3D PRINTING APPARATUS USING SELECTIVE ELECTROCHEMICAL DEPOSITION

    公开(公告)号:US20180178461A1

    公开(公告)日:2018-06-28

    申请号:US15437403

    申请日:2017-02-20

    IPC分类号: B29C67/00 C25D5/02 B29C67/24

    摘要: A three-dimensional (3D) printing apparatus using selective electrochemical deposition is provided. The 3D printing apparatus is used to selectively deposit a metallic material on a substrate using a nozzle for jetting an electrolyte at a predetermined pressure to enhance 3D printing speed of a metallic product stacked on the substrate. The 3D printing apparatus is configured in such a way that a metallic product is 3D-printed as a metallic material is selectively deposited on the substrate while the electrolyte is continuously jetted at a predetermined pressure and, thus, 3D printing speed of a metallic product stacked on the substrate is remarkably increased compared with the case according to the prior art (Korean Publication No. 10-2015-0020356) in which plating is performed only when a meniscus is formed. Accordingly, the 3D printing apparatus is also applied to 3D printing of a bulk type of a metallic product with a comparatively large shape.

    Plug gauge with maintenance line and round point and method of manufacturing the same
    2.
    发明授权
    Plug gauge with maintenance line and round point and method of manufacturing the same 有权
    插头规格与维护线和圆点及其制造方法相同

    公开(公告)号:US09476821B2

    公开(公告)日:2016-10-25

    申请号:US14170332

    申请日:2014-01-31

    摘要: Due to repeated use of a gauge portion, used to perform positioning and accuracy comparison measurement at the time of manufacture of various type of molds for metalworking, a gauge line on an outer circumferential surface portion of the gauge portion can disappear due to friction. A plug gauge body, which helps a user recognize the time for maintenance and replacement of the plug gauge, has a constricted portion formed on one side of a shank portion and a cylindrical gauge portion having a uniform diameter and extending from one side of the constricted portion, with the shank portion, the constricted portion, and the gauge portion, being formed axially, a wear checking gauge line having a predetermined depth and width formed so as to extend from one end portion of an outer circumferential surface portion of the gauge portion in the direction of the constricted portion.

    摘要翻译: 由于重复使用用于在制造用于金属加工的各种类型的模具时执行定位和精度比较测量的量规部分,所以量规部分的外周表面部分上的规矩线可能由于摩擦而消失。 帮助用户识别插头规的维护和更换时间的塞子测量体具有形成在柄部的一侧上的收缩部分和具有均匀直径并且从收缩部分的一侧延伸的圆柱形部分部分 部分,其中所述柄部分,所述收缩部分和所述计量部分轴向地形成有具有预定深度和宽度的磨损检查计量管线,其形成为从所述量规部分的外周表面部分的一个端部延伸 在收缩部分的方向上。

    PLUG GAUGE WITH MAINTENANCE LINE AND ROUND POINT AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PLUG GAUGE WITH MAINTENANCE LINE AND ROUND POINT AND METHOD OF MANUFACTURING THE SAME 有权
    具有维护线和圆点的插头尺寸及其制造方法

    公开(公告)号:US20140299042A1

    公开(公告)日:2014-10-09

    申请号:US14170332

    申请日:2014-01-31

    IPC分类号: G01N19/00 C25D5/02

    摘要: Due to repeated use of a gauge portion, used to perform positioning and accuracy comparison measurement at the time of manufacture of various type of molds for metalworking, a gauge line on an outer circumferential surface portion of the gauge portion can disappear due to friction. A plug gauge body, which helps a user recognize the time for maintenance and replacement of the plug gauge, has a constricted portion formed on one side of a shank portion and a cylindrical gauge portion having a uniform diameter and extending from one side of the constricted portion, with the shank portion, the constricted portion, and the gauge portion, being formed axially, a wear checking gauge line having a predetermined depth and width formed so as to extend from one end portion of an outer circumferential surface portion of the gauge portion in the direction of the constricted portion.

    摘要翻译: 由于重复使用用于在制造用于金属加工的各种类型的模具时执行定位和精度比较测量的量规部分,所以量规部分的外周表面部分上的规矩线可能由于摩擦而消失。 帮助用户识别插头规的维护和更换时间的塞子测量体具有形成在柄部的一侧上的收缩部分和具有均匀直径并且从收缩部分的一侧延伸的圆柱形部分部分 部分,其中所述柄部分,所述收缩部分和所述计量部分轴向地形成有具有预定深度和宽度的磨损检查计量管线,其形成为从所述量规部分的外周表面部分的一个端部延伸 在收缩部分的方向上。

    Electrochemical deposition method utilizing microdroplets of solution
    6.
    发明授权
    Electrochemical deposition method utilizing microdroplets of solution 有权
    电解沉积法利用微滴溶液

    公开(公告)号:US07628902B2

    公开(公告)日:2009-12-08

    申请号:US11169496

    申请日:2005-06-28

    IPC分类号: C25D5/02 C25D5/08

    摘要: A method of electrochemical deposition uses microdroplets of electrolytic solution over a targeted small circuit element. Only the targeted circuit element is electrically biased so that deposition occurs on the surface of that element, underneath the microdroplet, and nowhere else unless it is under other microdroplet(s). The invented method achieves extremely accurate and selective electrochemical deposition with a tiny amount of electrolytic solution, compared to conventional submersive and/or immersive methods, and eliminates the need for masking or etching, reducing the costs of manufacture and amount of waste electrolytic solution produced.

