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    Semiconductor package
    51.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US10985126B2

    公开(公告)日：2021-04-20

    申请号：US16682084

    申请日：2019-11-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jungho Shim ,  Han Kim ,  Chulkyu Kim

    IPC: H01L23/00 ,  H01L23/538 ,  H01L23/14 ,  H01L23/31 ,  H01L25/18 ,  H01L25/16 ,  H01L21/683 ,  H01L21/56 ,  H01L21/48

    Abstract: A semiconductor package includes a first connection structure having first and second surfaces and including a first redistribution layer, a first semiconductor chip disposed on the first surface and having a first connection pad electrically connected to the first redistribution layer, a second semiconductor chip disposed around the first semiconductor chip on the first surface and having a second connection pad electrically connected to the first redistribution layer, an interconnection bridge disposed on the second surface to be spaced apart from the second surface and connected to the first redistribution layer through a connection member to electrically connect the first and second connection pads to each other, and a second connection structure disposed on the second surface to embed the interconnection bridge and including a second redistribution layer electrically connected to the first redistribution layer.

    Connection system of semiconductor packages
    53.
    发明授权
    Connection system of semiconductor packages 有权

    公开(公告)号：US10453821B2

    公开(公告)日：2019-10-22

    申请号：US15966673

    申请日：2018-04-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yun Tae Lee ,  Han Kim ,  Hyung Joon Kim

    IPC: H01L25/065 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00 ,  H01L25/10

    Abstract: A connection system of semiconductor packages includes: a printed circuit board having a first surface, and a second surface, opposing the first surface; a first semiconductor package disposed on the first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; and a second semiconductor package disposed on the second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures. The first semiconductor package includes an application processor (AP) and a power management integrated circuit (PMIC) disposed side by side, and the second semiconductor package includes a memory.

    Fan-out semiconductor package
    54.
    发明授权
    Fan-out semiconductor package 有权

    公开(公告)号：US10396049B2

    公开(公告)日：2019-08-27

    申请号：US15725179

    申请日：2017-10-04

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Young Min Ban ,  Han Kim ,  Kyung Moon Jung

    IPC: H01L23/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L23/522 ,  H05K1/18

    Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip, wherein the first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pad, the semiconductor chip includes a passivation layer having an opening exposing at least a portion of the connection pad, the redistribution layer of the second interconnection member is connected to the connection pad through a via, and the via covers at least a portion of the passivation layer.

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