公开(公告)号：US20240262963A1

公开(公告)日：2024-08-08

申请号：US18411220

申请日：2024-01-12

Applicant: NexFlex Co., Ltd.

Inventor： So Jeong KIM ,  Joo Young KIM ,  Hyuk Jun KIM

IPC: C08G73/10 ,  C08J5/18

CPC classification number: C08G73/1053 ,  C08G73/1032 ,  C08J5/18 ,  C08J2379/08

Abstract: A polyimide composition, a method of preparing the polyimide composition, a polyimide film, and a flexible copper clad laminate are provided. The polyimide composition includes a dianhydride, and a diamine, and the diamine comprises an aromatic diamine, and an aliphatic diamine.

公开(公告)号：US11834561B2

公开(公告)日：2023-12-05

申请号：US18193224

申请日：2023-03-30

Applicant: DUPONT ELECTRONICS, INC.

Inventor： Ming-Siao Hsiao

IPC: C08J5/18 ,  C08G73/10 ,  H01L27/12 ,  H05K1/03

CPC classification number: C08J5/18 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  C08J2379/08 ,  H01L27/1218 ,  H05K1/0346 ,  H05K2201/0154

Abstract: A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

公开(公告)号：US20230235139A1

公开(公告)日：2023-07-27

申请号：US18193224

申请日：2023-03-30

Applicant: DUPONT ELECTRONICS, INC.

Inventor： MING-SIAO HSIAO

IPC: C08J5/18 ,  C08G73/10

CPC classification number: C08J5/18 ,  C08G73/1071 ,  C08G73/1053 ,  C08G73/1042 ,  H05K2201/0154 ,  C08J2379/08 ,  H01L27/1218

Abstract: A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.

公开(公告)号：US20190048142A1

公开(公告)日：2019-02-14

申请号：US16078672

申请日：2017-02-28

Applicant: SABIC Global Technologies B.V.

Inventor： Javier Nieves Remacha ,  Juan Justino Rodriguez Ordonez ,  Bernabe Quevedo Sanchez

IPC: C08G73/10 ,  C08J3/28 ,  C08J3/11

CPC classification number: C08G73/1053 ,  C08G73/10 ,  C08G73/1046 ,  C08J3/11 ,  C08J3/28 ,  C08J2379/08 ,  C08L79/08

Abstract: A method for reducing yellowness of a polyetherimide solution, including exposing a first solution including a solvent and a polyetherimide to light under conditions effective to provide a second solution having a yellowness index that is 1 to 100 units less than the yellowness index of the first solution, as determined according to ASTM D1925. Another aspect is a method for reducing yellowness of a polyetherimide solution including acidifying a first solution including a solvent and a polyetherimide to provide a second solution having a pH less than 5 under conditions effective for the second solution to attain a yellowness index that is 1 to 30 units less than the yellowness index of the first solution, as determined according to ASTM D1925. Polyetherimides prepared according to the method, and compositions and articles including the polyetherimide are also described.

公开(公告)号：US20180265655A1

公开(公告)日：2018-09-20

申请号：US15544483

申请日：2015-10-01

Applicant: Mark SANNER ,  Neal PFEIFFENBERGER ,  Matthew F. NIEMEYER ,  SABIC GLOBAL TECHNOLOGIES, B.V.

Inventor： Mark SANNER ,  Neal PFEIFFENBERGER ,  Matthew F. NIEMEYER

IPC: C08J5/18 ,  H01G4/18 ,  H01G4/008

CPC classification number: C08J5/18 ,  B32B7/00 ,  B32B7/12 ,  B32B15/00 ,  B32B15/04 ,  B32B15/08 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/28 ,  B32B27/281 ,  B32B27/36 ,  B32B2307/20 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/516 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2457/16 ,  C08G73/1017 ,  C08G73/1053 ,  C08G73/1064 ,  C08G73/1071 ,  C08J2367/02 ,  C08J2379/08 ,  C08J2467/02 ,  C08J2479/08 ,  C08L79/08 ,  H01G4/008 ,  H01G4/18 ,  C08L67/02

Abstract: A uniaxially-stretched, high yield extruded capacitor film comprising a miscible polymer blend comprising a polyetherimide and a polyester, wherein the polyetherimide comprises units derived from polymerization of an aromatic dianhydride with a diamine comprising a m-phenylenediamine, a p-phenylenediamine, or combinations thereof, wherein the polyetherimide is endcapped with a substituted or unsubstituted aromatic primary monoamine, wherein the polyester comprises repeating structural units derived from polymerization of an aromatic dicarboxylic acid with a dihydroxy compound, and wherein the high yield extruded capacitor film comprises equal to or greater than about 90 wt. % of the miscible polymer blend entering an extruder used for manufacturing the capacitor film, based on the total weight of miscible polymer blend prior to entering the extruder.

