymer useful as a molding powder, adhesive, and matrix resin.

    摘要翻译: 本发明是由3,4-氧代二苯胺(3,4'-ODA)和4,4'-氧联二邻苯二甲酸酐(ODPA)在2-甲氧基乙醚(二甘醇二甲醚)中制备的新型聚酰亚胺。 聚合物已经以超高分子量和受控的分子量形式制备,其具有2.5%的偏移量是化学计量(过量二胺),5.0%邻苯二甲酸酐作为端帽。 这种受控的分子量形式允许用于模制品,粘合剂粘合和复合材料制造的聚合物的大大改进的处理。 更高的分子量版本提供更坚韧的膜和涂层。 在二酐中的整体聚合物结构基团,二胺和二胺中的金属键提供了足够的流动性能,用于使该聚合物用作成型粉末,粘合剂和基质树脂。

    Aromatic polyimides containing a dimethylsilane-linked dianhydride
    6.
    发明授权
    Aromatic polyimides containing a dimethylsilane-linked dianhydride 失效
    含有二甲基硅烷的二酐的芳族聚酰亚胺

    公开(公告)号:US5093453A

    公开(公告)日:1992-03-03

    申请号:US449210

    申请日:1989-12-12

    IPC分类号: C08G73/10

    CPC分类号: C08G73/106

    摘要: A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

    摘要翻译: 通过化学组合等摩尔量的芳族二酐反应物和芳族二胺反应物来制备高温稳定的光学透明低介电芳族聚酰亚胺,其选择为使得一种反应物在其中含有至少一个Si(CH 3)2基团 分子结构,另一反应物在其分子结构中含有至少一个-CH 3基团。 将反应物在溶剂介质中化学组合以形成高分子量聚酰胺酸的溶液,然后将其转化为相应的聚酰亚胺。

    Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups
    9.
    发明授权
    Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups 失效
    含有N-炔丙基的热固性热塑性芳族聚酰胺

    公开(公告)号:US4431792A

    公开(公告)日:1984-02-14

    申请号:US447371

    申请日:1982-12-07

    IPC分类号: C08G69/28 C08G69/32

    CPC分类号: C08G69/28

    摘要: The compounds are of the class of aromatic polyamides useful as matrix resins in the manufacture of composites or laminate fabrication. The process for preparing this thermoplastic-thermoset polyamide system involves incorporating a latent crosslinking moiety along the backbone of the polyamide to improve the temperature range of fabrication thereof wherein the resin softens at a relatively low temperature (.congruent.154.degree. C.) and subsequently "sets-up" or undergoes crosslinking when subjected to higher temperature (.congruent.280.degree. C.).

    摘要翻译: 这些化合物是在复合材料或层压制造的制造中用作基质树脂的芳族聚酰胺类。 制备该热塑性热固性聚酰胺体系的方法包括在聚酰胺的主链上引入潜在交联部分以改善其制造的温度范围,其中树脂在相对较低的温度(约154℃)下软化,然后“ -up“或经受更高温度(280℃)时的交联。