公开(公告)号：US06893574B2

公开(公告)日：2005-05-17

申请号：US10002953

申请日：2001-10-23

申请人： Lawrence E. Felton ,  Peter W. Farrell ,  Jing Luo ,  David J. Collins ,  John R. Martin ,  William A. Webster

发明人： Lawrence E. Felton ,  Peter W. Farrell ,  Jing Luo ,  David J. Collins ,  John R. Martin ,  William A. Webster

IPC分类号： B81B7/00 ,  B81C1/00 ,  H01L23/10 ,  C23F1/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： B81B7/0077 ,  B81C1/00896 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

摘要翻译： MEMS封盖方法和装置使用盖结构，其上形成有MEMS空腔，切割捕获腔和盖壁。 盖壁基本上是MEMS空腔的外壁和切割捕获腔的内壁。 帽结构结合到MEMS结构上，使得MEMS腔覆盖受保护的MEMS部件。 帽盖结构通过从盖结构的顶部切割到切割捕获腔而不被切割直到MEMS结构来修剪。

公开(公告)号：US06759273B2

公开(公告)日：2004-07-06

申请号：US10006967

申请日：2001-12-05

申请人： Lawrence E. Felton ,  Jing Luo

发明人： Lawrence E. Felton ,  Jing Luo

IPC分类号： H01L2144

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  B81C1/00896 ,  H01L2221/68327

摘要： A wafer cap protects micro electromechanical system (“MEMS”) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

摘要翻译： 在MEMS晶片的切割期间，晶片盖保护微机电系统（“MEMS”）结构以产生单独的MEMS管芯。 制备具有多个MEMS结构位置的MEMS晶片。 在MEMS晶片上，安装晶片盖以产生层压的MEMS晶片。 晶片盖凹入与MEMS晶片上的MEMS结构位置的位置对应的区域中。 封装的MEMS晶片可以切割成多个MEMS管芯，而不会损坏或污染MEMS管芯。