公开(公告)号：US20180321521A1

公开(公告)日：2018-11-08

申请号：US16036409

申请日：2018-07-16

Applicant: Luxtera, Inc.

Inventor： Ali Ayazi ,  Gianlorenzo Masini ,  Subal Sahni ,  Attila Mekis ,  Thierry Pinguet

IPC: G02F1/025 ,  G02F1/225

CPC classification number: G02F1/025 ,  G02F1/2257 ,  G02F2001/212 ,  G02F2201/06 ,  G02F2202/105

Abstract: Methods and systems for a low-parasitic silicon high-speed phase modulator are disclosed and may include fabricating an optical phase modulator that comprises a PN junction waveguide formed in a silicon layer, wherein the silicon layer may be on an oxide layer and the oxide layer may be on a silicon substrate. The PN junction waveguide may have p-doped and n-doped regions on opposite sides along a length of the PN junction waveguide, and portions of the p-doped and n-doped regions may be removed. Contacts may be formed on remaining portions of the p-doped and n-doped regions. Portions of the p-doped and n-doped regions may be removed symmetrically about the PN junction waveguide. Portions of the p-doped and n-doped regions may be removed in a staggered fashion along the length of the PN junction waveguide. Etch transition features may be removed along the p-doped and n-doped regions.

公开(公告)号：US20180241517A1

公开(公告)日：2018-08-23

申请号：US15962829

申请日：2018-04-25

Applicant: Luxtera, Inc.

Inventor： Steffen Gloeckner ,  Subal Sahni ,  Joseph Balardeta ,  Simon Pang ,  Stefan Barabas ,  Scott Denton

IPC: H04L1/24 ,  H04B10/40 ,  H04B10/077 ,  H04B10/80

CPC classification number: H04L1/243 ,  H04B10/0779 ,  H04B10/40 ,  H04B10/801 ,  H04L1/244

Abstract: Methods and systems for an optoelectronic built-in self-test (BIST) system for silicon photonics optical transceivers are disclosed and may include, in an optoelectronic transceiver having a transmit (Tx) path and a receive (Rx) path, where the Rx path includes a main Rx path and a BIST loopback path: generating a pseudo-random bit sequence (PRBS) signal, generating an optical signal in the Tx path by applying the PRBS signal to a modulator, communicating the optical signal to the BIST loopback path and converting to an electrical signal utilizing a photodetector, the photodetector being a replica of a photodetector in the main Rx path, and assessing the performance of the Tx and Rx paths by extracting a PRBS signal from the electrical signal. The transceiver may be a single complementary-metal oxide semiconductor (CMOS) die or in two CMOS die, where a first comprises electronic devices and a second comprises optical devices.

公开(公告)号：US09960888B2

公开(公告)日：2018-05-01

申请号：US14752729

申请日：2015-06-26

Applicant: Luxtera, Inc.

Inventor： Steffen Gloeckner ,  Subal Sahni ,  Joseph Balardeta ,  Simon Pang ,  Scott Denton

IPC: H04B17/00 ,  H04L1/24 ,  H04B10/40 ,  H04B10/077 ,  H04B10/80

CPC classification number: H04L1/243 ,  H04B10/0779 ,  H04B10/40 ,  H04B10/801 ,  H04L1/244

Abstract: Methods and systems for an optoelectronic built-in self-test (BIST) system for silicon photonics optical transceivers are disclosed and may include, in an optoelectronic transceiver having a transmit (Tx) path and a receive (Rx) path, where the Rx path includes a main Rx path and a BIST loopback path: generating a pseudo-random bit sequence (PRBS) signal, generating an optical signal in the Tx path by applying the PRBS signal to a modulator, communicating the optical signal to the BIST loopback path and converting to an electrical signal utilizing a photodetector, the photodetector being a replica of a photodetector in the main Rx path, and assessing the performance of the Tx and Rx paths by extracting a PRBS signal from the electrical signal. The transceiver may be a single complementary-metal oxide semiconductor (CMOS) die or in two CMOS die, where a first comprises electronic devices and a second comprises optical devices.

公开(公告)号：US20170329080A1

公开(公告)日：2017-11-16

申请号：US15592774

申请日：2017-05-11

Applicant: Luxtera, Inc.

Inventor： Subal Sahni ,  Gianlorenzo Masini ,  Attila Mekis

IPC: G02B6/122 ,  G02B6/27 ,  G02B6/124 ,  G02B6/126 ,  G02B6/125 ,  H04B10/69 ,  G02B6/42 ,  H04B10/25 ,  G02B6/12

CPC classification number: G02B6/122 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/125 ,  G02B6/126 ,  G02B6/2773 ,  G02B6/4215 ,  G02B6/4286 ,  G02B2006/12123 ,  H04B10/25 ,  H04B10/40 ,  H04B10/691 ,  H04B10/801

Abstract: Methods and systems for integrated multi-port waveguide photodetectors are disclosed and may include an optical receiver on a chip, where the optical receiver comprises a multi-port waveguide photodetector having three or more input ports. The optical receiver may be operable to receive optical signals via one or more grating couplers, couple optical signals to the photodetector via optical waveguides in the chip, and generate an output electrical signal based on the coupled optical signals using the photodetector. The photodetector may include four ports coupled to two PSGCs. The optical signals may be coupled to the photodetector via S-bends and/or tapers at ends of the optical waveguides. A width of the photodetector on sides that are coupled to the optical waveguides may be wider than a width of the optical waveguides coupled to the sides. Optical signals may be mixed with local oscillator signals using the multi-port waveguide photodetector.

公开(公告)号：US09746626B2

公开(公告)日：2017-08-29

申请号：US15205400

申请日：2016-07-08

Applicant: Luxtera, Inc.

Inventor： Michael Mack ,  Subal Sahni ,  Steffen Gloeckner

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/34 ,  H04B10/079 ,  H04B10/25

CPC classification number: G02B6/4286 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4206 ,  G02B6/4214 ,  H04B10/07955 ,  H04B10/25

Abstract: Methods and systems for optical power monitoring of a light source assembly coupled to a silicon photonically-enabled integrated circuit (chip) are disclosed and may include, in a system comprising an optical source assembly coupled to the chip: emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser, directing the primary beam to an optical coupler in the chip, directing the secondary beam to a surface-illuminated photodiode in the chip, and monitoring an output power of the laser utilizing an output signal from the photodiode. The primary beam may comprise an optical source for a photonics transceiver in the chip. The focused primary beam and the secondary beam may be directed to the chip using reflectors in a lid of the optical source assembly.