摘要:
A head support mechanism includes a rigid support arm, a suspension for supporting, at its leading end section, a head slider with at least one head element, the suspension having a balance structure that can be pivoted in a direction crossing a surface of a recording medium using as a fulcrum a load support point established between the suspension and the support arm, a load generation unit for generating a load applied to the load support point for pressing the head slider toward the surface of the recording medium, a horizontal rotation bearing unit for pivotally bearing the support arm and the suspension so that the support arm and the suspension are capable of rotatively moving in a direction parallel to the surface of the recording medium, and an weight unit coupled to a trailing end section of the suspension to match the center of gravity of the suspension including the head slider with the load support point. The weight unit is formed around at least a part of the periphery of the horizontal rotation-bearing unit.
摘要:
A head arm assembly (HAA) includes a head slider having at least one head element, an arm member for supporting the head slider at one end section, an actuator, mounted to the other end section of the arm member, for rotationally moving the arm member in a direction substantially parallel with a recording medium surface around an axis for horizontal rotation of the arm member, and a load generation unit for generating a load for energizing the head slider in a direction to the recording medium surface by rotationally moving the arm member in a direction substantially orthogonal to the recording medium surface around an axis for vertical rotation. The position of the center of gravity of the HAA is located at a different position from the axis for vertical rotation on a center axis of the arm member.
摘要:
In a solar cell including a photoelectric conversion layer 14 disposed on a flexible substrate 11 and constituted by a laminated layer of non-single crystalline silicon thin films, the flexible substrate 11 has a coefficient of linear thermal expansion of is 2.0 ppm to 10.0 ppm. By this, the coefficient of linear thermal expansion of the flexible substrate 11 and that of the photoelectric conversion layer 14 become close to each other, so that warp and deformation during manufacturing steps and after the steps are decreased. Further, since stress applied to the photoelectric conversion layer 14 is also lessened, the photoelectric conversion efficiency can be increased.