公开(公告)号：US20200273775A1

公开(公告)日：2020-08-27

申请号：US16287653

申请日：2019-02-27

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Mitul Modi ,  Edvin Cetegen ,  Aastha Uppal

IPC: H01L23/46 ,  H01L23/427 ,  H01L21/48 ,  F28D15/02

Abstract: Package assemblies with a molded substrate comprising fluid conduits. The fluid conduits may be operable for conveying a fluid (e.g., liquid and/or vapor) through some portion of the package substrate structure. The fluid conveyance may improve thermal management of the package assembly, for example removing heat dissipated by one or more integrated circuits (ICs) of the package assembly.

公开(公告)号：US10192810B2

公开(公告)日：2019-01-29

申请号：US13930082

申请日：2013-06-28

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  Nitin A. Deshpande ,  Rajendra C. Dias ,  Edvin Cetegen ,  Lars D. Skoglund

IPC: H01L23/22 ,  H01L23/24 ,  H01L23/485 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: Underfill material flow control for reduced die-to-die spacing in semiconductor packages and the resulting semiconductor packages are described. In an example, a semiconductor apparatus includes first and second semiconductor dies, each having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a common semiconductor package substrate by a plurality of conductive contacts, the first and second semiconductor dies separated by a spacing. A barrier structure is disposed between the first semiconductor die and the common semiconductor package substrate and at least partially underneath the first semiconductor die. An underfill material layer is in contact with the second semiconductor die and with the barrier structure, but not in contact with the first semiconductor die.