公开(公告)号：US11784673B2

公开(公告)日：2023-10-10

申请号：US17469001

申请日：2021-09-08

申请人： Apple Inc.

发明人： Daniel R. Bloom ,  Chelsea E. Wojeski ,  Edward Siahaan ,  Nathan Morris ,  Ryan S. Haley ,  Tian Shi Li ,  Toni Ristoski

IPC分类号： H04B1/3827

CPC分类号： H04B1/3827

摘要： An electronic device component including a thermoset composite material is described herein. The electronic device component may be a structural component of the housing and define an exterior surface of the housing. The electronic device component may also be transparent to radio-frequency signals.

公开(公告)号：US11190878B1

公开(公告)日：2021-11-30

申请号：US17023243

申请日：2020-09-16

申请人： Apple Inc.

发明人： Axit H. Patel ,  Edwin J. Corona Aparicio ,  Daniel R. Bloom ,  Tsu-Hui Lin ,  Yuta Kuboyama ,  Michael B. Minerbi

IPC分类号： H04R5/033 ,  H04R5/04 ,  H04R1/10 ,  H01L31/107 ,  H04R1/02 ,  G01N21/3563

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20200280801A1

公开(公告)日：2020-09-03

申请号：US16878565

申请日：2020-05-19

申请人： Apple Inc.

发明人： Esge B. Andersen ,  Miikka O. Tikander ,  Jared M. Kole ,  Daniel R. Bloom ,  Onur I. Ilkorur ,  Eugene Antony Whang ,  Christopher S. Erickson ,  Rajesh Anantharaman ,  Edwin J. Corona Aparicio

IPC分类号： H04R5/033 ,  H04R1/10

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20200280786A1

公开(公告)日：2020-09-03

申请号：US16878556

申请日：2020-05-19

申请人： Apple Inc.

发明人： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC分类号： H04R1/10 ,  H04R5/033 ,  H04R5/04

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20190238963A1

公开(公告)日：2019-08-01

申请号：US16362386

申请日：2019-03-22

申请人： Apple Inc.

发明人： Daniel R. Bloom

IPC分类号： H04R1/10 ,  H04R3/04 ,  H04R5/04 ,  H04R5/033

CPC分类号： H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/1091 ,  H04R3/04 ,  H04R5/033 ,  H04R5/0335 ,  H04R5/04

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20190222913A1

公开(公告)日：2019-07-18

申请号：US16362399

申请日：2019-03-22

申请人： Apple Inc.

发明人： Michael E. Leclerc ,  Brett W. Degner ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniel R. Bloom ,  Daniele de Iuliis ,  Christopher J. Stringer ,  Sung-Ho Tan ,  Markus Diebel

IPC分类号： H04R1/10

CPC分类号： H04R1/105 ,  H04R1/1008 ,  H04R1/1075

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US12096175B2

公开(公告)日：2024-09-17

申请号：US18212133

申请日：2023-06-20

申请人： APPLE INC.

发明人： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC分类号： H04R25/00 ,  H04R1/10 ,  H04R5/033

CPC分类号： H04R1/1008 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11736847B2

公开(公告)日：2023-08-22

申请号：US17894055

申请日：2022-08-23

申请人： APPLE INC.

发明人： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC分类号： H04R25/00 ,  H04R1/10 ,  H04R5/033

CPC分类号： H04R1/1008 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R5/0335

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20220369015A1

公开(公告)日：2022-11-17

申请号：US17878767

申请日：2022-08-01

申请人： APPLE INC.

发明人： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC分类号： H04R1/10 ,  H04R5/033

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11330354B2

公开(公告)日：2022-05-10

申请号：US17071819

申请日：2020-10-15

申请人： Apple Inc.

发明人： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC分类号： H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

摘要： This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.