公开(公告)号：US10924836B1

公开(公告)日：2021-02-16

申请号：US16101281

申请日：2018-08-10

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Jason C. Zapantis ,  Christopher D. Jones ,  Edwin J. Corona Aparicio ,  Daniel R. Bloom

IPC: H04R1/10

Abstract: An earpiece includes a glass earcup having an outer exposed surface, an inner surface, and an edge extending around the perimeter of the glass earcup. The earpiece further includes an upper enclosure to which the glass earcup is laminated, and a protective coating lining the edge of the glass earcup.

公开(公告)号：US20210029435A1

公开(公告)日：2021-01-28

申请号：US17061098

申请日：2020-10-01

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.