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公开(公告)号：US08253765B2
公开(公告)日：2012-08-28
申请号：US12804955
申请日：2010-08-03
IPC分类号： B41J2/335
CPC分类号： B41J2/335 , B41J2/33585
摘要： Provided is a thermal head (1) including: a substrate body (12) constituted through bonding a flat supporting substrate (13) and a flat upper substrate (11), which are made of a glass material onto each other in a stacked state; a heating resistor (14) formed on a surface of the upper substrate (11); and a protective film (18) that partially covers the surface of the upper substrate (11) including the heating resistor (14) and protects the heating resistor (14), in which a heat-insulating concave portion (32) and thickness-measuring concave portions (34), which are open to a bonding surface between the supporting substrate and the upper substrate (11) and form cavities are provided in the supporting substrate (13), the heat-insulating concave portion (32) is formed at a position opposed to the heating resistor (14), and the thickness-measuring concave portions (34) is formed in a region that is prevented from being covered with the protective film (18). Thus, the thickness of the upper substrate is easily measured without decomposing the thermal head.
摘要翻译： 本发明提供一种热敏头（1），其特征在于，包括：基板主体（12），其通过将平坦的支撑基板（13）和平坦的上基板（11）以层叠的状态彼此结合而形成; 形成在所述上基板（11）的表面上的加热电阻（14）; 以及保护膜（18），其部分地覆盖包括所述加热电阻器（14）的所述上基板（11）的表面，并且保护所述加热电阻器（14），其中，绝热凹部（32）和厚度测量 在支撑基板（13）上设置有在支撑基板和上基板（11）之间的接合面开口并形成空腔的凹部（34），隔热凹部（32）形成在 位于与发热电阻体（14）相对的位置，厚度测定凹部（34）形成在防止被保护膜（18）覆盖的区域。 因此，容易测量上基板的厚度，而不会使热敏头分解。
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公开(公告)号：US20120212558A1
公开(公告)日：2012-08-23
申请号：US13401894
申请日：2012-02-22
IPC分类号： B41J2/335
CPC分类号： B41J2/33585
摘要： Adopted is a thermal head, including: a support substrate including a concave portion formed in a front surface thereof; an upper substrate, which is bonded in a stacked state to the front surface of the support substrate and includes a convex portion formed at a position corresponding to the concave portion; a heating resistor provided on a front surface of the upper substrate at a position straddling the convex portion; and a pair of electrodes provided on both sides of the heating resistor, in which at least one of the pair of electrodes include: a thin portion, which is connected to the heating resistor in a region corresponding to the concave portion; and a thick portion, which is connected to the heating resistor and is formed thicker than the thin portion.
摘要翻译： 采用热敏头，包括：支撑基板，其包括形成在其前表面中的凹部; 上层基板，其以叠层状态接合到所述支撑基板的前表面，并且包括形成在与所述凹部对应的位置的凸部; 加热电阻器，其设置在跨越所述凸部的位置的所述上基板的前表面上; 以及一对电极，其设置在所述加热电阻器的两侧，所述一对电极中的至少一个包括：薄部，其在与所述凹部对应的区域中连接到所述加热电阻器; 以及连接到加热电阻器并且形成为比薄部分厚的厚部分。
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公开(公告)号：US08189021B2
公开(公告)日：2012-05-29
申请号：US12589593
申请日：2009-10-26
IPC分类号： B41J2/335
CPC分类号： B41J2/33585 , B41J2/3359 , Y10T29/49401
摘要： A thermal head manufacturing method comprises a concave portion forming step of forming a concave portion on one surface of a supporting substrate, a bonding step of bonding a thin plate glass to the one surface of the supporting substrate where the concave portion has been formed in a manner that hermetically seals the concave portion and forms a hollow portion, a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step to thereby soften the thin plate glass and expand gas trapped inside the hollow portion, and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion. During the heating step, the thin glass plate undergoes plastic deformation, due to expansion of the gas inside the hollow portion, and rises toward an opposite side from the hollow portion, and a leveling step is carried out to level the outer surface of the plastically deformed thin glass plate.
摘要翻译： 热敏打印头的制造方法包括在支撑基板的一个面上形成凹部的凹部形成工序，将薄板玻璃与形成有凹部的支撑基板的一个面接合的接合工序 密封凹部并形成中空部的方式，在接合工序中加热支撑基板和薄板玻璃的加热工序，从而使薄板玻璃软化，将中空部内的气体膨胀 以及在薄板玻璃上形成加热电阻器以与中空部分相对的加热电阻器形成步骤。 在加热步骤期间，由于中空部分内部的气体膨胀，薄玻璃板发生塑性变形，并且朝向与中空部分相反的一侧上升，并且进行调平步骤以使塑性的外表面平坦化 变形薄玻璃板。
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44.发明授权公开(公告)号：US08189020B2
公开(公告)日：2012-05-29
申请号：US12613849
申请日：2009-11-06
IPC分类号： B41J2/335
CPC分类号： B41J2/33525 , B41J2/33585 , B41J2/3359 , Y10T156/1031
摘要： To improve heat generating efficiency and printing quality, a plurality of heating resistors (14) are arranged with spaces therebetween on a heat storage layer (13) laminated on a surface of a supporting substrate (11) via an adhesive layer (12) made of an elastic material. A cavity section (19) is formed at a region between the supporting substrate (11) and the heat storage layer (13), the region being opposed to a heat generating portion of each of the plurality of heating resistors (14). The cavity section (19) includes a concave portion (20) formed in the surface of the supporting substrate (11) and the heat storage layer (13) in which the concave portion (20) is closed and the surface thereof is exposed to the cavity section (19).