公开(公告)号：US09896546B2

公开(公告)日：2018-02-20

申请号：US14373218

申请日：2013-01-18

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Koichiro Shimoda ,  Yasuhito Iizuka ,  Masaki Yamamoto ,  Yoro Sasaki ,  Hiroaki Adachi ,  Shuji Kashiwagi

IPC: C08G73/10 ,  C08K5/353 ,  C08L79/08 ,  B32B27/28 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: C08G73/1075 ,  B32B27/281 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1071 ,  C08K5/353 ,  C08L79/08 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/427 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/051 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

公开(公告)号：US20180044484A1

公开(公告)日：2018-02-15

申请号：US15552060

申请日：2016-02-19

Applicant: SABIC Global Technologies B.V.

Inventor： Viswanathan Kalyanaraman

IPC: C08J3/14

CPC classification number: C08J3/14 ,  C08G73/10 ,  C08G73/1053 ,  C08G73/106 ,  C08J2369/00 ,  C08J2379/08

Abstract: A method for making spherical polymer particles, the method including: providing a polymer solution including a polymer in an amount of less than 10% by weight, based on the total weight of the polymer solution, and an organic solvent; combining the polymer solution, deionized water, and a first surfactant to provide an emulsification composition having an organic solvent fraction of 0.60 or higher by volume; forming an emulsion from the emulsification composition; and adding the emulsion into receiving water maintained at a temperature above the boiling point of the organic solvent for a period sufficient to evaporate the organic solvent, wherein the adding and the evaporating are at a rate effective to form an aqueous slurry comprising spherical polymer particles having a Dv100 (volume-based diameter) of 10 micrometers or less, as measured by laser diffraction.

公开(公告)号：US09850401B2

公开(公告)日：2017-12-26

申请号：US14561070

申请日：2014-12-04

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Chung-Ting Lai ,  Chih-Wei Lin

IPC: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/28 ,  B32B27/32 ,  H05K1/03 ,  H05K3/38 ,  C08G73/10 ,  B32B38/00 ,  H05K3/02

CPC classification number: C09D179/08 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/322 ,  B32B2038/0016 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2457/08 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1071 ,  H05K1/036 ,  H05K3/022 ,  H05K3/381 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  Y10T428/2495 ,  Y10T428/254 ,  Y10T428/259 ,  Y10T428/31544 ,  C08L27/18 ,  C08L83/04 ,  C08K3/36

Abstract: A multilayered polyimide film includes a first polyimide layer containing fluorine-containing polymer particles and having a first surface and a second surface, and a second polyimide layer and a third polyimide layer respectively disposed on the first surface and the second surface. The second and the third polyimide layers contain organic silicon oxygen compound particles. The multilayered polyimide film has a coefficient of thermal expansion (CTE) between about 13 and about 30 ppm/° C.

公开(公告)号：US09850347B2

公开(公告)日：2017-12-26

申请号：US14417083

申请日：2013-07-30

Applicant: TORAY INDUSTRIES, INC.

Inventor： Daichi Miyazaki ,  Masao Tomikawa

IPC: C08G69/32 ,  C08G73/10 ,  C03C17/32 ,  C08J5/18 ,  C09D179/08

CPC classification number: C08G69/32 ,  C03C17/32 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C09D179/08 ,  Y10T428/31623

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

公开(公告)号：US20170355832A1

公开(公告)日：2017-12-14

申请号：US15529175

申请日：2015-11-24

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Paul Dean Sybert ,  Yogesh Omprakash Sharma

IPC: C08K5/3432 ,  C08G63/695 ,  B32B27/06

CPC classification number: C08K5/3432 ,  B32B27/06 ,  B32B2309/105 ,  C08G63/6956 ,  C08G73/1053 ,  C08G77/448 ,  C08K5/3437 ,  C08K5/3475 ,  C08K5/523 ,  C08L79/08 ,  C08L83/10

Abstract: A thermoplastic composition including a polycarbonatesiloxane-arylate; a phthalone compound; and optionally an additional component different from the polycarbonatesiloxane-arylate and the phthalone compound; wherein the phthalone compound has a formula: wherein Z1 represents the atoms necessary to complete a 9- to 13-membered single or fused aromatic ring structure, Z2 represents the atoms necessary to complete a pyridine or quinoline ring, each R1 and each R2 are independently halogen, an alkyl group, an aryl group, a heterocyclic group, an alkoxy group, an aryloxy group, an aromatic or aliphatic thioether group, an aromatic or aliphatic carboxylic acid ester group, or an aromatic or aliphatic amide group, a is an integer from 0 to 6, b is an integer from 0 to 4, n is 1 or 2, and X is present only if n=2 and is a single bond or a divalent organic radical bonded to the Z1 ring structure through an ether, ketone, or thio linkage.