公开(公告)号：US20230365402A1

公开(公告)日：2023-11-16

申请号：US18354012

申请日：2023-07-18

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chih-Hang Chang ,  I-Shi Wang ,  Jen-Hao Liu

IPC分类号： B81C1/00 ,  B81C3/00

CPC分类号： B81C1/00238 ,  B81C1/00269 ,  B81C1/00888 ,  B81C3/005 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2201/0146 ,  B81C2203/035

摘要： A semiconductor device structure is provided. The semiconductor device structure includes a first substrate including a first face and a second face opposite the first face. A second substrate is bonded to the first face of the first substrate such that the second face of the first substrate faces away from the second substrate. One or more recesses are arranged in the second face of the first substrate and are configured to compensate for thermal expansion or thermal contraction.

公开(公告)号：US20170225950A1

公开(公告)日：2017-08-10

申请号：US15499381

申请日：2017-04-27

申请人： Continental Automotive Systems, Inc.

发明人： Xiaoyi Ding ,  James Nowicki

IPC分类号： B81C1/00 ,  G01L13/02 ,  G01L19/06 ,  B81B7/00

CPC分类号： B81C1/00888 ,  B81B7/0019 ,  B81B2201/0264 ,  B81C1/00182 ,  B81C2201/019 ,  B81C2203/031 ,  B81C2203/032 ,  G01L13/025 ,  G01L19/0654

摘要： A sensor device is constructed to maintain a high glass strength to avoid the glass failure at low burst pressure, resulting from the sawing defects located in the critical high stress area of the glass pedestal as one of the materials used for construction of the sensor. This is achieved by forming polished recess structures in the critical high stress areas of the sawing street area. The sensor device is also constructed to have a robust bonding with the die attach material by creating a plurality of micro-posts on the mounting surface of the glass pedestal.

公开(公告)号：US20150346712A1

公开(公告)日：2015-12-03

申请号：US14291397

申请日：2014-05-30

申请人： SKYWORKS SOLUTIONS, INC.

发明人： Cesar D. LARA

IPC分类号： G05B19/418 ,  H01L21/67

CPC分类号： H01L21/67092 ,  B23K2101/40 ,  B81C1/00888 ,  B81C99/001 ,  B81C99/004 ,  G05B2219/45031 ,  H01L21/304 ,  H01L21/67253 ,  H01L22/34 ,  H01L2924/1461 ,  Y10T225/30

摘要： Systems and methods for controlling wafer-breaker devices. In some embodiments, a controller for a semiconductor wafer singulation apparatus can be configured to receive an input signal having information about at least one singulation parameter. The controller can be further configured to generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter. The controller can be further configured to disable manual control of the singulation parameter. In some embodiments, such a controller can be implemented, for example, in a control module, in a kit for modifying an existing singulation apparatus, as an integral part of a singulation apparatus, or any combination thereof.

摘要翻译： 用于控制晶片断路器装置的系统和方法。 在一些实施例中，用于半导体晶片单片化装置的控制器可被配置为接收具有关于至少一个单独参数的信息的输入信号。 控制器还可以被配置为基于输入信号产生输出信号，以实现与分割参数相关联的操作。 控制器还可以被配置为禁止手动控制单个参数。 在一些实施例中，这样的控制器可以例如在控制模块中，在用于修改现有的分离设备的套件中，作为分割设备的组成部分或其任何组合来实现。

公开(公告)号：US08836134B2

公开(公告)日：2014-09-16

申请号：US13738082

申请日：2013-01-10

申请人： Po-Shen Lin ,  Chuan-Jin Shiu ,  Bing-Siang Chen ,  Chen-Han Chiang ,  Chien-Hui Chen ,  Hsi-Chien Lin ,  Yen-Shih Ho

发明人： Po-Shen Lin ,  Chuan-Jin Shiu ,  Bing-Siang Chen ,  Chen-Han Chiang ,  Chien-Hui Chen ,  Hsi-Chien Lin ,  Yen-Shih Ho

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/78 ,  B81C1/00888 ,  H01L21/561 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/562 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/1461 ,  H01L2924/16235 ,  H01L2924/00

摘要： A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided.

摘要翻译： 提供一种制造半导体堆叠封装的方法。 在晶片和基板上进行单晶化处理，晶片和晶片被堆叠在其上。 去除切割区域上的晶片的一部分，以在晶片的芯片的边缘上形成应力集中区域。 然后切割晶片和基板，并且迫使应力集中在晶片的芯片的边缘上。 结果，芯片的边缘变形。 因此，防止了应力延伸到芯片的内部。 还提供半导体堆叠封装。

公开(公告)号：US07763525B2

公开(公告)日：2010-07-27

申请号：US11169579

申请日：2005-06-30

申请人： Keisuke Goto ,  Kenichi Yokoyama

发明人： Keisuke Goto ,  Kenichi Yokoyama

IPC分类号： H01L21/00 ,  H01L21/30

CPC分类号： H01L21/78 ,  B81C1/00888 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/00

摘要： A method for positioning a dicing line includes the steps of: bonding an adhesive tape on a semiconductor layer of a wafer; detecting an image of the wafer by an imaging device on the basis of a light transmitted through the wafer; and determining the dicing line of the wafer on the basis of a position of an image of a marker, which is disposed on the semiconductor layer of the wafer. The image of the marker is obtained by image recognition from the detected image of the wafer.

