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公开(公告)号：US10145545B2
公开(公告)日：2018-12-04
申请号：US14431782
申请日：2013-09-24
Applicant: OSRAM OLED GmbH
Inventor： Joerg Farrnbacher , Stefan Gschloessl , Christoph Gaerditz , Christian Kristukat
IPC: F21V19/00 , F21V23/00 , F21V23/06 , F21Y105/00 , F21Y115/15 , F21Y115/10
Abstract: A light-emitting element includes at least one flat light emitter having a first electrical contact portion formed on a side surface, and a housing partially surrounding the side surface of the flat light emitter, the housing including a second electrical contact portion formed on an inner surface of the housing and configured to mate with the first electrical contact portion.
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公开(公告)号：US09806243B2
公开(公告)日：2017-10-31
申请号：US15029696
申请日：2014-10-16
Applicant: OSRAM OLED GmbH
Inventor： Joerg Farrnbacher , Simon Schicktanz
CPC classification number: H01L33/62 , H01L24/01 , H01L33/56 , H01L2251/5361 , H01L2924/12041 , H01L2924/12044 , H01L2933/0066 , H01L2924/00
Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.
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公开(公告)号：US20150354801A1
公开(公告)日：2015-12-10
申请号：US14763173
申请日：2013-12-23
Applicant: OSRAM OLED GMBH
Inventor： Joerg Farrnbacher , Stefan Gschloessl , Kilian Regau , Karsten Diekmann , Christian Kristukat
CPC classification number: F21V23/06 , F21V19/0015 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15
Abstract: An illuminant may include at least one light-emitting element unit, which has a carrier, at least one light-emitting element arranged on the carrier and is surrounded by an encapsulating material, at least one contact area formed on the carrier, and at least one contact element arranged on the contact area, wherein the light-emitting element surrounded by the encapsulating material is electrically connected to the contact element via the contact area, and at least one mating contact element, wherein electrical contact can be made between the mating contact element and the contact element via a plug-type connection, wherein the contact element is a female connector element, and the mating contact element is a male connector element and having a plurality of pin contact elements, or the contact element is a male connector element and having a plurality of pin contact elements, and the mating contact element is a female connector element.
Abstract translation: 光源可以包括至少一个发光元件单元，其具有载体，布置在载体上的至少一个发光元件并被封装材料包围，形成在载体上的至少一个接触区域，并且至少 布置在所述接触区域上的一个接触元件，其中由所述封装材料包围的所述发光元件经由所述接触区域电连接到所述接触元件，以及至少一个配合接触元件，其中可以在所述配合接触件 元件和接触元件，其中接触元件是阴连接器元件，并且配合接触元件是阳连接器元件并且具有多个销接触元件，或者接触元件是阳连接器元件 并且具有多个销接触元件，并且所述配合接触元件是阴连接器元件。
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4.发明申请公开(公告)号：US20160233398A1
公开(公告)日：2016-08-11
申请号：US15029696
申请日：2014-10-16
Applicant: OSRAM OLED GMBH
Inventor： Joerg Farrnbacher , Simon Schicktanz
CPC classification number: H01L33/62 , H01L24/01 , H01L33/56 , H01L2251/5361 , H01L2924/12041 , H01L2924/12044 , H01L2933/0066 , H01L2924/00
Abstract: In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.
Abstract translation: 在各种实施例中，提供了光电子部件。 光电子部件包括载体主体。 光电子层结构形成在载体主体上方，并具有至少一个用于电接触光电子层结构的接触区域。 覆盖体设置在光电子层结构的上方。 至少一个触点切口，其中接触区域的至少一部分被暴露延伸穿过载体主体和/或覆盖体。 用于电接触光电子部件的至少一个插塞元件至少部分地布置在触点切口中并且紧密地闭合触头切口。 接触介质，其中插塞元件电耦合到接触区域，布置在接触切口中。
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公开(公告)号：US20160118622A1
公开(公告)日：2016-04-28
申请号：US14979624
申请日：2015-12-28
Applicant: OSRAM OLED GmbH
Inventor： Benjamin Krummacher , Joerg Farrnbacher , Simon Schicktanz , Kilian Regau
CPC classification number: H01L51/5253 , H01L51/441 , H01L51/448 , H01L51/5203 , H01L51/5206 , H01L51/5221 , H01L51/524 , H01L51/56 , H01L2251/5361 , H01L2251/558
Abstract: Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.
