公开(公告)号：US06826050B2

公开(公告)日：2004-11-30

申请号：US10451144

申请日：2003-06-27

申请人： Masumi Suzuki

发明人： Masumi Suzuki

IPC分类号： H05K720

CPC分类号： H01L23/467 ,  H01L23/367 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a heat receiving part for receiving heat from the outside, a first radiating part, connected to said heat receiving part, which forms a first air channel, and radiates the heat from said heat receiving part using air that passes through the first air channel, and a second radiating part, located apart from said heat receiving part and connected to said first radiating part, said second radiating part forming a second air channel which the air that has passed the first air channel enters, the second air channel being narrower than the first air channel, said second radiating part radiating the heat from said first radiating part.

摘要翻译： 散热器包括用于从外部接收热量的热接收部分，连接到形成第一空气通道的所述热接收部分的第一辐射部分，并且使用穿过第一空气通道的空气从所述热接收部件辐射热量 空气通道和第二辐射部分，其与所述热接收部分分开并连接到所述第一辐射部分，所述第二辐射部分形成已经通过第一空气通道的空气进入的第二空气通道，第二空气通道为 所述第二辐射部分辐射来自所述第一辐射部分的热量。

公开(公告)号：US06507493B2

公开(公告)日：2003-01-14

申请号：US09791777

申请日：2001-02-26

申请人： Akira Ueda ,  Masumi Suzuki ,  Minoru Hirano ,  Toyokazu Hamaguchi ,  Shigeru Hidesawa

发明人： Akira Ueda ,  Masumi Suzuki ,  Minoru Hirano ,  Toyokazu Hamaguchi ,  Shigeru Hidesawa

IPC分类号： H05K720

CPC分类号： G06F1/203 ,  G06F1/20

摘要： The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

公开(公告)号：US5065095A

公开(公告)日：1991-11-12

申请号：US552930

申请日：1990-07-13

申请人： Masumi Suzuki

发明人： Masumi Suzuki

IPC分类号： G01D5/36 ,  G01D5/243 ,  G01D5/244 ,  G01D5/245

CPC分类号： G01D5/243

摘要： A position detecting apparatus detects the position of an object and includes a sensor device which outputs first and second AC detection signals which have a predetermined phase relationship and which correspond to a detected position of the object. An instantaneous value detecting unit detects and outputs instantaneous values of the first and second AC detection signals. A DC component detecting unit processes the instantaneous values to obtain first and second DC components of the first and second AC detection signals, respectively. A position calculating section calculates the position of the object based on a difference between the first DC component and the first AC detection signal, and a difference between the second DC component and the second AC detection signal.

摘要翻译： 位置检测装置检测物体的位置，并且包括传感器装置，该传感器装置输出具有预定相位关系且对应于被检测物体的检测位置的第一和第二AC检测信号。 瞬时值检测单元检测并输出第一和第二AC检测信号的瞬时值。 直流分量检测单元处理瞬时值，以分别获得第一和第二AC检测信号的第一和第二DC分量。 位置计算部分基于第一DC分量和第一AC检测信号之间的差以及第二DC分量和第二AC检测信号之间的差来计算对象的位置。

公开(公告)号：USD279031S

公开(公告)日：1985-05-28

申请号：US445040

申请日：1982-11-29

申请人： Masumi Suzuki

设计人： Masumi Suzuki

公开(公告)号：USD669484S1

公开(公告)日：2012-10-23

申请号：US29371756

申请日：2011-09-02

申请人： Masumi Suzuki

设计人： Masumi Suzuki

公开(公告)号：US20100205354A1

公开(公告)日：2010-08-12

申请号：US12678657

申请日：2008-05-07

申请人： Masumi Suzuki

发明人： Masumi Suzuki

IPC分类号： G06F12/02 ,  G06F12/00

CPC分类号： G06F12/0246 ,  G06F2212/1036 ,  G06F2212/7211

摘要： Provided is a system whose effective endurable number of rewrite times can be drastically improved in a storage device using a flash memory whose rewrite life is restricted. The logical address (LBA) of a sector in which data which is not used as a file system is accumulated is detected. Mapping information on a physical address (PBA) corresponding to the logical address is released. A block in which the mapping information on every logical address and physical address is released out of blocks of the flash memory is deleted and used as an alternative block for wear leveling.