    摘要翻译: 电化学沉积的方法在目标小电路元件上使用电解液的微滴。 只有目标电路元件被电偏置,使得沉积发生在该元件的表面上,在微滴下面,除非在其它微滴之下,否则不存在其它地方。 与传统的潜水和/或沉浸式方法相比,本发明的方法与少量的电解液相比,实现了非常精确和选择性的电化学沉积,并且不需要掩蔽或蚀刻,降低了制造成本和生产的废电解液的量。

    Electroplating Head and Method for Operating the Same
    7.
    发明申请
    Electroplating Head and Method for Operating the Same 有权
    电镀头及其操作方法

    公开(公告)号:US20090242413A1

    公开(公告)日:2009-10-01

    申请号:US12482171

    申请日:2009-06-10

    IPC分类号: C25D21/10 C25D3/02

    摘要: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.

    摘要翻译: 电镀头设置在晶片的上表面上方并靠近晶片的上表面。 阳离子从阳极转移到电镀头内的电镀溶液中。 电镀溶液在电镀头的出口处向下流过多孔电阻材料以设置在晶片的上表面上。 通过电镀溶液在晶片的阳极和上表面之间建立电流。 通过存在于阳极和晶片上表面之间的多孔电阻材料均匀分布电流。 电流导致阳离子被吸引到晶片的上表面。

    Apparatus for enhanced electrochemical deposition
    9.
    发明申请
    Apparatus for enhanced electrochemical deposition 有权
    用于增强电化学沉积的装置

    公开(公告)号:US20070289867A1

    公开(公告)日:2007-12-20

    申请号:US11827829

    申请日:2007-07-13

    申请人: Uri Cohen

    发明人: Uri Cohen

    IPC分类号: C25B9/00

    摘要: One embodiment of the invention is an apparatus for electrochemical deposition (ECD) of a metal or an alloy inside at least one opening located at a front surface of a substrate, said apparatus including: (a) an electrochemical deposition (ECD) cell adapted to contain an electrolyte, the electrolyte including plating metallic ions and at least one inhibitor additive; (b) a cathode including at least a portion of said front surface of the substrate, wherein at least one surface inside said at least one opening includes an exposed metallic surface, and wherein at least a portion of said cathode is immersed in said electrolyte; (c) at least one anode, wherein at least a portion of the at least one anode is immersed in said electrolyte; (d) a power supply adapted to generate an electroplating current through the electrolyte between said cathode and said at least one anode; and (e) means for producing a turbulent flow of the electrolyte across the front surface of the substrate, wherein the turbulent flow is capable of producing a diffusion layer thickness of less than about 50 μm at said front surface of the substrate.

    摘要翻译: 本发明的一个实施方案是一种用于在位于基材的前表面的至少一个开口内的金属或合金的电化学沉积(ECD)的装置,所述装置包括:(a)电化学沉积(ECD)电池,适于 含有电解质,所述电解质包括电镀金属离子和至少一种抑制添加剂; (b)阴极,其包括所述基板的所述前表面的至少一部分,其中所述至少一个开口内的至少一个表面包括暴露的金属表面,并且其中所述阴极的至少一部分浸入所述电解质中; (c)至少一个阳极,其中所述至少一个阳极的至少一部分浸入所述电解质中; (d)适于在所述阴极和所述至少一个阳极之间产生通过所述电解质的电镀电流的电源; 和(e)用于在衬底的前表面上产生电解质湍流的装置,其中湍流能够在衬底的所述前表面处产生小于约50μm的扩散层厚度。

    Plating method and apparatus
    10.
    发明授权
    Plating method and apparatus 失效
    电镀方法和装置

    公开(公告)号:US06221230B1

    公开(公告)日:2001-04-24

    申请号:US09078572

    申请日:1998-05-14

    IPC分类号: C25D508

    摘要: A method and apparatus for forming a layer of plating on a base material and a method for manufacturing a three dimensional object. The plating apparatus includes a nozzle for delivering a stream of plating fluid and an electric source for applying a voltage between the base material and the nozzle. The nozzle has an outer wall and a stem located at its center. The nozzle delivers plating fluid from the opening of the nozzle in an annular manner to produce a stream that has a substantially uniform flow velocity when the stream hits the base material. In an another embodiment, the nozzle has surrounding conduit for conducting air. The air increases the velocity of a peripheral portion of the stream. To manufacture a three dimensional object, a plating layer is deposited, and the nozzle is moved to form a desired shape while piling the layer.

    摘要翻译: 一种用于在基材上形成电镀层的方法和装置以及用于制造三维物体的方法。 电镀装置包括用于输送电镀液流的喷嘴和用于在基材和喷嘴之间施加电压的电源。 喷嘴具有位于其中心的外壁和杆。 喷嘴以环形方式从喷嘴的开口输送电镀液,以产生当料流撞击基材时具有基本均匀流速的流。 在另一个实施例中,喷嘴具有用于传导空气的周围导管。 空气增加了流的周边部分的速度。 为了制造三维物体,沉积镀层,并且在堆叠层时使喷嘴移动以形成期望的形状。