Abstract translation: 各种实施例可以涉及光电子部件，包括形成用于吸收和/或提供电磁辐射的光学有源区域，至少一个第一接触结构，其中光学有源区域电导耦合到第一接触结构，以及 具有第二接触结构的封装结构，其中所述封装结构形成在所述光学有源区域和所述第一接触结构上或上方，以及形成用于将所述第一接触结构导电连接到所述第二接触结构的导电结构，其中所述封装 结构至少部分地由电绝缘模塑料形成，其中电绝缘模塑料至少部分地围绕导电结构。
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Patent Agency Ranking
公开(公告)号：US10531536B2
公开(公告)日：2020-01-07
申请号：US15748666
申请日：2016-07-28
Applicant: OSRAM OLED GmbH
Inventor： Kilian Regau , Joerg Farrnbacher , Benjamin Hoeflinger , Thorsten Vehoff , Tobias Pohl-Zander
Abstract: An optoelectronic assembly and method for operating an optoelectronic assembly are provided. In some aspects, the optoelectronic assembly includes an organic light-emitting component, a temperature sensor configured to record a temperature value, and a driver circuit coupled to the organic light-emitting component and the temperature sensor. The driver circuit is configured to apply an AC voltage to the organic light-emitting component when the organic light-emitting component is switched on, and if the recorded temperature value is less than a predetermined temperature threshold value, where the AC voltage is, at least, temporarily less than an instantaneous threshold voltage of the organic light-emitting component. The driver circuit is also configured to apply a DC voltage to the organic light-emitting component if a measurement value is greater than or equal to a predetermined threshold value, where the DC voltage is greater than the instantaneous threshold voltage of the organic light-emitting component.
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7.发明授权Optoelectronic component, contact-making device, and optoelectronic subassembly 有权光电子部件，接触制造装置和光电子组件公开(公告)号：US09583740B2
公开(公告)日：2017-02-28
申请号：US15029678
申请日：2014-10-16
Applicant: OSRAM OLED GmbH
Inventor： Joerg Farrnbacher , Simon Schicktanz
CPC classification number: H01L51/56 , H01L24/72 , H01L51/5203 , H01L51/524 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L2224/32225 , H01L2251/5361 , H01L2924/12041 , H01L2924/12043 , H01L2924/12044 , H01L2924/00
Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.
Abstract translation: 光电子部件包括载体主体，形成在载体主体上方的光电子层结构，并具有用于接触光电子层结构的至少一个接触区域，布置在光电子层结构上方的覆盖体，延伸穿过覆盖层的至少一个触点切口 身体和/或载体体。 接触切口具有第一和第二切口区域，该第一切口区域和第二切口区域彼此引导，并且在形成接触区域的层平面方向上从覆盖体和/或载体主体的外表面延伸。 在第一切除区域中相应的外表面附近的接触切口的第一透明宽度大于相应外表面附近的第二切口区域中的第二透明宽度。 第二透明宽度小于接触区域附近的第二切除区域的第三透明宽度。
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8.发明申请OPTOELECTRONIC COMPONENT, CONTACT-MAKING DEVICE, AND OPTOELECTRONIC SUBASSEMBLY 有权光电组件，接触制造装置和光电子分层公开(公告)号：US20160276630A1
公开(公告)日：2016-09-22
申请号：US15029678
申请日：2014-10-16
Applicant: OSRAM OLED GMBH
Inventor： Joerg Farrnbacher , Simon Schicktanz
CPC classification number: H01L51/56 , H01L24/72 , H01L51/5203 , H01L51/524 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L2224/32225 , H01L2251/5361 , H01L2924/12041 , H01L2924/12043 , H01L2924/12044 , H01L2924/00
Abstract: An optoelectronic component include a carrier body, an optoelectronic layer structure formed above the carrier body and having at least one contact region for contacting the optoelectronic layer structure, a covering body arranged above the optoelectronic layer structure, at least one contact cutout extending through the covering body and/or the carrier body. The contact cutout has a first and a second cutout regions, which lead into one another and which extend from an outer surface of the covering body and/or of the carrier body in a layer plane direction where the contact region is formed. A first clear width of the contact cutout near the corresponding outer surface in the first cutout region is greater than a second clear width in the second cutout region near the corresponding outer surface. The second clear width is less than a third clear width of the second cutout region near the contact region.