摘要翻译： 为了提高发热效率和印刷质量，多个加热电阻器（14）通过层叠在支撑基板（11）的表面上的热存储层（13）上经由经由粘合剂层（12）形成的空间布置， 弹性材料。 在支撑基板（11）和蓄热层（13）之间的区域形成有空腔部（19），该区域与多个加热电阻体（14）的发热部分相对。 空腔部分（19）包括形成在支撑基板（11）的表面上的凹部（20）和其中凹部（20）被封闭并且其表面暴露于其中的储热层（13） 空腔部分（19）。
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45.发明授权Heating resistor element, manufacturing method for the same, thermal head, and printer 有权加热电阻元件，制造方法相同，热敏头和打印机公开(公告)号：US08154575B2
公开(公告)日：2012-04-10
申请号：US12254570
申请日：2008-10-20
IPC分类号： B41J2/335
CPC分类号： H05B3/16 , B41J2/3357 , B41J2/33585 , Y10T29/49083
摘要： Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 μm or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.
摘要翻译： 提供一种加热电阻元件，包括：绝缘基板（9）; 与绝缘基板（9）的表面接合的蓄热层（10）; 以及设置在所述蓄热层（10）上的加热电阻器（11），其中：在所述加热基板（9）和所述蓄热层（10）的至少一个接合面上，所述绝缘基板 （9）和蓄热层（10）在与发热电阻体（11）相对的区域设有凹部（16），形成中空部（17）。 并且所述凹部（16）的每个角部的曲率半径为10μm以上。 因此，能够抑制由热或负荷引起的应力集中的发生，提高耐久性，并且能够实现充分的强度和加热效率。
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公开(公告)号：US08111273B2
公开(公告)日：2012-02-07
申请号：US12586989
申请日：2009-09-30
IPC分类号： B41J2/335
CPC分类号： B41J2/3355 , B41J2/33585 , Y10T29/49083
摘要： To achieve improvements in heating efficiency and strength against external load, provided is a thermal head (1), comprising: a supporting substrate (3) having a surface in which a concave portion (2) is formed; a heat storage layer (5) bonded onto the surface of the supporting substrate (3); a heating resistor provided in a region, which is opposed to the concave portion (2) of the supporting substrate (3), on the heat storage layer (5); and a protruding portion (2A), which is provided inside a hollow portion formed between the supporting substrate (3) and the heat storage layer (5) by the concave portion (2), and comes into contact with the heat storage layer (5) and limits deflection of the heat storage layer (5) when the heating resistor is pressurized by predetermined load or more.
摘要翻译： 为了实现对外部负载的加热效率和强度的提高，提供了一种热敏头（1），包括：支撑基板（3），其具有形成有凹部（2）的表面; 结合到所述支撑基板（3）的表面上的储热层（5）; 设置在与所述支撑基板（3）的凹部（2）相对的区域中的加热电阻器，位于所述储热层（5）上。 以及设置在由所述凹部（2）形成在所述支撑基板（3）和所述蓄热层（5）之间的中空部内的与所述蓄热层（5）接触的突出部（2A） ），并且当加热电阻器被加压预定负载或更多时限制储热层（5）的偏转。
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公开(公告)号：US20110031212A1
公开(公告)日：2011-02-10
申请号：US12804954
申请日：2010-08-03
IPC分类号： B32B38/10
CPC分类号： B41J2/3359 , Y10T29/49083
摘要： Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)). Thus, a high-efficiency thermal head capable of accurately outputting a target heating amount obtained by estimating an amount of heat wasted without being used is easily manufactured without using a special apparatus.
