公开(公告)号：US11259107B2

公开(公告)日：2022-02-22

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio ,  Timon A. Wright

IPC: H04R5/04 ,  H04R1/10 ,  H04R5/033 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280794A1

公开(公告)日：2020-09-03

申请号：US16878561

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Mike B. Minerbi ,  Edward Siahaan ,  Benjamin A. Shaffer ,  Eugene A. Whang ,  Miikka O. Tikander ,  Derek W. Wright ,  Jared M. Kole ,  Esge B. Andersen ,  Daniel R. Bloom ,  Edwin J. Corona Aparicio

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11190878B1

公开(公告)日：2021-11-30

申请号：US17023243

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Axit H. Patel ,  Edwin J. Corona Aparicio ,  Daniel R. Bloom ,  Tsu-Hui Lin ,  Yuta Kuboyama ,  Michael B. Minerbi

IPC: H04R5/033 ,  H04R5/04 ,  H04R1/10 ,  H01L31/107 ,  H04R1/02 ,  G01N21/3563

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20200280801A1

公开(公告)日：2020-09-03

申请号：US16878565

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Esge B. Andersen ,  Miikka O. Tikander ,  Jared M. Kole ,  Daniel R. Bloom ,  Onur I. Ilkorur ,  Eugene Antony Whang ,  Christopher S. Erickson ,  Rajesh Anantharaman ,  Edwin J. Corona Aparicio

IPC: H04R5/033 ,  H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280786A1

公开(公告)日：2020-09-03

申请号：US16878556

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11375306B2

公开(公告)日：2022-06-28

申请号：US16878565

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Esge B. Andersen ,  Miikka O. Tikander ,  Jared M. Kole ,  Daniel R. Bloom ,  Onur I. Ilkorur ,  Eugene Antony Whang ,  Christopher S. Erickson ,  Rajesh Anantharaman ,  Edwin J. Corona Aparicio

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11134328B2

公开(公告)日：2021-09-28

申请号：US16878556

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11109135B1

公开(公告)日：2021-08-31

申请号：US17023234

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Edwin J. Corona Aparicio ,  Daniel R. Bloom ,  Jason Joseph LeBlanc

IPC: H04R25/00 ,  H04R1/10

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US10924836B1

公开(公告)日：2021-02-16

申请号：US16101281

申请日：2018-08-10

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Jason C. Zapantis ,  Christopher D. Jones ,  Edwin J. Corona Aparicio ,  Daniel R. Bloom

IPC: H04R1/10

Abstract: An earpiece includes a glass earcup having an outer exposed surface, an inner surface, and an edge extending around the perimeter of the glass earcup. The earpiece further includes an upper enclosure to which the glass earcup is laminated, and a protective coating lining the edge of the glass earcup.