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公开(公告)号：US4972595A
公开(公告)日：1990-11-27
申请号：US314640
申请日：1989-02-23
摘要： An inclination sensor is contemplated which includes case means having a cavity formed in the interior thereof, with this cavity having a longitudinal slope which is generally V-shaped in longitudinal profile, downwardly concave, and having a downwardly facing apex. A movable member is movable longitudinally along the slope within said cavity. A detecting means is operable to detect the inclination of a mounting body to which said case means is attached, in response to longitudinal movement of the movable member along the longitudinal generally V-shaped slope. A restricting means is provided by the apex and is operable to impede movement of the movable member out of the apex only until the case means undergoes a predetermined, longitudinal tilting movement.
摘要翻译： 可以设想一种倾斜传感器，其包括在其内部形成有空腔的壳体装置，该空腔具有纵向斜面，该纵向斜面在纵向轮廓中大致为V形，向下凹入，并且具有面向下的顶点。 可移动构件沿着所述空腔内的斜坡纵向移动。 检测装置可操作以响应于沿着纵向大致V形斜坡的可移动构件的纵向移动来检测所述壳体装置附接到的安装体的倾斜度。 限制装置由顶点提供并且可操作以阻止可移动构件从顶点的移动，直到外壳装置经历预定的纵向倾斜运动。
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公开(公告)号：US4483749A
公开(公告)日：1984-11-20
申请号：US508659
申请日：1983-06-28
申请人： Koichi Shimamura
发明人： Koichi Shimamura
CPC分类号： C25D5/026 , C25D5/08 , H01L21/4846 , H05K3/241 , Y10S204/07
摘要： Here are disclosed a method and apparatus for making it possible to plate specific parts of members to be plated to be high in the precision and quality even in minute area parts.In highly integrated printed base plates and integrated circuit elements, it has been difficult to plate precious metals high in the specific conductivity precisely and uniformly in the required minute parts with a plating apparatus in order to control as much as possible the resistances and impedances in the respective terminals and contacts. Therefore, according to the present invention, in a jetting type plating apparatus jetting a plating liquid through a nozzle onto a specific part required to be plated of an object to be plated, a mask is brought into close contact with the periphery of the specific part opposed to the nozzle to form a sealed space around the nozzle by a closely enclosing means, the object to be plated is set at a distance adjacent to the nozzle tip, a voltage of a predetermined polarity is impressed to make the migration of metal ions by an electric field conspicuous, to make a plating treatment possible and the sealed space is held under a negative pressure to quickly suck and discharge the used plating liquid.
摘要翻译： 这里公开了一种方法和装置，即使在微小区域部分中也可以将要镀覆的部件的特定部件的精度和质量设定得很高。 在高度集成的印刷基板和集成电路元件中，难以用电镀装置在所需的微小部分中精确而均匀地印制高电导率的贵金属，以便尽可能多地控制电阻和阻抗 相应的端子和触点。 因此，根据本发明，在通过喷嘴将电镀液喷射到要镀覆对象的特定部位的喷射型电镀装置中，将掩模与特定部分的周边紧密接触 与喷嘴相对以通过紧密封闭的装置在喷嘴周围形成密封空间，被镀物体设置在与喷嘴尖端相邻的距离处，施加预定极性的电压以使金属离子的迁移通过 电场显眼，能够进行电镀处理，将密封空间保持在负压下，以快速吸引和排出所使用的电镀液。
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