公开(公告)号：US06401734B1

公开(公告)日：2002-06-11

申请号：US09524744

申请日：2000-03-13

申请人： Fumio Morita ,  Masataka Fujiki ,  Hitoshi Oka ,  Noriyuki Oroku ,  Yuichirou Tanaka

发明人： Fumio Morita ,  Masataka Fujiki ,  Hitoshi Oka ,  Noriyuki Oroku ,  Yuichirou Tanaka

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  B08B3/10 ,  Y10S134/902

摘要： A substrate treating apparatus and method can recover a substrate treating liquid such as a cleaning liquid in an efficient manner and positively avoid occurrences of treatment defects such as formation of cleaning spots, water marks and the like. A fixed upper plate and a fixed lower plate are disposed in opposition to each other so as to define a space therebetween. A substrate such as a semiconductor wafer is inserted into the space between the fixed upper and lower plates, supported there by a support and adapted to be rotated through rotation of the support. A substrate treating medium such as a cleaning liquid is introduced into the space to treat the substrate while the substrate is rotating. The treating medium after having treated the substrate is discharged from the space through a discharge passage which is defined between an outer peripheral surface of the support and an inner surface of a housing which covers the outer peripheral surface of the support. Rotary blades are disposed in the discharge passage and adapted to rotate in accordance with the rotation of the substrate, thereby enhancing discharging of the substrate treating medium from the space through the discharge passage.

摘要翻译： 基板处理装置和方法可以有效地回收诸如清洗液体的基板处理液体，并且可以有效地避免诸如形成清洁点，水痕等的处理缺陷的发生。 固定的上板和固定的下板彼此相对设置，以便在它们之间限定一个空间。 诸如半导体晶片的基板被插入到固定的上板和下板之间的空间中，由支撑件支撑在其上并适于通过支撑件的旋转而旋转。 将衬底处理介质如清洗液体引入到空间中以在衬底旋转的同时处理衬底。 经过处理的基板之后的处理介质经由排出通道排出，该排出通道限定在支撑体的外周面和覆盖支撑体的外周面的壳体的内表面之间。 旋转叶片设置在排出通道中并且适于根据基板的旋转而旋转，从而增强基板处理介质从通过排出通道的空间的排放。

公开(公告)号：US06443168B1

公开(公告)日：2002-09-03

申请号：US09579142

申请日：2000-05-30

申请人： Fumio Morita ,  Masataka Fujiki ,  Hitoshi Oka ,  Noriyuki Oroku ,  Yuichirou Tanaka

发明人： Fumio Morita ,  Masataka Fujiki ,  Hitoshi Oka ,  Noriyuki Oroku ,  Yuichirou Tanaka

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  B08B3/04 ,  Y10S134/902

摘要： The fluid treatment apparatus, as disclosed, comprises upper and lower Bernoulli-plates 12 and 14, each of which includes a metal plate 25 provided on overall outer surface thereof. On each of the metal plates 25, there is arranged a spiral-shaped circulating pipe 24 through which a heating medium or a cooling medium are circulated so as to rapidly heat or cool the upper and lower Bernoulli-plates. During the treatment of a wafer 16 by the apparatus, the upper and lower Bernoulli-plates are disposed in parallel with each other to define a narrow gap therebetween while a clearance between the wafer 16 and the upper Bernoulli-plate and a clearance between the wafer 16 and the lower Bernoulli-plate are kept to be equal to each other. Thus, the present invention can achieve various purpose such as a time saving for the cleaning, reduction of consumption of the cleaning liquid and inhibition of cleaning irregularity.

摘要翻译： 所公开的流体处理装置包括上部和下部伯努利板12和14，每个都包括设置在其整个外表面上的金属板25。 在每个金属板25上，布置有螺旋形循环管24，通过该螺旋形循环管24循环加热介质或冷却介质，以便快速加热或冷却上部和下部伯努利板。 在由设备处理晶片16期间，上部和下部伯努利板彼此平行地设置，以在其间形成窄间隙，同时晶片16和上部伯努利板之间的间隙以及晶片之间的间隙 16和下部伯努利板保持彼此相等。 因此，本发明可以实现各种目的，例如清洁的时间节省，清洁液的消耗减少和清洁不均匀性的抑制。

公开(公告)号：US06539959B1

公开(公告)日：2003-04-01

申请号：US09498355

申请日：2000-02-04

申请人： Noriyuki Ohroku ,  Yuichirou Tanaka ,  Yoichi Takahara ,  Tomonori Saeki ,  Susumu Aiuchi ,  Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

