公开(公告)号：US08159400B2

公开(公告)日：2012-04-17

申请号：US12170999

申请日：2008-07-10

申请人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

发明人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

IPC分类号： H01Q1/24 ,  H01Q1/38

CPC分类号： H01Q1/38 ,  H01Q9/0407

摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.

摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。

公开(公告)号：US20080129604A1

公开(公告)日：2008-06-05

申请号：US11944573

申请日：2007-11-23

申请人： Ki Won CHANG ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

发明人： Ki Won CHANG ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

IPC分类号： H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q9/42 ,  H05K1/0243 ,  H05K2201/10636 ,  Y02P70/611

摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.

摘要翻译： 提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案 将一端连接到接地部分，以便用于调谐芯片天线的频率特性。

公开(公告)号：US20080122713A1

公开(公告)日：2008-05-29

申请号：US11944571

申请日：2007-11-23

申请人： Ki Won CHANG ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

发明人： Ki Won CHANG ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

IPC分类号： H01Q9/00

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q9/42 ,  H05K1/0243 ,  H05K2201/10636 ,  Y02P70/611

摘要： There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.

摘要翻译： 提供了一种印刷电路板，包括：设置在其一个表面上的芯片天线的安装区域和形成在与印刷电路板的一个表面相对的表面上的调谐接地图案，以使其一端连接到接地部分 用于调谐芯片天线的频率特性。

公开(公告)号：US20120147474A1

公开(公告)日：2012-06-14

申请号：US13324412

申请日：2011-12-13

申请人： Jeong-Sik Seo

发明人： Jeong-Sik Seo

IPC分类号： G02B27/12

CPC分类号： G02B27/10 ,  G02B3/005 ,  G02B3/0056 ,  G02B3/0062 ,  G02B27/2214

摘要： A lens sheet for both a microlens and a lenticular lens includes a first lenticular lens layer having semicircular convex lenses which are arranged in parallel; a refraction control adhesive layer formed under the first lenticular lens layer; a second lenticular lens layer formed under the refraction control adhesive layer and having semicircular convex lenses which are arranged in parallel; a focal distance layer formed under the second lenticular lens layer; and a three-dimensional layer formed under the focal distance layer, wherein an extension direction of the semicircular convex lenses arranged in the first lenticular lens layer and an extension direction of the semicircular convex lenses arranged in the second lenticular lens layer are crossed with each other.

摘要翻译： 用于微透镜和双凸透镜的透镜片包括具有并联布置的半圆形凸透镜的第一双凸透镜层; 形成在第一双凸透镜层下面的折射控制粘合剂层; 第二双凸透镜层，形成在折射控制粘合剂层下方并且具有平行布置的半圆形凸透镜; 形成在第二双凸透镜层下面的焦距层; 以及形成在焦距层下方的三维层，其中配置在第一双凸透镜层中的半圆形凸透镜的延伸方向和布置在第二柱状透镜层中的半圆形凸透镜的延伸方向相互交叉 。

公开(公告)号：US08111194B2

公开(公告)日：2012-02-07

申请号：US11944573

申请日：2007-11-23

申请人： Ki Won Chang ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

发明人： Ki Won Chang ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

IPC分类号： H01Q1/36 ,  H01Q1/48

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q9/42 ,  H05K1/0243 ,  H05K2201/10636 ,  Y02P70/611

摘要： There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.

摘要翻译： 提供了一种移动通信终端，包括：芯片天线和其一个表面上安装有芯片天线的印刷电路板，印刷电路板包括形成在与印刷电路板的一个表面相对的表面上的调谐接地图案 将一端连接到接地部分，以便用于调谐芯片天线的频率特性。

公开(公告)号：US07557760B2

公开(公告)日：2009-07-07

申请号：US11797536

申请日：2007-05-04

申请人： Ki Won Chang ,  Duk Woo Lee ,  Jeong Sik Seo

发明人： Ki Won Chang ,  Duk Woo Lee ,  Jeong Sik Seo

IPC分类号： H01Q1/24

CPC分类号： H01Q1/38 ,  H01Q1/243 ,  H01Q9/30 ,  H01Q9/42

摘要： An inverted-F antenna and a mobile communication terminal using the same. The antenna includes a flexible board and a radiation plate formed on the flexible board. The antenna further includes a signal line having a first end formed on the flexible board and connected to the radiation plate and a second end extending from the first end and provided as a connecting terminal for feeding and grounding. The mobile communication terminal includes an RF board, a ground plate formed on the RF board, a feed line formed on the RF board for supplying a signal, and the inverted-F antenna as described above.

