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公开(公告)号：US20240140043A1
公开(公告)日：2024-05-02
申请号：US18498636
申请日：2023-10-31
Applicant: Align Technology, Inc.
Inventor： Michael Christopher Cole , Brett E. Kelly , Bastien Pesenti , Masoumeh Pourali , Paul Hassell , Viswanath Meenakshisundaram , Peter Dorfinger
Abstract: Systems, devices, and methods for additive manufacturing of objects are provided. In some embodiments, a device for supporting an object during an additive manufacturing process includes a build platform having a surface, and a plurality of support structures extending above the surface of the build platform. Each support structure can be configured to couple to a portion of an additively manufactured object. The device can also include a plurality of actuators, each actuator being configured to adjust a position of a corresponding support structure relative to the build platform.
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公开(公告)号：US20240100775A1
公开(公告)日：2024-03-28
申请号：US18472100
申请日：2023-09-21
Applicant: Cubicure GmbH , Align Technology, Inc.
Inventor： Thomas Förster-Romswinckel , Robert Gmeiner , Otmar Martl , Oliver Kesel , Bernhard Busetti , Markus Kury , Michael Christopher Cole , Peter Dorfinger , Shawn Stromenger , Viswanath Meenakshisundaram , Lance Robert Pickens
IPC: B29C64/379 , B29C64/124 , B29C64/223 , B29C64/245 , B29C71/00 , B29C71/02
CPC classification number: B29C64/379 , B29C64/124 , B29C64/223 , B29C64/245 , B29C71/0009 , B29C71/02 , B33Y30/00
Abstract: Systems, methods, and devices for additive manufacturing are provided. In some embodiments, a method includes: coupling a plurality of build platforms to a carrier; forming a plurality of 3D objects on the plurality of build platforms using an additive manufacturing process, where each build platform receives at least one 3D object thereon; removing the plurality of build platforms from the carrier; performing post-processing of the plurality of 3D objects while the 3D objects remain on the respective build platforms; and separating the plurality of 3D objects from the respective build platforms.
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公开(公告)号：US11718019B2
公开(公告)日：2023-08-08
申请号：US17689854
申请日：2022-03-08
Applicant: Align Technology, Inc.
Inventor： Mehdi Mojdeh , Michael Christopher Cole , Peter Dorfinger , Shiva P. Sambu
IPC: B29C64/118 , B29C64/264 , B29C64/307 , B29C64/188 , B29C64/232 , B29C64/245 , B29C64/295 , B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y80/00
CPC classification number: B29C64/118 , B29C64/188 , B29C64/209 , B29C64/232 , B29C64/245 , B29C64/264 , B29C64/295 , B29C64/307 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y80/00
Abstract: A 3D printer comprises a platform, a dispenser and a light source. A heating element heats a material and a nozzle extrudes the heated material onto the platform to form a first layer, having a first shape specified by one or more digital files. The first shape corresponds to a first minimum line width based on a diameter of the nozzle. The light source emits a light beam that is directed onto the first layer according to the one or more digital files to cure a portion of the first layer to create a first cured layer that corresponds to a second shape of a 3D object specified by the one or more digital files. The light beam has a beam diameter that is smaller than the diameter of the nozzle, and the second shape has a second minimum line width that is smaller than the first minimum line width.
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Patent Agency Ranking
公开(公告)号：US20230118997A1
公开(公告)日：2023-04-20
申请号：US17963963
申请日：2022-10-11
Applicant: Align Technology, Inc.
Inventor： Viswanath Meenakshisundaram , Peter Dorfinger , Umesh Upendra Choudhary , Michael Christopher Cole
IPC: B29C64/214 , A61C7/08 , A61C7/10 , B33Y30/00
Abstract: A system includes a build platform configured to support an object that is being formed from layers of resin. The system further includes one or more blades configured to provide the layers of resin to form the object on the build platform. At least a first blade of the one or more blades is configured to vibrate to reduce viscosity of the layers of resin.
