公开(公告)号：US20180122747A1

公开(公告)日：2018-05-03

申请号：US15794128

申请日：2017-10-26

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Sheng-Mou Lin ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/66 ,  H01L23/522 ,  H01L49/02 ,  H01L23/495

CPC classification number: H01L23/552 ,  H01L23/4951 ,  H01L23/5227 ,  H01L23/645 ,  H01L23/66 ,  H01L25/16 ,  H01L28/10 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a substrate, a semiconductor die, a base and a first inductor structure. The substrate has a die-attach surface and a solder-ball-attach surface opposite to the die-attach surface. The semiconductor die is mounted on the die-attach surface of the substrate. The semiconductor die includes a radio-frequency (RF) circuit and a first RF die pad electrically connected to the RF circuit. The base is mounted on the solder-ball-attach surface of the substrate. The first inductor structure is positioned on the substrate, the semiconductor die or the base. The first inductor structure includes a first terminal electrically connected to the first die pad and a second terminal electrically connected to a ground terminal.