公开(公告)号：US12119152B2

公开(公告)日：2024-10-15

申请号：US15990857

申请日：2018-05-29

申请人： Murata Manufacturing Co., Ltd.

发明人： Shingo Ito ,  Takumi Tanaka

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/28

CPC分类号： H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F2017/002 ,  H01F2017/0073 ,  H01F2017/048 ,  H01F2027/2809

摘要： A laminate of a laminated coil includes first and second sections in a stacking direction from a first surface toward a second surface. The number of windings of each of coil conductor patterns on insulation resin layers, respectively, in the first region is equal to or more than the number of windings of a coil conductor pattern on an insulation resin layer in the second section, and is more than the number of windings of the coil conductor pattern closest to the second surface in the second section. The number of main conductor portions per unit distance in the first section is more than the number of main conductor portions per unit distance in the second section. The outermost main conductor portion of the coil conductor pattern in the second section has a width more than a width of the main conductor portion of the coil conductor pattern in the first section.

公开(公告)号：US12057249B2

公开(公告)日：2024-08-06

申请号：US16989089

申请日：2020-08-10

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Hwi Dae Kim ,  Dong Hwan Lee ,  Sang Soo Park ,  Chan Yoon ,  Dong Jin Lee ,  Hye Mi Yoo

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/29 ,  H01F27/32

CPC分类号： H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F27/324 ,  H01F2017/048

摘要： A coil component includes a body, a coil portion disposed in the body and having first and second lead-out portions exposed to at least one surface of the body to be spaced apart from each other, first and second external electrodes disposed on the at least one surface of the body to be spaced apart from each other, and respectively connected to the first and second lead-out portions, a dielectric layer disposed on a surface of the body, and a third external electrode disposed on the surface of the body having the dielectric layer disposed thereon to be spaced apart from each of the first and second external electrodes, and covering the dielectric layer.

公开(公告)号：US12033786B2

公开(公告)日：2024-07-09

申请号：US17176713

申请日：2021-02-16

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Young Il Lee ,  Myoung Ki Shin ,  Ji Hoon Hwang ,  Jeong Gu Yeo

IPC分类号： H01F27/28 ,  H01F17/00 ,  H01F17/04 ,  H01F27/255 ,  H01F27/29

CPC分类号： H01F27/2847 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F27/292 ,  H01F2017/048 ,  Y10T428/32

摘要： A coil component includes a resin; and a magnetic particle dispersed in the resin and comprising magnetic powder particle, an insulating layer disposed on a surface of the magnetic powder particle, and a surface-treatment layer disposed on a surface of the insulating layer.

公开(公告)号：US20240212908A1

公开(公告)日：2024-06-27

申请号：US18478416

申请日：2023-09-29

申请人： Advanced Micro Devices, Inc. ,  ATI Technologies ULC

发明人： Robert Grant Spurney ,  Alexander Helmut Pfeiffenberger ,  Sri Ranga Sai Boyapati ,  Deepak Vasant Kulkarni

IPC分类号： H01F17/00 ,  H01F17/04 ,  H01F27/255

CPC分类号： H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F2017/002 ,  H01F2017/048

摘要： The disclosed inductor includes a magnetic material surrounding a conductive core. The magnetic material and conductive core can be embedded in a substrate. The magnetic material and conductive core can be formed in the substrate, using a magnetic composite material. Various other systems and methods are also disclosed.

公开(公告)号：US12020854B2

公开(公告)日：2024-06-25

申请号：US17115311

申请日：2020-12-08

申请人： TDK CORPORATION

发明人： Hitoshi Ohkubo ,  Miyuki Asai ,  Masazumi Arata ,  Hokuto Eda

IPC分类号： H01F27/32 ,  H01F17/04

CPC分类号： H01F27/324 ,  H01F17/04 ,  H01F2017/048

摘要： In a coil component, the pressure resistance is improved by main surfaces and of a main body portion being covered with an insulating layer. The main body portion has a surface part, the resin ratio of the surface part is higher than the internal resin ratio, and insulation is enhanced at the surface part. As a result, the pressure resistance on the surface of the main body portion is further improved and the pressure resistance of the entire coil component is further improved.

公开(公告)号：US11915854B2

公开(公告)日：2024-02-27

申请号：US16291979

申请日：2019-03-04

申请人： Murata Manufacturing Co., Ltd.