摘要翻译： 倒F天线和使用该天线的移动通信终端。 天线包括柔性板和形成在柔性板上的辐射板。 该天线还包括信号线，该信号线具有形成在柔性基板上并连接到辐射板的第一端和从第一端延伸的第二端，并且设置为用于馈电和接地的连接端子。 移动通信终端包括RF板，形成在RF板上的接地板，形成在用于提供信号的RF板上的馈线和如上所述的倒F天线。

公开(公告)号：US08503083B2

公开(公告)日：2013-08-06

申请号：US13324412

申请日：2011-12-13

申请人： Jeong Sik Seo

发明人： Jeong Sik Seo

IPC分类号： G02B27/10

CPC分类号： G02B27/10 ,  G02B3/005 ,  G02B3/0056 ,  G02B3/0062 ,  G02B27/2214

摘要： A lens sheet for both a microlens and a lenticular lens includes a first lenticular lens layer having semicircular convex lenses which are arranged in parallel; a refraction control adhesive layer formed under the first lenticular lens layer; a second lenticular lens layer formed under the refraction control adhesive layer and having semicircular convex lenses which are arranged in parallel; a focal distance layer formed under the second lenticular lens layer; and a three-dimensional layer formed under the focal distance layer, wherein an extension direction of the semicircular convex lenses arranged in the first lenticular lens layer and an extension direction of the semicircular convex lenses arranged in the second lenticular lens layer are crossed with each other.

摘要翻译： 用于微透镜和双凸透镜的透镜片包括具有并联布置的半圆形凸透镜的第一双凸透镜层; 形成在第一双凸透镜层下面的折射控制粘合剂层; 第二双凸透镜层，形成在折射控制粘合剂层下方并且具有平行布置的半圆形凸透镜; 形成在第二双凸透镜层下面的焦距层; 以及形成在焦距层下方的三维层，其中配置在第一双凸透镜层中的半圆形凸透镜的延伸方向和布置在第二柱状透镜层中的半圆形凸透镜的延伸方向相互交叉 。

公开(公告)号：US20090015486A1

公开(公告)日：2009-01-15

申请号：US12170999

申请日：2008-07-10

申请人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

发明人： Chang Mok Han ,  Ki Won Chang ,  Duk Woo Lee ,  Dae Kyu Lee ,  Jeong Sik Seo ,  Hyun Do Park

IPC分类号： H01Q9/04

CPC分类号： H01Q1/38 ,  H01Q9/0407

摘要： There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.

摘要翻译： 提供了具有芯片天线的芯片天线和移动电信终端。 芯片天线包括：具有相对的顶表面和底表面的介质块和连接顶表面和底表面的多个侧表面; 形成在介质块的至少一个表面上并连接到外部馈电部分的第一导电图案; 形成在所述介电块的至少一个表面上以连接到所述第一导电图案并且具有连接到外部接地部分的一端的第二导电图案; 以及形成在所述介质块的至少一个表面上并且与所述第一和第二导电图案间隔开以分别电容耦合到所述第一和第二导电图案的第三导电图案，所述第三导电图案具有下端 连接到外部接地部分。

公开(公告)号：US08054227B2

公开(公告)日：2011-11-08

申请号：US11944575

申请日：2007-11-23

申请人： Ki Won Chang ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

发明人： Ki Won Chang ,  Jeong Sik Seo ,  Hyun Do Park ,  Jae Suk Sung

IPC分类号： H01Q1/38

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q9/42 ,  H05K1/0243 ,  H05K2201/10636 ,  Y02P70/611

摘要： There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.

摘要翻译： 提供了一种芯片天线，包括：介质块; 形成在介质块的至少一个表面上以连接到外部馈电部分的第一导电图案; 第二导电图案，其间隔一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案以用作散热器，第二导电图案的一端连接到外部接地部分; 以及第三导电图案，其以一定距离与第一导电图案间隔开，以便电容耦合到第一导电图案，以使得天线的阻抗匹配，第三导电图案的一端连接到外部接地部分。

公开(公告)号：US07002522B2

公开(公告)日：2006-02-21

申请号：US10893923

申请日：2004-07-20

申请人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

发明人： Hyun Hak Kim ,  Chul Ho Kim ,  Gi Tae Do ,  Il Hwan Park ,  Jeong Sik Seo

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/362 ,  H01Q1/38 ,  H01Q21/30

摘要： Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.

摘要翻译： 这里公开了一种用于陆地DMB的芯片天线。 芯片天线包括介质块，在该介质块中形成有导电图案的主天线装置，使得在XZ平面中具有在Z轴方向上具有曲折线结构的导电图案的多个单元叠层结构是 沿着Y轴的方向布置，而相邻的单元层叠结构彼此连接，形成沿着Y轴的方向具有弯曲线结构的层叠结构，并且多个层压结构沿着 X轴和相邻的层叠结构在X轴的方向上彼此连接以具有曲折线结构，以及形成在主天线装置中的上或下介电层处的T形辅助天线装置。