公开(公告)号：US10358388B2

公开(公告)日：2019-07-23

申请号：US15889856

申请日：2018-02-06

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ki Myoung Yun ,  Dong Jun Jung ,  Jae Sung Park ,  Tae Young Ham ,  Hyung Soon Kwon ,  Jong Han Kim ,  Hyoung Uk Kim

IPC分类号： H01G4/10 ,  C04B35/468 ,  C04B35/49 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/012

摘要： A multilayer electronic component includes: a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein each of the dielectric layers includes BamTiO3 and includes a plurality of grains and grain boundaries formed between adjacent grains, and a sum of contents of Si and Dy in the grain boundary is 10 to 15 parts by weight.