公开(公告)号：US20220199316A1

公开(公告)日：2022-06-23

申请号：US17209458

申请日：2021-03-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Hui Li ,  Byung Soo Kang ,  Ju Hwan Yang ,  Seung Min Lee ,  Yoon Mi Cha ,  Boum Seock Kim ,  Byeong Cheol Moon

IPC: H01F27/29 ,  H01F17/00 ,  H01F27/32

Abstract: A coil component is disposed. The coil component according to an aspect of the present disclosure includes: a body; a coil portion disposed in the body; an external electrode portion including a first metal layer disposed on the body, and connected to the coil portion; and a surface insulating layer disposed on the body to cover a first region of the first metal layer and open a second region of the first metal layer. Surface roughness of an interface of the first region of the first metal layer with the surface insulating layer is higher than surface roughness of an outer surface of the second region of the first metal layer.

公开(公告)号：US11139108B2

公开(公告)日：2021-10-05

申请号：US16181722

申请日：2018-11-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kang Wook Bong ,  Byeong Cheol Moon ,  Boum Seock Kim

IPC: H01F27/28 ,  H01F27/34 ,  H01F27/32 ,  H01F41/04 ,  H01F27/29

Abstract: A coil electronic component includes a body including a support member, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil, and external electrodes disposed on an external surface of the body and connected to the internal coil, wherein the internal coil includes a plurality of coil patterns, each of the plurality of coil patterns includes a lower coil pattern in contact with the support member and an upper coil pattern on the lower coil pattern, a line width and a thickness of the lower coil pattern are uniform in along the internal coil, and a line width and a thickness of the upper coil pattern are increased in a direction from the center of the internal coil to the outermost portion of the internal coil.

公开(公告)号：US11037732B2

公开(公告)日：2021-06-15

申请号：US16537843

申请日：2019-08-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Geum Kim ,  Byeong Cheol Moon ,  Kun Hoi Koo ,  Jung Min Kim

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.

公开(公告)号：US20210090784A1

公开(公告)日：2021-03-25

申请号：US16749382

申请日：2020-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hun Kim ,  Byeong Cheol Moon ,  Joung Gul Ryu

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04

Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.

公开(公告)号：US10804028B2

公开(公告)日：2020-10-13

申请号：US16026440

申请日：2018-07-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byeong Cheol Moon

IPC: H01F27/29 ,  H01F17/04

Abstract: A coil electronic component includes a magnetic body in which a coil having leads exposed to side surfaces of the coil is disposed. External terminals are connected to the leads and disposed on outer surfaces of the magnetic body. Additionally, the external terminals are folded to have side surface portions which are disposed on end surfaces of the magnetic body, and bottom surface portions which are disposed on a bottom surface of the magnetic body.

公开(公告)号：US20200051735A1

公开(公告)日：2020-02-13

申请号：US16365093

申请日：2019-03-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Gu Yeo ,  Byeong Cheol Moon

IPC: H01F27/32 ,  H01F27/28 ,  H01F27/29 ,  H01F27/24

Abstract: A coil component includes a body and external electrodes. The body includes a support member having through-openings formed in end portions thereof, an internal coil supported by the support member, and an encapsulant encapsulating the support member and the internal coil. The through-openings are filled with end portions of the internal coil. An insulating layer is interposed between the internal coil and the external electrode.

公开(公告)号：US09978509B2

公开(公告)日：2018-05-22

申请号：US15229587

申请日：2016-08-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Sik Yoon ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F27/255 ,  H01F41/04 ,  H01F41/10

Abstract: A coil component and a method of manufacturing the same are provided. The coil component may include a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a coil disposed on a surface of the support member and having a terminal exposed to at least one outer surface of the body part, and a conductive via connected to the terminal of the coil and penetrating through at least one end portion of the support member to thereby be exposed to the at least one outer surface of the body part.

公开(公告)号：US09530554B2

公开(公告)日：2016-12-27

申请号：US14084264

申请日：2013-11-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan Son ,  Jin Woo Hahn ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/28 ,  H01B1/02 ,  H01F17/00 ,  C04B35/26

CPC classification number: H01F27/2804 ,  C04B35/26 ,  C04B2235/3262 ,  C04B2235/3279 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/36 ,  C04B2235/6025 ,  H01B1/026 ,  H01F17/0013 ,  H01F2027/2809

Abstract: Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.

Abstract translation: 本文公开了一种多层线圈部件，其包括用于内部电极的铜 - 镍混合物，其中调节内部电极中的镍含量，从而优化镍与铜的面积比，而铜 - 镍混合物用于材料 对于多层线圈部件的内部电极，能够防止多层线圈部件的特性劣化，能够使阻抗（Z），电感（L）等多层线圈部件的铁氧体特性 改进。

公开(公告)号：US08729999B2

公开(公告)日：2014-05-20

申请号：US13660543

申请日：2012-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin Woo Hahn ,  Sung Yong An ,  Soo Hwan Son ,  Ic Seob Kim ,  Byeong Cheol Moon

IPC: H01F5/00 ,  H01F27/24 ,  H01F27/30

CPC classification number: H01F17/0033 ,  H01F17/0013 ,  H01F27/292

Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1≦Ts:Te≦0.3 is satisfied.

Abstract translation: 提供了一种多层芯片电子部件，包括：多层体，包括形成有导电图案的多个第一磁性层; 以及介于所述多层体内的所述第一磁性层之间的第二磁性层，其中所述导电图案电连接以在层叠方向上形成线圈图案，并且当所述第二磁性层的厚度被定义为Ts时， 导电图形被定义为Te，0.1＆nlE; Ts：Te＆nlE; 0.3。

公开(公告)号：US20250149233A1

公开(公告)日：2025-05-08

申请号：US18816570

申请日：2024-08-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Byeong Cheol Moon ,  Dong Hwan Lee ,  Dong Jin Lee ,  Boum Seock Kim

IPC: H01F27/30 ,  H01F5/04 ,  H01F27/32

Abstract: A coil componenti includes: a body having a first surface, a second surface opposing the first surface in a first direction, and a plurality of side surfaces connecting the first surface and the second surface to each other; a support member disposed inside the body; and first and second coils disposed on opposite sides of the support member, in which the first coil includes a first coil layer, a first lead portion disposed between the first coil layer and the support member, and a first conductive via connecting the first coil layer and the first lead portion to each other, and the second coil includes a second coil layer, a second lead portion disposed between the second coil layer and the support member, and a second conductive via connecting the second coil layer and the second lead portion to each other.