公开(公告)号：US20080148971A1

公开(公告)日：2008-06-26

申请号：US11957035

申请日：2007-12-14

Applicant: Chul Ho Kim ,  Jung Jae Lee ,  Tae Young Oh ,  Choon Ho Park

Inventor： Chul Ho Kim ,  Jung Jae Lee ,  Tae Young Oh ,  Choon Ho Park

IPC: B41F5/00

CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

Abstract: A printing device can be fabricated in a large size, and a method of patterning a thin film using the same are disclosed. The printing device includes a printing roller that rolls on a substrate to form a thin film thereon. A plurality of blankets are adhered to the printing roller and coated with an organic liquid for the thin film.

Abstract translation: 可以制造大尺寸的印刷装置，并且公开了使用其形成薄膜的方法。 印刷装置包括在基板上滚动以在其上形成薄膜的印刷辊。 多个毯子粘附到印刷辊上并涂覆有薄膜用有机液体。

公开(公告)号：US07002522B2

公开(公告)日：2006-02-21

申请号：US10893923

申请日：2004-07-20

Applicant: Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

Inventor： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

IPC: H01Q1/24

CPC classification number: H01Q1/2283 ,  H01Q1/22 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

Abstract: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

Abstract translation: 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块，在该介质块中形成有导电图案的主天线装置，使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置，而相邻的单元层叠结构彼此连接，形成沿着Y轴的方向具有弯曲线结构的层叠结构，并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构，以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。

公开(公告)号：US06992633B2

公开(公告)日：2006-01-31

申请号：US10859145

申请日：2004-06-03

Applicant: Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Jeong Sik Seo ,  Il Hwan Park

Inventor： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Jeong Sik Seo ,  Il Hwan Park

IPC: H01Q1/24

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q5/385

Abstract: Disclosed herein is a multi-layered chip antenna using double coupling feeding. The multi-layered chip antenna comprises a first feeding radiation element including a first feeding electrode connected at one side of the first feeding electrode to a feeding line and connected at the other side thereof to a ground surface while being formed on a first plane in a predetermined direction, the first feeding radiation element being connected to the first feeding electrode so that the first feeding radiation element has a spatial meander line structure, a second feeding radiation element connected to a portion of the first feeding electrode on a second plane parallel to the first plane such that the second feeding radiation element has a planar meander line structure, a second feeding electrode connected to a portion of the first feeding electrode on a third plane parallel to the first plane, a first parasitic radiation element electrically coupled to the second feeding electrode, and a second parasitic radiation element electrically coupled to the second feeding electrode and comprising a plurality of parasitic patterns.

Abstract translation: 这里公开了一种使用双重耦合馈电的多层芯片天线。 多层芯片天线包括第一馈电辐射元件，第一馈电辐射元件包括在第一馈电电极的一侧连接到馈电线的第一馈电电极，并且在第一馈电电极的另一侧连接到地表面，同时形成在第一平面上 所述第一馈电辐射元件连接到所述第一馈电电极，使得所述第一馈电辐射元件具有空间曲折线结构，第二馈电辐射元件在平行于所述第一馈电电极的第二平面上连接到所述第一馈电电极的一部分 第一平面，使得第二馈电辐射元件具有平面曲折线结构，在平行于第一平面的第三平面上连接到第一馈电电极的一部分的第二馈电电极，与第二馈电电耦合的第一寄生辐射元件 电极，以及电耦合到第二馈电电极的第二寄生辐射元件 并且包括多个寄生图案。

公开(公告)号：US20050259012A1

公开(公告)日：2005-11-24

申请号：US10893923

申请日：2004-07-20

Applicant: Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Seo

Inventor： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Seo

IPC: H01Q9/42 ,  H01Q20060101 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q5/00 ,  H01Q11/08 ,  H01Q13/08 ,  H01Q21/00 ,  H01Q21/30

CPC classification number: H01Q1/2283 ,  H01Q1/22 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

Abstract: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

Abstract translation: 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块，在该介质块中形成有导电图案的主天线装置，使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置，而相邻的单元层叠结构彼此连接，形成沿着Y轴的方向具有弯曲线结构的层叠结构，并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构，以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。