Abstract:
A heat sink is used to dissipate the heat of a chip module with a first bump and a second bump. The first bump is located centrally on the chip module and the second bump is disposed laterally at a distance from of the first bump, and the heat sink has a contact surface, a first cavity and a second cavity containing the first bump and the second bump respectively.The first cavity and the second cavity not only position tightly the heat sink onto the chip module but also conduct heat efficiently from the chip module to the heat sink and to protect electronic elements disposed on the chip module. The heat-dissipating efficiency of the heat sink is increased, and production costs are reduced as additional elements for clamping the heat sink onto the chip module are made redundant.
Abstract:
A uricase enzyme biosensor and fabrication method thereof. The uricase enzyme biosensor includes a metal oxide semiconductor field effect transistor, a sensing unit including a substrate, a titanium dioxide film formed thereon and a uricase enzyme sensing film formed on the titanium dioxide film, and a conductive wire connecting with the metal oxide semiconductor field effect transistor and the sensing unit. The invention also provides a sensing system and a sensing circuit including the biosensor.