摘要翻译： 提供一种在使用限制了重写寿命的闪速存储器的存储装置中可以显着改善有效持续数量的重写时间的系统。 检测其中未被用作文件系统的数据被累积的扇区​​的逻辑地址（LBA）。 释放与逻辑地址对应的物理地址（PBA）的映射信息。 其中将关于每个逻辑地址和物理地址的映射信息从闪速存储器的块中释放的块被删除并用作用于损耗均衡的替代块。

公开(公告)号：US07721789B2

公开(公告)日：2010-05-25

申请号：US11604750

申请日：2006-11-28

申请人： Akira Ueda ,  Masumi Suzuki

发明人： Akira Ueda ,  Masumi Suzuki

IPC分类号： F28F7/00 ,  F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate; a heat radiator having a configuration of a plurality of horizontally oriented vertically spaced heat radiation plates; and a heat pipe H having a generally U-shaped or V-shaped profile, the middle portion of which is secured to the heat receiving plate; and wherein each end of the heat pipe H passes through the heat radiation plates.

摘要翻译： 为了实现热管型整体式冷却器，确保实现足够的冷却能力，并实现了一种特别低的高度的简单，紧凑和便宜的冷却器，巧妙地使用和结合了热管，提供了一种 热管式冷却器，包括：受热板; 具有多个水平取向的垂直间隔的散热板的构造的散热器; 以及具有大致U形或V形轮廓的热管H，其中间部分固定在热接收板上; 并且其中热管H的每个端部穿过散热板。

公开(公告)号：US07431072B2

公开(公告)日：2008-10-07

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US20070137755A1

公开(公告)日：2007-06-21

申请号：US11636523

申请日：2006-12-11

申请人： Masumi Suzuki

发明人： Masumi Suzuki

IPC分类号： B60C9/00

CPC分类号： B60C9/2204 ,  B60C9/005 ,  B60C2009/2219 ,  B60C2009/2261 ,  Y10T152/10765 ,  Y10T152/10783 ,  Y10T152/10801

摘要： A tire (2) includes a belt (12) provided on a carcass (10) and a band (14) for covering the belt (12). The band (14) includes a full band (36) and a pair of edge bands (38) provided in the vicinity of a shoulder and positioned on an outside in a radial direction of the full band (36). The full band (36) has a first band cord (40) wound spirally in a substantially circumferential direction. The edge band (38) has a second band cord (44) wound spirally in the substantially circumferential direction. A modulus of the second band cord (44) is higher than that of the first band cord (40). In the tire (2), it is preferable that an outer end (50) of the full band (36) should be provided on an outside of an outer end (48) of the belt (12) in an axial direction. An outer end (52) of the edge band (38) is identical to the outer end (48) of the belt (12) or is provided on an inside thereof.

摘要翻译： 轮胎（2）包括设置在胎体（10）上的带（12）和用于覆盖带（12）的带（14）。 所述带（14）包括设置在肩部附近并位于所述全带（36）的径向方向上的外侧的全带（36）和一对边缘带（38）。 全带（36）具有在大致圆周方向上螺旋地卷绕的第一带束线（40）。 边缘带（38）具有在基本圆周方向上螺旋地卷绕的第二带束线（44）。 第二带状帘线（44）的模量高于第一带状帘线（40）的模量。 在轮胎（2）中，优选的是，全带（36）的外端（50）应当沿轴向设置在带（12）的外端（48）的外侧。 边缘带（38）的外端（52）与带（12）的外端（48）相同或者设置在其内侧。

公开(公告)号：US07219721B2

公开(公告)日：2007-05-22

申请号：US10500464

申请日：2002-01-16

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。