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    Inductor
    41.
    发明授权
    Inductor 有权

    公开(公告)号：US10650948B2

    公开(公告)日：2020-05-12

    申请号：US15675286

    申请日：2017-08-11

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim

    IPC: H01F5/00 ,  H01F17/00 ,  H01F27/29 ,  H01F27/32 ,  H01F5/04 ,  H01F10/06 ,  H01F17/04

    Abstract: An inductor includes: a body including a coil and a magnetic material, and external electrodes disposed on an outer surface of the body. The coil is supported by a support member, and the support member may also support an insulating wall including an open-hole pattern having a shape corresponding to a pattern of the coil. An insulating ribbon formed so that a length thereof is greater than a width thereof may be additionally disposed on at least a portion of an upper surface of the insulating wall.

    Inductor
    42.
    发明授权
    Inductor 有权

    公开(公告)号：US10546679B2

    公开(公告)日：2020-01-28

    申请号：US15634282

    申请日：2017-06-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim

    IPC: H01F5/00 ,  H01F27/02 ,  H01F27/29 ,  H01F27/28

    Abstract: An inductor includes a body including a support member, a coil supported by the support member, and an encapsulant encapsulating the support member and the coil, the coil including a plurality of coil patterns continuously connected to each other and at least some portion of a cross section of the coil pattern having a wavy shape, and external electrodes disposed on an outer surface of the body and electrically connected to the coil.

    Coil component
    45.
    发明授权
    Coil component 有权

    公开(公告)号：US12224099B2

    公开(公告)日：2025-02-11

    申请号：US17878570

    申请日：2022-08-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim

    IPC: H01F27/29 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/061

    Abstract: A coil component may include a body having one surface and the other surface facing each other, and including a molded portion having a core and a cover portion disposed on the molded portion; a wound coil disposed between the molded portion and the cover portion and wound around the core; and a first accommodation groove and a second accommodation groove disposed on the one surface of the body to be spaced apart from each other, and respectively disposed outside of a region of the body corresponding to the core, wherein both end portions of the wound coil are respectively disposed in the first and second accommodation grooves, and a minimum value of a distance between the first and second accommodation grooves is greater than a diameter of the core.

    Coil component
    47.
    发明授权
    Coil component 有权

    公开(公告)号：US11837394B2

    公开(公告)日：2023-12-05

    申请号：US16526218

    申请日：2019-07-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/061 ,  H01F27/02 ,  H01F27/24

    CPC classification number: H01F27/28 ,  H01F27/02 ,  H01F27/24 ,  H01F41/061

    Abstract: A coil component may include a body having one surface and the other surface facing each other, and including a molded portion having a core and a cover portion disposed on the molded portion; a wound coil disposed between the molded portion and the cover portion and wound around the core; and a first accommodation groove and a second accommodation groove disposed on the one surface of the body to be spaced apart from each other, and respectively disposed outside of a region of the body corresponding to the core, wherein both end portions of the wound coil are respectively disposed in the first and second accommodation grooves, and a minimum value of a distance between the first and second accommodation grooves is greater than a diameter of the core.

    Coil electronic component
    48.
    发明授权
    Coil electronic component 有权

    公开(公告)号：US11830665B2

    公开(公告)日：2023-11-28

    申请号：US16530396

    申请日：2019-08-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Byeong Cheol Moon

    IPC: H01F5/00 ,  H01F27/30 ,  H01F27/32

    CPC classification number: H01F27/306 ,  H01F27/32

    Abstract: A coil electronic component includes a body, an insulating substrate disposed in the body, first and second coil portions respectively disposed on a first surface and a second surface of the insulating substrate opposing each other, first and second lead-out portions each disposed on the first surface of the insulating substrate and exposed to at least two external surfaces of the body, first and second connection conductors disposed on the first surface of the insulating substrate and connecting the first lead-out portion and the first coil portion and connecting the second lead-out portion and the second coil portion, respectively, wherein the first connection conductor and the second connection conductor respectively include a plurality of first connection conductors and a plurality of second connection conductors, and the plurality of first connection conductors are spaced apart from one another and the plurality of second connection conductors are spaced apart from one another.

    Coil component
    49.
    发明授权
    Coil component 有权

    公开(公告)号：US11830662B2

    公开(公告)日：2023-11-28

    申请号：US16749382

    申请日：2020-01-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  Byeong Cheol Moon ,  Joung Gul Ryu

    IPC: H01F27/29 ,  H01F27/28 ,  H01F41/04 ,  H01F17/00

    CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F27/2804 ,  H01F27/2828 ,  H01F27/292 ,  H01F41/041 ,  H01F2027/2809

    Abstract: A coil component includes a support substrate; first and second coil portions, respectively arranged on the support substrate; a body embedding the support substrate and the first and second coil portions therein; first and second lead-out portions, respectively connected to end portions of the first and second coil portions and exposed from one surface to be spaced apart from each other; and first and second connection portions, respectively connecting the end portions of the first and second coil portions to the first and second lead-out portions, wherein a line width of one end of each of the first and second connection portions connected to the respective end portion of the first and second coil portions is smaller than a line width of another end of each of the first and second connection portions connected to a respective one of the first and second lead-out portions.

    COIL COMPONENT
    50.
    发明公开
    COIL COMPONENT 审中-公开

    公开(公告)号：US20230343507A1

    公开(公告)日：2023-10-26

    申请号：US18100094

    申请日：2023-01-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hun Kim ,  In Young Kang

    IPC: H01F27/29 ,  H01F27/32

    CPC classification number: H01F27/292 ,  H01F27/324

    Abstract: A coil component includes a body, a supporting member disposed within the body, a coil portion including a coil pattern disposed on at least one surface of the supporting member, a via pad connected to the coil pattern, and a via connected to the via pad, and an external electrode disposed on the body and connected to the coil portion. The via includes a plurality of side surfaces, one or more of the side surfaces is covered by the supporting member, and at least a portion of two or more of the side surfaces is non-covered by the supporting member.

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