发明人： Yuya Ishida ,  Katsuyuki Takahashi ,  Hiroyuki Sugie ,  Keijiro Kojima

IPC分类号： H01F27/29 ,  H01F1/14 ,  H01F1/28 ,  H01F17/04 ,  H01F27/28 ,  H01F41/077

CPC分类号： H01F27/2828 ,  H01F1/143 ,  H01F1/28 ,  H01F17/045 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F41/077 ,  H01F2017/048

摘要： A wire coil component includes a shaped article, a wire wound around the shaped article, and terminal electrodes to which the ends of the wire are connected. The shaped article is formed from a magnetic resin containing a binder resin and a magnetic metal powder and has a thermal expansion coefficient of about 12 ppm/K or more and about 16 ppm/K or less (i.e., from about 12 ppm/K to about 16 ppm/K) from −55° C. to 150° C.

公开(公告)号：US11901112B2

公开(公告)日：2024-02-13

申请号：US16991587

申请日：2020-08-12

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Ju Hwan Yang ,  Seung Mo Lim ,  No Il Park ,  Byung Soo Kang ,  Byeong Cheol Moon

IPC分类号： H01F27/29 ,  H01F27/32 ,  H01F17/00 ,  H01F17/04 ,  H01F27/25 ,  H01F27/255

CPC分类号： H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F27/324 ,  H01F2017/048

摘要： A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer.

公开(公告)号：US11894168B2

公开(公告)日：2024-02-06

申请号：US17465000

申请日：2021-09-02

申请人： Seiko Epson Corporation

发明人： Yasuko Kudo ,  Mayu Watanabe ,  Hiroyoshi Otaka

IPC分类号： H01F1/153 ,  H01F27/255 ,  H01F27/28 ,  C22C38/02 ,  C22C38/16 ,  C22C38/12 ,  C22C38/06 ,  C22C38/14 ,  C22C38/28 ,  H01F3/08 ,  C22C38/26 ,  C22C38/20 ,  C22C38/34 ,  C22C38/32 ,  C22C38/00 ,  B22F1/054 ,  C22C33/00 ,  C22C33/02 ,  H01F17/04 ,  H01F17/06 ,  B22F9/08 ,  B22F1/142

CPC分类号： H01F1/15308 ,  B22F1/054 ,  C22C38/002 ,  C22C38/02 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C22C38/16 ,  C22C38/20 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  H01F1/15333 ,  H01F3/08 ,  H01F27/255 ,  H01F27/28 ,  B22F1/142 ,  B22F9/082 ,  B22F2999/00 ,  C22C33/003 ,  C22C33/02 ,  H01F17/062 ,  H01F2017/048 ,  B22F2999/00 ,  C22C2200/02 ,  C22C2202/02

摘要： A soft magnetic powder has a composition represented by Fe100-a-b-c-d-e-f-g-hCuaSibBcMdM′eXfAlgTih (at %) (wherein M is at least one element selected from the group consisting of Nb and the like, M′ is at least one element selected from the group consisting of V and the like, X is at least one element selected from the group consisting of C and the like, and a, b, c, d, e, f, g, and h satisfy the following formulae: 0.1≤a≤3, 0

公开(公告)号：US20240013970A1

公开(公告)日：2024-01-11

申请号：US18345970

申请日：2023-06-30

申请人： Murata Manufacturing Co., Ltd.

发明人： Ryuichiro TOMINAGA ,  Keisuke KUNIMORI ,  Yuuki KAWAKAMI ,  Yoshimasa YOSHIOKA

IPC分类号： H01F27/29 ,  H01F17/00 ,  H01F17/04

CPC分类号： H01F27/292 ,  H01F17/0013 ,  H01F17/04 ,  H01F2017/048 ,  H01F2017/002

摘要： An electronic component capable of improving connection reliability between a via conductor and a circuit pattern. An electronic component includes a circuit pattern; an insulating resin layer covering the circuit pattern; a via conductor provided inside the insulating resin layer and connected to the circuit pattern; and a wiring member connected to the circuit pattern via the via conductor. The via conductor and the wiring member are integrally formed, and in the via conductor, a diameter of an end portion on a side close to the circuit pattern is larger than a diameter of an end portion on a side close to the wiring member.

公开(公告)号：US20230420180A1

公开(公告)日：2023-12-28

申请号：US18466213

申请日：2023-09-13

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshimasa YOSHIOKA ,  Akinori HAMADA

IPC分类号： H01F27/32 ,  H01F27/28 ,  H01F27/29 ,  H01F17/04 ,  H01F17/00

CPC分类号： H01F27/324 ,  H01F27/2823 ,  H01F27/292 ,  H01F17/04 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/048

摘要： An inductor array component includes a substantially flat plate-shaped main body including a magnetic layer having resin and metal magnetic powder contained in the resin, a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other, and a plurality of first vertical wirings extending in a first direction of a normal direction with respect to the plane so as to penetrate through inside of the main body and being exposed on a side of a first main surface of the main body. Also, the inductor array component includes a plurality of second vertical wirings extending in a second direction of the normal direction with respect to the plane so as to penetrate through the inside of the main body and being exposed on a side of a second main surface of the main body.