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公开(公告)号：US20240345318A1
公开(公告)日：2024-10-17
申请号：US18502263
申请日：2023-11-06
Applicant: Quantum Network Technologies, Inc.
Inventor： Dirk Robert ENGLUND , Brendan John SHIELDS
CPC classification number: G02B6/1228 , B82Y10/00 , H04B10/70
Abstract: A method for interacting with quantum states over respective time intervals comprises: providing, from at least one optical fiber interface, a fiber-coupled optical mode that controls optical coupling to and/or from an optical fiber, where at least a portion of the optical fiber extends outside of an interior of a housing comprising the at least one optical fiber interface; providing a quantum state from each quantum state emission element (QSEE) housed on or inside the housing; providing, from each of multiple portions of one or more directional structures, a preferential direction for an associated element-coupled optical mode that controls optical coupling to and from a different respective subset of one or more of the QSEEs; and scanning a scanning structure housed on or inside the housing to change an overlap between the fiber-coupled optical mode and a different respective one of the element-coupled optical modes over each time interval.
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公开(公告)号：US12117648B2
公开(公告)日：2024-10-15
申请号：US17680267
申请日：2022-02-24
Inventor： Weihua Guo , Xiangyang Dai , Qiaoyin Lu
CPC classification number: G02B6/13 , G02B6/1228 , H05K1/144 , H05K3/368 , H05K2201/041 , Y10T29/4913
Abstract: A hybrid integration method includes: assembling a motherboard chip, assembling a daughterboard chip, and assembling an integrated chip. The motherboard chip includes a motherboard chip body, a first metal region, a first vertical support assembly, and a first waveguide region arranged on the motherboard chip body, and the first waveguide region includes a first conventional waveguide region and a first coupling waveguide region used for vertical coupling which are fixedly connected to each other; the daughterboard chip includes a daughterboard chip body, a second metal region, a second vertical support assembly and a second waveguide region arranged on the daughterboard chip body, and the second waveguide region includes a second conventional waveguide region and a second coupling waveguide region used for vertical coupling which are fixedly connected to each other.
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公开(公告)号：US12092868B2
公开(公告)日：2024-09-17
申请号：US17835513
申请日：2022-06-08
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian
CPC classification number: G02B6/1228 , G02B6/13 , G02B2006/12061
Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.
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公开(公告)号：US20240255699A1
公开(公告)日：2024-08-01
申请号：US18393392
申请日：2023-12-21
Applicant: The Regents of the University of California , Massachusetts Institute of Technology , National Technology & Engineering Solutions of Sandia, LLC
Inventor： Daniel J. Blumenthal , Matt Eichenfield , Dirk Englund , Mikkel Heuck
IPC: G02B6/122
CPC classification number: G02B6/1228
Abstract: Systems and methods for hybrid integration of ultra-low loss waveguide photonic circuits with various efficient on-chip elements are described. The photonic circuits can integrate various elements including (but not limited to): gain, modulation, detection, and nonlinear optical elements. The integrated photonic chips can be manufactured in a flexible, reconfigurable, 3D heterogeneous platform. The integrated photonic chips can cover wavelength ranges from the visible wavelength to infrared wavelength.
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公开(公告)号：US20240241315A1
公开(公告)日：2024-07-18
申请号：US18096125
申请日：2023-01-12
Applicant: Cisco Technology, Inc.
Inventor： Jean-Luc Joseph Tambasco
CPC classification number: G02B6/126 , G02B6/1228 , G02B6/2773 , G02B2006/1209
Abstract: A device and method are provided. The device includes a bus waveguide having a longitudinal axis, a lower waveguide disposed on a first side of the bus waveguide, and an upper waveguide disposed on a second side of the bus waveguide opposite to the first side of the bus waveguide, wherein the upper waveguide substantially matches a path of the lower waveguide. The method includes receiving a TE1 mode optical signal on a bus waveguide, receiving a TE0 mode optical signal on a lower waveguide disposed below the bus waveguide, mode multiplexing the TE1 mode optical signal and the TE0 mode optical signal without converting the TE0 mode optical signal or the TE1 mode optical signal to another mode, and outputting the TE0 mode optical signal and the TE1 mode optical signal on the bus waveguide.
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Patent Agency Ranking
公开(公告)号：US20240241312A1
公开(公告)日：2024-07-18
申请号：US18097261
申请日：2023-01-15
Applicant: SiLC Technologies, Inc.
Inventor： Mehdi Asghari
CPC classification number: G02B6/1228 , G01S7/4817 , G01S17/89 , G02B2006/12102
Abstract: A semiconductor chip has a photonic integrated circuit with a first waveguide and a second waveguide. an optical bridge is positioned over a first one of the faces of the semiconductor chip. The optical bridge is configured to receive a light signal from the first waveguide and the second waveguide is configured to receive the light signal from the optical bridge. The optical bridge holds an optical device and is configured to direct the light signal along a first optical pathway and along a second optical pathway. The first optical pathway, the optical device, and the second optical pathway are arranged such that the light signal received from the first waveguide travels through the optical bridge along the first optical pathway, then through the optical device, and then through the optical bridge along the second optical pathway before being received at the second waveguide.