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公开(公告)号：US20220184883A1
公开(公告)日：2022-06-16
申请号：US17689852
申请日：2022-03-08
Applicant: Align Technology, Inc.
Inventor： Mehdi Mojdeh , Michael Christopher Cole , Peter Dorfinger , Shiva P. Sambu
IPC: B29C64/118 , B29C64/264 , B29C64/307 , B29C64/188 , B29C64/232 , B29C64/245 , B29C64/295 , B29C64/209
Abstract: A method of three-dimensional (3D) printing includes heating a photo-curable material and extruding the photo-curable material from a nozzle to form a first layer of an object according to a digital file, wherein the first layer has a first shape specified by the digital file, and wherein the first shape has a first minimum line width based on a diameter of the nozzle. The method further includes directing a light beam onto the first layer according to the digital file or an additional digital file to cure a portion of the first layer, wherein the cured portion of the first layer has a second shape, wherein the second shape may comprise features that are smaller than the first shape.
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公开(公告)号：US11318667B2
公开(公告)日：2022-05-03
申请号：US16571029
申请日：2019-09-13
Applicant: Align Technology, Inc.
Inventor： Mehdi Mojdeh , Michael Christopher Cole , Peter Dorfinger , Shiva P. Sambu
IPC: B29C64/118 , B29C64/264 , B29C64/307 , B29C64/188 , B29C64/232 , B29C64/245 , B29C64/295 , B29C64/209 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y80/00
Abstract: A method of three-dimensional (3D) printing includes heating a photo-curable material and extruding the photo-curable material from a nozzle to form a first layer of an object according to a digital file, wherein the first layer has a first shape specified by the digital file, and wherein the first shape has a first minimum line width based on a diameter of the nozzle. The method further includes directing a light beam onto the first layer according to the digital file or an additional digital file to cure a portion of the first layer, wherein the cured portion of the first layer has a second shape, wherein the second shape may comprise features that are smaller than the first shape.
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公开(公告)号：US11109946B2
公开(公告)日：2021-09-07
申请号：US16948670
申请日：2020-09-28
Applicant: ALIGN TECHNOLOGY, INC.
Inventor： Sriram Venkatasanthanam , Ramin Heydarpour , John Y. Morton , Jun Sato , Michael Christopher Cole , Mehdi Mojdeh , Prashanth Vanchy , Natalia Lysaya Powers , Sibel Narin , Jeremy Riley
IPC: A61C7/08 , A61C13/00 , B32B7/06 , B32B7/12 , B32B27/20 , B32B38/00 , B41M5/00 , B44C3/02 , C09D11/101
Abstract: The present disclosure relates to ornamental indicia carrier and method of producing the same. In some embodiments, the ornamental indicia carrier comprises an ultraviolet light (“UV”) cured ink printed on a thin flexible film and combined with an adhesive layer. The ornamental indicia carrier is capable of enduring the conditions inside the mouth for an extended period of time and can be used in conjunction with a dental appliance.
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公开(公告)号：US20190291474A1
公开(公告)日：2019-09-26
申请号：US16439450
申请日：2019-06-12
Applicant: Align Technology, Inc.
Inventor： Michael Christopher Cole
IPC: B41J11/00 , C09D11/322 , C09D11/101 , B41M5/00 , A61C7/08 , B41J3/407
Abstract: Provided herein are methods of obtaining good photocured-ink adhesion to low surface energy materials. The methods have greatly improved adhesion of photocured ink on low surface energy materials, including those that are subjected to high humidity or wet environments. The methods take into account the glass transition temperature (Tg) of the materials and the onset for the glass transition temperature, including ink applied to an exposed surface of the material at an elevated temperature that is close to the Tg of the material. The ink is allowed to sit briefly or soak, such as for more than 1 second, before the ink is cured. The ink may be photocured. Furthermore, the methods do not require solvents or surface treatment, including plasma or corona treatments, to obtain good ink adhesion.
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