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公开(公告)号:US20120229985A1
公开(公告)日:2012-09-13
申请号:US13479032
申请日:2012-05-23
申请人: Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人: Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号: H05K7/20
CPC分类号: H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译: 半导体器件包括:第一输出单元,被配置为输出第一相位; 第二输出单元,被配置为输出与所述第一相不同的第二相,所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器,被配置为控制所述输出单元。
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公开(公告)号:US08208260B2
公开(公告)日:2012-06-26
申请号:US12954451
申请日:2010-11-24
申请人: Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人: Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号: H05K7/20
CPC分类号: H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译: 半导体器件包括:第一输出单元,被配置为输出第一相位; 第二输出单元,被配置为输出与所述第一相不同的第二相,所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器,被配置为控制所述输出单元。
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公开(公告)号:US20100265664A1
公开(公告)日:2010-10-21
申请号:US12826334
申请日:2010-06-29
申请人: Keiji Okumura , Takukazu Otsuka , Masao Saito
发明人: Keiji Okumura , Takukazu Otsuka , Masao Saito
IPC分类号: H05K7/20
CPC分类号: H02M7/003 , H01L25/162 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2924/01019 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H05K1/14 , H05K7/02 , H05K7/20509 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
摘要翻译: 半导体器件包括:第一输出单元,被配置为输出第一相位; 第二输出单元,被配置为输出与所述第一相不同的第二相,所述第二输出单元被布置为堆叠在所述第一输出单元上; 以及控制器,被配置为控制所述输出单元。
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公开(公告)号:US07732917B2
公开(公告)日:2010-06-08
申请号:US12243098
申请日:2008-10-01
申请人: Masao Saito , Takukazu Otsuka , Keiji Okumura
发明人: Masao Saito , Takukazu Otsuka , Keiji Okumura
IPC分类号: H01L21/34
CPC分类号: H01L25/18 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要: A power module includes a substrate having first and second main substrate surfaces; a semiconductor device disposed on the first main substrate surface, and having a first main surface on which a first main electrode is formed, and a second main surface on which a second main electrode in contact with the first main substrate surface is formed; a heat conduction portion disposed on the first main substrate surface in a residual region of a region on which the semiconductor device is disposed; and an upper cooling portion disposed on the heat conduction portion.
摘要翻译: 功率模块包括具有第一和第二主衬底表面的衬底; 半导体器件,其设置在所述第一主衬底表面上,并且具有形成有第一主电极的第一主表面和形成有与所述第一主衬底表面接触的第二主电极的第二主表面; 在设置有半导体器件的区域的残留区域中的第一主衬底表面上设置的热传导部分; 以及设置在导热部上的上部冷却部。
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45.
公开(公告)号:US20100059929A1
公开(公告)日:2010-03-11
申请号:US12551726
申请日:2009-09-01
申请人: Keiji Okumura
发明人: Keiji Okumura
CPC分类号: B65H3/0607 , B65H1/14 , B65H3/48 , B65H3/60 , B65H2301/5143 , B65H2406/12 , B65H2511/20 , B65H2515/40 , B65H2515/805 , B65H2801/06 , B65H2220/02 , B65H2220/11 , B65H2220/01
摘要: A sheet feeding device has: a sheet accommodating portion that accommodates a sheet stack of a plurality of sheets; a sheet carrying plate that is provided within the sheet accommodating portion and stacks the sheet stack thereon; a pickup roller that contacts an upper face of the sheet stack and dispatches a sheet on an uppermost layer of the sheet stack, an elevator mechanism that displaces the sheet carrying plate between a sheet feeding position in which the upper face of the sheet stack contacts the pickup roller, and a separating position in which the upper face of the sheet stack separates from the pickup roller by a predetermined distance; and a controller that controls an operation of the elevator mechanism such that the sheet carrying plate is lowered to the separating position after a sheet feeding operation for feeding a sheet at the sheet feeding position is completed.
摘要翻译: 片材进给装置具有:容纳多张片材的片材叠片的片材容纳部; 片材承载板,其设置在所述片材容纳部内并且堆叠所述片材堆叠; 拾取辊,其接触片材堆叠的上表面并且在片材堆叠的最上层上分配片材;升降机构,其将片材承载板移动到片材进给位置,在片材进给位置,片材堆叠的上表面接触片材 拾取辊和分离位置,其中纸叠的上表面与拾取辊分离预定距离; 以及控制器,用于控制电梯机构的操作,使得在用于在片材进给位置馈送片材的供纸操作完成之后,片材承载板下降到分离位置。
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