公开(公告)号：US20140145814A1

公开(公告)日：2014-05-29

申请号：US14086152

申请日：2013-11-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Moon LEE ,  Jun Hee BAE ,  Sung Kwon WI ,  Yong Suk KIM

IPC: H01F27/28

CPC classification number: H01F17/0013 ,  H01F2017/0066

Abstract: Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer.

Abstract translation: 这里公开了一种薄膜型芯片装置，其包括形成在基板上的线圈图案; 限定图案的空腔限定图案，所述线圈图案的一部分通过所述腔暴露; 填充在空腔中的填充层; 以及包括覆盖填充层的表面的表面层的磁性层。

公开(公告)号：US20140145797A1

公开(公告)日：2014-05-29

申请号：US13842789

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Hee BAE ,  Sang Moon LEE ,  Sung Kwon WI ,  Yong Suk KIM

IPC: H03H7/01

CPC classification number: H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007 ,  H03H2001/0057 ,  H03H2001/0092 ,  Y10T29/49016

Abstract: Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product.

Abstract translation: 这里公开了共模噪声芯片滤波器及其制造方法，该共模噪声芯片滤波器包括：铁氧体基板; 在铁素体基板上形成的线圈图案; 以及形成在其上形成有线圈图案的结果基板上的铁氧体 - 聚合物复合层，其中铁氧体 - 聚合物复合层具有多层结构，使得铁氧体 - 聚合物复合层填充具有内部线圈图案的基板的内部空间 形成为具有多层结构而不是单层结构，从而降低内应力，从而提高作为产品的共模噪声芯片滤波器的可靠性。

公开(公告)号：US20140132366A1

公开(公告)日：2014-05-15

申请号：US14078317

申请日：2013-11-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Suk KIM ,  Sung Kwon WI ,  Hyeog Soo SHIN ,  Sang Moon LEE ,  Young Seuck YOO ,  Sung Jin PARK

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007

Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

Abstract translation: 本发明公开了一种过滤芯片元件，包括铁氧体衬底，形成在铁氧体衬底上的内部线圈图案; 以及填充在形成在铁氧体基板上的内部线圈图案之间的铁氧体复合层，其中，所述铁氧体复合层包括发泡树脂，从而提高作为电磁屏蔽部件中的噪声防止用过滤芯片元件的重要特性的磁导率和Q值 。

公开(公告)号：US20130234819A1

公开(公告)日：2013-09-12

申请号：US13766449

申请日：2013-02-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Seuck YOO ,  Sung Kwon WI ,  Jong Yun LEE ,  Sang Moon LEE ,  Won Chul SIM ,  Jeong Bok KWAK ,  Kang Heon HUR ,  Yong Suk KIM

IPC: H01F17/00

CPC classification number: H01F17/0013 ,  H01F2017/0066

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate.

Abstract translation: 共模滤波器及其制造方法技术领域本发明涉及共模滤波器及其制造方法，提供一种薄膜型共模滤波器，包括：第一磁性基板; 第一层压体，设置在第一磁性基板上并且包括初级线圈图案电极; 设置在所述第一层压体上的芯磁性层; 设置在芯磁性层上并包括次级线圈图形电极的第二层压体; 以及设置在所述第二层压体上的第二磁性基板。