摘要:
The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates 12 and 14, each of which includes a metal plate 25 provided on overall outer surface thereof. On each of the metal plates 25, there is arranged a spiral-shaped circulating pipe 24 through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer 16 by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer 16 and the upper Bernoulli-plate and a clearance between the wafer 16 and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.
摘要:
To carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid. A retention member for the object to be processed 18 that retains the object to be processed 17 and a rear shielding plate 15 that prevents the rear surface of the object to be processed from becoming contaminated by excessive fluid flow are mechanically separated. The rear shielding plate 15 is fixed in like manner to a front shielding plate 11, only the retention member for the object to be processed 18 is allowed to rotate making it possible to rigidly connect a supply pipe 22 (that supplies fluid through the rear shielding plate 15) to the rear shielding plate 15. Further, a circulation system is provided that collects fluid which underwent front surface processing in a collection tube 13, circulates that fluid and then supplies it to the rear surface of the object to be processed from a supply pipe.