Touch substrate and touch display device with disconnected dots

    公开(公告)号:US12242696B2

    公开(公告)日:2025-03-04

    申请号:US18032791

    申请日:2020-11-19

    Abstract: A touch substrate (01) and a touch display device. The touch substrate (01) includes: a base substrate (101); a plurality of first touch electrodes (102) located on the base substrate (101); a plurality of second touch electrodes (103) located on a side, facing away from the base substrate (101), of a layer where the first touch electrodes (102) are located and insulated from the first touch electrodes (102); and a plurality of floating electrodes (104) insulated from the plurality of first touch electrodes (102) and the plurality of second touch electrodes (103), and arranged on the same layer as at least one of the first touch electrodes (102) or the second touch electrodes (103). Each floating electrode (104) has a grid shape, and at least part of the floating electrodes (104) is disconnected at at least part of dots.

    DRIVE BACKBOARD, MANUFACTURING METHOD THEREOF AND BACKLIGHT MODULE

    公开(公告)号:US20220035204A1

    公开(公告)日:2022-02-03

    申请号:US17216793

    申请日:2021-03-30

    Abstract: A drive backboard includes: a first conductive layer including bonding pins and first connecting lines, an insulating layer including first via holes and second via holes, a second conductive layer including connecting electrodes and second connecting lines and a conductive protective layer including first protective structures and second protective structures. The first via hole exposes the bonding pin, one end of a first connecting line electrically connects a bonding pin, and the other end reaches the second via hole. One end of a second connecting line electrically connects a connecting electrode, and the other end electrically connects the first connecting line through the second via hole. The first protective structure covers the bonding pin, and the second protective structure covers the second connecting line formed at the position of the second via hole. The pattern of the conductive protective layer is complementary to the pattern of the insulating layer.

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