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公开(公告)号：US20240230994A9
公开(公告)日：2024-07-11
申请号：US18481526
申请日：2023-10-05
Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
Inventor： Kazuhiro YOSHIDA
IPC: G02B6/122
CPC classification number: G02B6/1228 , G02B2006/12061
Abstract: An optical connection structure includes a first silicon photonic chip having a first lateral surface, a second silicon photonic chip having a second lateral surface that faces the first lateral surface, and an optical waveguide disposed astride a gap between the first silicon photonic chip and the second silicon photonic chip. The first silicon photonic chip includes a first silicon substrate and a first silicon waveguide disposed over the first silicon substrate. The second silicon photonic chip includes a second silicon substrate and a second silicon waveguide disposed over the second silicon substrate. The optical waveguide includes a first cladding filling a space between the first lateral surface and the second lateral surface, a core disposed on the first cladding and covering one end of the first silicon waveguide and one end of the second silicon waveguide, and a cladding covering the core.
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公开(公告)号：US20240230988A9
公开(公告)日：2024-07-11
申请号：US18489419
申请日：2023-10-18
Applicant: Meta Platforms Technologies, LLC
Inventor： Mohit KHURANA , John GOWARD , Rahul AGARWAL , James Ronald BONAR
CPC classification number: G02B6/12004 , G02B6/1223 , G02B6/1228 , G02B2006/12147
Abstract: An edge coupler for coupling a light beam (e.g., a laser beam) into a waveguide comprises a first waveguide section characterized by a first thickness and a first constant width, a second waveguide section physically coupled to the first waveguide section and characterized by the first thickness and a gradually decreasing width, and a third waveguide section partially overlapping with the second waveguide section at an overlap region, the third waveguide section characterized by a gradually increasing width and a second thickness different from (e.g., greater than) the first thickness. In some embodiments, a surface (e.g., the top or bottom surface) of the second waveguide section and a surface (e.g., the top or bottom surface) of the third waveguide section are on a same plane.
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公开(公告)号：US20240222542A1
公开(公告)日：2024-07-04
申请号：US18558464
申请日：2022-05-09
Inventor： Yiding LIN , Zheng YONG , Jason MAK , Wesley SACHER , Joyce POON
IPC: H01L31/107 , G02B6/12 , G02B6/122
CPC classification number: H01L31/107 , G02B6/1228 , G02B2006/12123
Abstract: A photodetector apparatus (100), being configured for detecting light in the visible or infrared spectrum, comprises a substrate (30), a waveguide (20), a detector section (10), a first contact section (50) and a second contact section (52). The substrate (30) has a substrate surface (32) and a cladding layer (40). The waveguide (20) is arranged above the substrate surface (32) in the cladding layer (40) and is adapted for guiding light. The detector section (10) comprises a p-doped region (12, 14) and an ndoped region (16, 18), and the detector section (10′) is arranged for producing charge carriers by the (10) light guided in the waveguide (20). The first contact section (50) is connected to the p-doped region (12, 14) and the second contact section (52) is connected to the n-doped region (16, 18), the first and second contact sections (50, 52) being connectable to a measuring device for measuring an electrical signal based on the charge carriers produced by the light. The waveguide (20) and the detector section (10) are spaced apart by a portion of the cladding layer (40) with a mutual distance such that optical power of the light guided in the waveguide (20) can be gradually transferred from the waveguide (20) to the detector section (10). Furthermore, a method of detecting light in the visible or infrared spectrum is described.
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公开(公告)号：US20240210620A1
公开(公告)日：2024-06-27
申请号：US18087792
申请日：2022-12-22
Applicant: Nokia Solutions and Networks Oy
Inventor： Jiabao Zheng , Alexandre Horth , Ruizhi Shi
IPC: G02B6/122
CPC classification number: G02B6/1228 , G02B2006/1204
Abstract: An optical device comprises a photonic integrated circuit having an optical mode coupler. The optical mode coupler optically couples a first planar optical waveguide having a first optical core at one horizontal plane to a second planar optical waveguide having a second optical core at a different second horizontal plane. The optical mode coupler comprises two or more intermediate optical layers stacked vertically between the horizontal planes of the optical cores, and intermediate optical layer comprises one or more optical rails. The optical mode coupler causes light received from the first planar optical waveguide to excite an optical mode and guide the light of the optical mode such that the optical mode substantially overlaps the first planar optical waveguide and the optical rails of at least two of the intermediate optical layers in a vertical cross-section of the photonic integrated circuit.
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