发明人： Noriyuki Ohroku ,  Yuichirou Tanaka ,  Yoichi Takahara ,  Tomonori Saeki ,  Susumu Aiuchi ,  Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

IPC分类号： B08B310

CPC分类号： H01L21/67051 ,  B08B3/04 ,  B08B3/10 ,  G11B23/505 ,  Y10S134/902

摘要： At a time of cleaning a plate-like part such as a wafer or the like while rotating, for the purpose of reducing a contamination, a damage and an unevenness of process of the plate-like part which are caused by an amount of charged electricity of the plate-like part, chuck pins (chuck members) 201 which chuck the plate-like part 1 such as the wafer or the like and upper and lower cleaning plates 101 and 121 which oppose to the plate-like part 1 are constituted by a resin material containing carbon powders, and a desired potential difference is applied to a portion between the plate-like part and the cleaning plates by a voltage control unit 601 which is provided in an outer portion.

摘要翻译： 在旋转时清洁诸如晶片等的板状部件的时候，为了减少由电荷量引起的污染，板状部件的过程的损坏和不均匀性 板状部分夹住板状部分等板状部分1的卡盘销（卡盘部件）201和与板状部分1相对的上下清扫板101和121构成为： 含有碳粉末的树脂材料，并且通过设置在外部的电压控制单元601将期望的电位差施加到板状部分和清洁板之间的部分。

公开(公告)号：US06315836B1

公开(公告)日：2001-11-13

申请号：US09351288

申请日：1999-07-12

申请人： Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

发明人： Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

IPC分类号： B08B300

CPC分类号： H01L21/67017 ,  B08B3/10 ,  B08B11/02 ,  Y10S134/902

摘要： A clean, recirculating and processing method which prevents surface contamination of an object, such as a semiconductor, semi-conductor wafer, glass for LCD or magnetic disk is provided which includes covering the front and rear surfaces of an object to be processed with front and rear shielding plates and allows the object to rotate relative to the front and rear shielding plates. The fluid is supplied between the front surface of the object and the front shielding plate allowing the front surface to be processed. The remaining fluid is collected and recirculated between the rear surface of the object and the rear shielding plate allowing the rear surface of the object to be processed. An apparatus for accomplishing the method is also disclosed.

摘要翻译： 提供一种清洁，再循环和处理方法，其防止诸如半导体，半导体晶片，LCD或磁盘的玻璃的物体的表面污染，其包括用前面和后面的待处理物体的前表面和后表面 后屏蔽板并允许物体相对于前后屏蔽板旋转。 流体被提供在物体的前表面和前屏蔽板之间，从而允许前表面被处理。 剩余的流体被收集并在物体的后表面和后屏蔽板之间再循环，从而允许物体的后表面被处理。 还公开了一种用于实现该方法的装置。

公开(公告)号：US06431190B1

公开(公告)日：2002-08-13

申请号：US09955212

申请日：2001-09-19

申请人： Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

发明人： Hitoshi Oka ,  Fumio Morita ,  Masataka Fujiki ,  Akinobu Yamaoka

IPC分类号： B08B304

CPC分类号： H01L21/67017 ,  B08B3/10 ,  B08B11/02 ,  Y10S134/902

摘要： To carry out very clean and low-cost fluid processing on both the front and rear surfaces of an object to be processed without generating rubbing particles and without leakage of fluid. A retention member for the object to be processed 18 that retains the object to be processed 17 and a rear shielding plate 15 that prevents the rear surface of the object to be processed from becoming contaminated by excessive fluid flow are mechanically separated. The rear shielding plate 15 is fixed in like manner to a front shielding plate 11, only the retention member for the object to be processed 18 is allowed to rotate making it possible to rigidly connect a supply pipe 22 (that supplies fluid through the rear shielding plate 15) to the rear shielding plate 15. Further, a circulation system is provided that collects fluid which underwent front surface processing in a collection tube 13, circulates that fluid and then supplies it to the rear surface of the object to be processed from a supply pipe.

摘要翻译： 在待加工物体的前表面和后表面上进行非常干净且低成本的流体处理，而不会产生摩擦颗粒并且不会泄漏流体。 机械地分离用于保护被处理物体18的保持构件18和防止被处理物的后表面被过度流体流动污染的后挡板15。 后屏蔽板15以与前屏蔽板11相同的方式固定，仅允许被处理物体18的保持构件旋转，从而可以将供给管22（通过后屏蔽 板15）连接到后屏蔽板15.此外，提供一种循环系统，其收集在收集管13中经历前表面处理的流体，使该流体循环，然后将其从一个 供应管道。