摘要翻译： 用于定影切割线的方法包括以下步骤：将粘合带粘合在晶片的半导体层上; 基于透过晶片的光，通过成像装置检测晶片的图像; 以及基于设置在晶片的半导体层上的标记的图像的位置来确定晶片的切割线。 通过从晶片的检测图像的图像识别获得标记的图像。

公开(公告)号：US20100075482A1

公开(公告)日：2010-03-25

申请号：US12238038

申请日：2008-09-25

申请人： Daryl Ross Koehl ,  Braden Peter D'Andrea

发明人： Daryl Ross Koehl ,  Braden Peter D'Andrea

IPC分类号： H01L21/302 ,  B26F3/00 ,  B26D9/00

CPC分类号： B26F3/002 ,  B81C1/00484 ,  B81C1/00888 ,  B81C99/001 ,  B81C99/004 ,  B81C2203/051 ,  Y10T83/0341 ,  Y10T225/307 ,  Y10T225/321 ,  Y10T225/325 ,  Y10T225/329

摘要： A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

摘要翻译： 一种用于在接合晶片组件中去除多余材料的系统和方法。 该方法包括切割顶部晶片中的多个平行切口，多个切口限定经由突片附接到顶部晶片的另一部分的顶部晶片的段，将楔形断路器条插入到至少一个切口中 所述多个切口对所述断路器杆施加力以使所述突片断裂，以及从所述接合的晶片组件移除所述顶部晶片的所述段，其中在所述移除之后，底部晶片保持未起伏。

公开(公告)号：US07491288B2

公开(公告)日：2009-02-17

申请号：US10968139

申请日：2004-10-20

申请人： Toshikazu Furui ,  Naohisa Matsushita

发明人： Toshikazu Furui ,  Naohisa Matsushita

IPC分类号： B29C65/16 ,  B32B37/18 ,  B32B38/04 ,  B26D3/08 ,  B31B1/25 ,  H01L21/301 ,  B32B38/18 ,  B26D3/10 ,  H01L21/304

CPC分类号： B81C1/00888 ,  B23K26/40 ,  B23K26/50 ,  B23K26/53 ,  B23K26/57 ,  B23K2101/40 ,  B23K2103/50 ,  B32B17/06 ,  C03B33/07 ,  C03B33/091 ,  H01L21/78 ,  Y10T83/0304 ,  Y10T83/0333 ,  Y10T83/0341 ,  Y10T156/1052 ,  Y10T156/1064

摘要： A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.

摘要翻译： 通过切割半导体衬底和玻璃衬底的层压体来制造诸如MEMS器件的器件。 在玻璃基板上形成槽，半导体基板和玻璃基板层叠在一起，使得槽面对半导体基板。 层叠基板从玻璃基板的侧面沿着凹槽照射激光，将层压体切断成元件。

公开(公告)号：US20080132037A1

公开(公告)日：2008-06-05

申请号：US11848423

申请日：2007-08-31

申请人： Toshikazu FURUI

发明人： Toshikazu FURUI

IPC分类号： H01L21/00

CPC分类号： B81C1/00888 ,  B81C2201/053 ,  H01L21/78

摘要： Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.

摘要翻译： 在切割之前，将挥发性保护剂施加到至少其中制造器件的衬底的表面。 然后通过切割分离设备。 切割后，清洁挥发性保护剂的表面，然后蒸发挥发性保护剂。

公开(公告)号：US07306975B2

公开(公告)日：2007-12-11

申请号：US11172975

申请日：2005-07-01

申请人： John Paul Harris, Jr.

发明人： John Paul Harris, Jr.

IPC分类号： H01L21/44

CPC分类号： H01L21/78 ,  B28D5/0011 ,  B28D5/022 ,  B81C1/00888 ,  H01L2924/16235

摘要： The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peripheries of numerous devices arranged on a wafer. Kerfs are also sawn into the opposite side of the wafer approximately opposing the first kerfs. Mechanical stress is applied to the wafer causing controlled breakage of the intervening wafer material, severing each of the devices from its neighbors. A saw blade apparatus of the invention provides enhanced cutting characteristics and is particularly suited for glass-bonded semiconductor wafer device singulation. The saw blade has a diamond disc suitable for high-speed rotation about its axis. The saw blade of the invention also preferably has a radiused cutting edge, and an annular gutter symmetrically disposed about the circumference on each of the opposing planes of the disc.

公开(公告)号：US20040140532A1

公开(公告)日：2004-07-22

申请号：US10348638

申请日：2003-01-22

发明人： Dustin W. Carr ,  Flavio Pardo

IPC分类号： H01L023/544

CPC分类号： H01L21/6836 ,  B81C1/00888 ,  H01L2221/68327

摘要： A tape assembly for use in wafer dicing includes a layer of adhesive dicing tape having a size at least as large as a footprint of a die, and a screening portion which is adhered to the tape. The screening portion is interposed between the layer of tape and the die when the die is adhered to the layer of tape. The screening portion covers an interior portion of the layer of tape. The screening portion is sized and shaped to leave a sufficient portion of the layer of tape underlying a perimeter of the die exposed to adhere the die to the layer of tape.

摘要翻译： 用于晶片切割的带组件包括具有至少与模具的覆盖层一样大的尺寸的粘合剂切割带层和粘附到带上的屏蔽部分。 当模具粘附到胶带层上时，屏蔽部分插入在胶带层和模具之间。 遮蔽部分覆盖胶带层的内部。 筛分部分的尺寸和形状设置成留下在模具的周边下方的足够部分的胶带，该胶片层暴露以使模具粘附到胶带层上。