公开(公告)号：US06969302B1

公开(公告)日：2005-11-29

申请号：US09594502

申请日：2000-06-16

申请人： Tomohiro Hashii

发明人： Tomohiro Hashii

IPC分类号： B24B7/17 ,  B24B7/22 ,  B24B37/00 ,  H01L21/304

CPC分类号： B24B37/08 ,  B24B7/228

摘要： To reduce the wafer production cost by grinding a sliced semiconductor wafer at a high accuracy and a high efficiency and supplying the wafer to the next polishing step. A semiconductor wafer is rough ground between grindstones by a fixed grindstone. After rough grinding, finish grinding by free abrasive grain is performed on the same grinding axis by supplying a slurry which suspends fine abrasive grain between the grindstones through slurry pipes. To perform finish grinding by free abrasive grains, a rotational speed and a feed rate of the grindstones are lowered to lower the grinding action by a fixed grindstone.

摘要翻译： 通过以高精度和高效率研磨切片的半导体晶片来降低晶片生产成本，并将晶片供给下一个抛光步骤。 半导体晶片通过固定磨石在磨石之间粗糙地面。 粗磨之后，通过供给通过浆料管在砂轮之间悬浮精细磨粒的浆料，在相同的研磨轴上进行无磨损颗粒的精磨。 为了通过自由磨粒进行精磨，降低了磨石的旋转速度和进给速率，以通过固定磨石降低研磨动作。

公开(公告)号：US06753256B2

公开(公告)日：2004-06-22

申请号：US09919900

申请日：2001-08-02

申请人： Tomohiro Hashii ,  Tooru Watanabe

发明人： Tomohiro Hashii ,  Tooru Watanabe

IPC分类号： H01L21302

CPC分类号： H01L21/02008 ,  B24B37/042 ,  B24B37/08

摘要： An object of the present invention is to provide a method of manufacturing a semiconductor wafer in which the manufacturing efficiency of grinding using a double-headed grinding machine is improved, minute surface undulations arising through the grinding are reduced, and the yield of the manufacturing process is improved. By processing a sliced wafer using a double-headed grinding machine, a strained layer and a macroscopic undulation component formed on the wafer surfaces during the slicing are removed, and the degree of flatness of the wafer is improved, and by subsequently carrying out both-surfaces lapping, minute surface undulations that arose during the double-headed grinding are removed.

摘要翻译： 本发明的目的是提供一种制造半导体晶片的方法，其中使用双头磨床的研磨制造效率提高，通过研磨产生的微小的表面波动减小，并且制造过程的产量 改进了 通过使用双头研磨机处理切片晶片，去除在切片期间在晶片表面上形成的应变层和宏观波动部件，提高晶片的平坦度， 研磨表面，去除在双头研磨过程中产生的微小表面起伏。