Abstract translation: 光电子部件包括载体主体，形成在载体主体上方的光电子层结构，并具有用于接触光电子层结构的至少一个接触区域，布置在光电子层结构上方的覆盖体，延伸穿过覆盖层的至少一个触点切口 身体和/或载体体。 接触切口具有第一和第二切口区域，该第一切口区域和第二切口区域彼此引导，并且在形成接触区域的层平面方向上从覆盖体和/或载体主体的外表面延伸。 在第一切除区域中相应的外表面附近的接触切口的第一透明宽度大于相应外表面附近的第二切口区域中的第二透明宽度。 第二透明宽度小于接触区域附近的第二切除区域的第三透明宽度。
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公开(公告)号：US20180220509A1
公开(公告)日：2018-08-02
申请号：US15748666
申请日：2016-07-28
Applicant: OSRAM OLED GmbH
Inventor： Kilian Regau , Joerg Farrnbacher , Benjamin Hoeflinger , Thorsten Vehoff , Tobias Pohl-Zander
Abstract: An optoelectronic assembly and method for operating an optoelectronic assembly are provided herein. The optoelectronic assembly may include an organic light-emitting component, a temperature sensor for recording a temperature value, and a controller coupled to the organic light-emitting component and to the temperature sensor. The controller may be configured to apply an alternating current (AC) voltage to the organic light-emitting component when the organic light-emitting component is switched on, and if the recorded temperature value is less than a predetermined temperature threshold value, where the AC voltage may, at least, temporarily less than an instantaneous threshold voltage of the organic light-emitting component. The controller may also be configured to apply a direct current (DC) voltage to the organic light-emitting component if a measurement value is greater than or equal to a predetermined threshold value, where the DC voltage is greater than the instantaneous threshold voltage of the organic light-emitting component.
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公开(公告)号：US09945547B2
公开(公告)日：2018-04-17
申请号：US14763173
申请日：2013-12-23
Applicant: OSRAM OLED GmbH
Inventor： Joerg Farrnbacher , Stefan Gschloessl , Kilian Regau , Karsten Diekmann , Christian Kristukat
IPC: F21S4/00 , F21V23/06 , F21V19/00 , F21Y105/00 , F21Y105/10 , F21Y115/10 , F21Y115/15
CPC classification number: F21V23/06 , F21V19/0015 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15
Abstract: An illuminant may include at least one light-emitting element unit, which has a carrier, at least one light-emitting element arranged on the carrier and is surrounded by an encapsulating material, at least one contact area formed on the carrier, and at least one contact element arranged on the contact area, wherein the light-emitting element surrounded by the encapsulating material is electrically connected to the contact element via the contact area, and at least one mating contact element, wherein electrical contact can be made between the mating contact element and the contact element via a plug-type connection, wherein the contact element is a female connector element, and the mating contact element is a male connector element and having a plurality of pin contact elements, or the contact element is a male connector element and having a plurality of pin contact elements, and the mating contact element is a female connector element.
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