Abstract:
Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.
Abstract:
An optoelectronic component includes a first electrically conductive contact layer, an electrically insulating layer above the first electrically conductive contact layer, a second electrically conductive contact layer above the electrically insulating layer, a first electrically conductive electrode layer above the second electrically conductive contact layer, at least one optically functional layer structure above the first electrically conductive electrode layer, and a second electrically conductive electrode layer above the optically functional layer structure, wherein the second electrically conductive contact layer has a first cutout, the electrically insulating layer has a second cutout, which overlaps the first cutout, an electrically conductive plated-through hole is arranged in the first cutout and in the second cutout, said electrically conductive plated-through hole being led to the first electrically conductive contact layer, and the electrically conductive plated-through hole is electrically insulated with respect to the second electrically conductive contact layer.
Abstract:
Various embodiments may relate to a method for producing an organic optoelectronic component, including forming a first layer on or over a substrate, the substrate including at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad, forming a second layer on or over the first layer, and removing at least the second layer in at least one region of the substrate with the first layer and the contact pad. The adhesion of the substance or of the substance mixture of the first layer on the interface with the substrate is less than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate.
Abstract:
A method for producing an optoelectronic arrangement and an optoelectronic arrangement. In an embodiment the method includes providing a connection carrier having a contact surface and two connection points, which are electrically conductively connected with the contact surface, providing an optoelectronic device having a connection surface, introducing an electrically conductive bonding material between the contact surface of the connection carrier and the connection surface of the optoelectronic device and heating the contact surface of the connection carrier by energizing the contact surface via the two connection points, wherein the electrically conductive bonding material is heated by the contact surface such that the bonding material melts or hardens.
Abstract:
An organic optoelectronic component includes a substrate embodied in a light-transmissive fashion, an organic light-emitting element having an organic light-emitting layer between two electrodes, and an organic light-detecting element having an organic light-detecting layer. The organic light-emitting element and the organic light-detecting element are arranged on the substrate. Part of the light generated by the organic light-emitting element during operation enters into the substrate, emerges from the substrate and is detected by the organic light-detecting element.
Abstract:
An organic optoelectronic component includes a substrate, an organic light-emitting element which has an organic light-emitting layer between two electrodes, and an organic radiation-detecting element which has an organic radiation-detecting layer. The organic light-emitting element and the organic radiation-detecting element are arranged on the substrate. The organic light-emitting element is designed to emit visible light during operation and the organic radiation-detecting element is designed to detect infrared radiation during operation.