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公开(公告)号:US08167445B2
公开(公告)日:2012-05-01
申请号:US12542923
申请日:2009-08-18
申请人: Young-Keun Lee , Gi-Cherl Kim , Byung-Choon Yang , Si-Joon Song , Young-Min Park
发明人: Young-Keun Lee , Gi-Cherl Kim , Byung-Choon Yang , Si-Joon Song , Young-Min Park
CPC分类号: G02F1/133603 , G02F1/133608 , G02F1/133611
摘要: A backlight assembly includes a light source assembly including a plurality of light source blocks arranged in a first direction, each light source block including a substrate including a reflecting surface and a plurality of point light sources arranged on the substrate, a lower housing accommodating the light source assembly, and a substrate fixing portion disposed at a boundary between adjacent substrates and fixing the light source assembly to the lower housing. The substrate fixing portion includes a head extending overlapping the boundary between the adjacent substrates of the light source blocks and pressing the substrates towards the lower housing, and an engaging protrusion protruding from the head and fixed to the lower housing.
摘要翻译: 背光组件包括:光源组件,其包括沿第一方向布置的多个光源块,每个光源块包括基板,该基板包括布置在基板上的反射表面和多个点光源;容纳光的下壳体 源组件和设置在相邻基板之间的边界处的基板固定部分,并将光源组件固定到下壳体。 基板固定部包括与光源块的相邻基板之间的边界重叠的头部,并且朝向下部壳体按压基板,以及从头部突出并固定到下部壳体的卡合突起。
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公开(公告)号:US07990360B2
公开(公告)日:2011-08-02
申请号:US12115303
申请日:2008-05-05
申请人: Si-Joon Song , Eun-Chae Jeon , Gi-Cherl Kim , Young-Keun Lee
发明人: Si-Joon Song , Eun-Chae Jeon , Gi-Cherl Kim , Young-Keun Lee
IPC分类号: G09G3/36
CPC分类号: G09G3/3413 , G09G3/342 , G09G2320/0242 , G09G2320/041 , G09G2320/0626 , G09G2330/021
摘要: A backlight assembly a plurality of first light-emitting chips for emitting light and a thermistor for indicating the temperature of the first light-emitting chips. The first light-emitting chips emit first color light and are connected in series to each other. The thermistor may be connected in series to the first light-emitting chips and has an electrical resistance that decreases with an increase of its temperature. The light amount emitted by the first light-emitting chips is controlled by pulse width modulating the current driving the first light-emitting chips based on the temperature (resistance) of the thermistor and based on received image data. Thus, a decrease in brightness due to temperature variation may be compensated for while performing color dimming.
摘要翻译: 背光组件,用于发光的多个第一发光芯片和用于指示第一发光芯片的温度的热敏电阻。 第一发光芯片发射第一色光并且彼此串联连接。 热敏电阻可以与第一发光芯片串联连接,并且其电阻随温度的升高而降低。 通过对基于热敏电阻的温度(电阻)驱动第一发光芯片的电流进行脉冲宽度调制,并根据接收到的图像数据来控制由第一发光芯片发出的光量。 因此,在进行颜色调光的同时可以补偿因温度变化引起的亮度的降低。
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公开(公告)号:USD639766S1
公开(公告)日:2011-06-14
申请号:US29371054
申请日:2010-09-30
申请人: Woo-Seung Han , Young-Keun Lee
设计人: Woo-Seung Han , Young-Keun Lee
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公开(公告)号:USD629776S1
公开(公告)日:2010-12-28
申请号:US29352292
申请日:2009-12-18
申请人: Kyung-Jin Lee , Nam-Mi Kim , Young-Keun Lee
设计人: Kyung-Jin Lee , Nam-Mi Kim , Young-Keun Lee
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公开(公告)号:USD621378S1
公开(公告)日:2010-08-10
申请号:US29343013
申请日:2009-09-04
申请人: Tae-Ho Kim , Young-Keun Lee
设计人: Tae-Ho Kim , Young-Keun Lee
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公开(公告)号:USD619984S1
公开(公告)日:2010-07-20
申请号:US29342483
申请日:2009-08-26
申请人: Woo-Seung Han , Young-Keun Lee , Chang-Hwan Hwang
设计人: Woo-Seung Han , Young-Keun Lee , Chang-Hwan Hwang
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公开(公告)号:USD619556S1
公开(公告)日:2010-07-13
申请号:US29342482
申请日:2009-08-26
申请人: Woo-Seung Han , Young-Keun Lee , Chang-Hwan Hwang
设计人: Woo-Seung Han , Young-Keun Lee , Chang-Hwan Hwang
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公开(公告)号:USD616857S1
公开(公告)日:2010-06-01
申请号:US29340832
申请日:2009-07-27
申请人: Tae-Ho Kim , Young-Keun Lee , Chang-Hwan Hwang
设计人: Tae-Ho Kim , Young-Keun Lee , Chang-Hwan Hwang
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公开(公告)号:USD616856S1
公开(公告)日:2010-06-01
申请号:US29340829
申请日:2009-07-27
申请人: Bong-Kyu Song , Young-Keun Lee , Chang-Hwan Hwang
设计人: Bong-Kyu Song , Young-Keun Lee , Chang-Hwan Hwang
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公开(公告)号:USD615955S1
公开(公告)日:2010-05-18
申请号:US29342480
申请日:2009-08-26
申请人: Jong-Hoon Oh , Young-Keun Lee
设计人: Jong-Hoon Oh , Young-Keun Lee
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