摘要翻译： 本发明提供一种热敏头的制造方法，其特征在于，包括：将层叠状态的平坦的上部基板接合在具有向其一个表面开口的绝热凹部的平坦的支撑基板上，使得所述绝热凹部闭合（接合 步骤（SA2））; 通过接合步骤（SA2）（板薄化步骤（SA3））使结合到支撑衬底上的上衬底变薄; 测量通过板薄化步骤（SA3）变薄的上基板的厚度（测量步骤（SA4））; 基于通过测量步骤（SA4）测量的上基板的厚度（判定步骤（SA5）），确定加热电阻器的目标电阻值; 在由所述薄板稀化工序（SA3）变薄的所述上基板的表面的位置处，形成由所述判定工序（SA5）决定的所述目标电阻值的所述加热电阻体，与所述绝热凹部 （电阻形成工序（SA6））。 因此，在不使用特殊装置的情况下，容易制造能够精确地输出通过估计不使用而浪费的热量而获得的目标加热量的高效热头。
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公开(公告)号：US20100140215A1
公开(公告)日：2010-06-10
申请号：US12592866
申请日：2009-12-03
IPC分类号： C23F1/00
CPC分类号： B41J2/33585 , B41J2/3359
摘要： To keep printing quality uniform and to improve productivity, while maintaining a heating efficiency and a strength against an external load, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one face of a supporting substrate; an upper substrate forming step of forming an upper substrate in which an etching layer and a non-etching layer are arranged in layers in a substrate thickness direction, the etching layer being etched at a predetermined etching rate, the non-etching layer being lower in etching rate than the etching layer; a bonding step of bonding the one face of the supporting substrate in which the concave portion has been formed in the concave portion forming step to a surface on a side of the non-etching layer of the upper substrate; a thinning step of etching the etching layer of the upper substrate which has been bonded to the supporting substrate in the bonding step; and a heating resistor forming step of forming a heating resistor across from the concave portion of the supporting substrate on the upper substrate which has been thinned in the thinning step.
摘要翻译： 为了保持印刷质量均匀并提高生产率，在保持加热效率和抵抗外部载荷的强度的同时，提供一种热敏头制造方法，包括：凹部形成步骤，在支撑基板的一个面上形成凹部; 上基板形成步骤，其形成在基板厚度方向上分层设置蚀刻层和非蚀刻层的上基板，蚀刻层以预定的蚀刻速率被蚀刻，非蚀刻层的下蚀刻层 蚀刻速率比蚀刻层高; 将在凹部形成工序中形成有凹部的支撑基板的一面与上基板的非蚀刻层侧的表面接合的接合工序; 在接合步骤中蚀刻已经结合到支撑衬底的上衬底的蚀刻层的薄化步骤; 以及加热电阻体的形成工序，在所述薄化工序中已经变薄的所述上基板上从所述支撑基板的所述凹部形成加热电阻体。
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公开(公告)号：US20100118105A1
公开(公告)日：2010-05-13
申请号：US12589593
申请日：2009-10-26
CPC分类号： B41J2/33585 , B41J2/3359 , Y10T29/49401
摘要： To provide a thermal head and a printer which realize improved heating efficiency and improved strength, and to manufacture the thermal head stably, provided is a thermal head manufacturing method including: a concave portion forming step of forming a concave portion on one surface of a supporting substrate; a bonding step of bonding a thin plate glass shaped like a substantially flat board, to the one surface of the supporting substrate where the concave portion has been formed in the concave portion forming step, in a manner that hermetically seals the concave portion and forms a hollow portion; a heating step of heating the supporting substrate and the thin plate glass which have been bonded together in the bonding step, to thereby soften the thin plate glass and expand gas trapped inside the hollow portion; and a heating resistor forming step of forming a heating resistor on the thin plate glass so as to be opposed to the hollow portion, wherein the heating step concavely curves a surface of the thin plate glass that is on the hollow portion side.
摘要翻译： 为了提供一种能够实现提高加热效率和提高强度的热敏头和打印机，并且为了稳定地制造热敏头，提供了一种热敏头制造方法，包括：凹部形成步骤，在支撑体的一个表面上形成凹部 基质; 将形成为大致平板状的薄板状玻璃的接合工序，以凹状部形成工序形成凹部的支撑基板的一个面粘接，形成凹部 中空部分 在接合步骤中加热已经结合在一起的支撑基板和薄板玻璃的加热步骤，从而软化薄板玻璃并膨胀被困在中空部分内的气体; 以及加热电阻体的形成步骤，在所述薄板玻璃上形成与所述中空部相对的加热电阻体，所述加热工序使所述中空部侧的所述薄板玻璃的表面凹凸地弯曲。
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公开(公告)号：US08769806B2
公开(公告)日：2014-07-08
申请号：US13200250
申请日：2011-09-21
IPC分类号： H05B3/00
CPC分类号： H01C17/065 , B41J2/335 , B41J2/33585 , B41J2/3359
摘要： In a method of manufacturing a thermal head, a groove portion is formed in one surface of at least one of a first substrate and a second substrate, and a width dimension of the groove portion is measured. The first and second substrates are bonded to each other in a stacked state so as to close an opening of the groove portion. A heating resistor is formed on a surface of the second substrate in a region opposed to the groove portion. A protective film for covering and protecting the heating resistor is formed on the surface of the second substrate. A thickness dimension of the protective film is set so as to increase with an increase in the measured width dimension of the groove portion and so as to decrease with an increase in a thickness dimension of the second substrate.
摘要翻译： 在制造热敏头的方法中，在第一基板和第二基板中的至少一个的一个表面上形成槽部，并且测量槽部的宽度尺寸。 第一和第二基板以堆叠状态彼此结合，以封闭槽部的开口。 在与槽部相对的区域中，在第二基板的表面上形成发热电阻体。 在第二基板的表面上形成用于覆盖和保护加热电阻器的保护膜。 保护膜的厚度尺寸设定为随着槽部的测量宽度尺寸的增加而增加，并且随着第二基板的厚度尺寸的增加而减小。
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