公开(公告)号：US4594473A

公开(公告)日：1986-06-10

申请号：US587917

申请日：1984-03-09

申请人： Tatsuo Inoue ,  Mitsuru Kimura

发明人： Tatsuo Inoue ,  Mitsuru Kimura

IPC分类号： H05K3/46 ,  H01B5/14 ,  H01L23/498 ,  H05K3/38 ,  H05K1/09

CPC分类号： H01L23/49866 ,  H01B5/14 ,  H05K3/38 ,  H01L2924/0002 ,  Y10S428/901

摘要： A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold.

摘要翻译： 用于LSI电路的精细布线导体具有良好的粘合性能。 导体由诸如铬或钛的金属膜构成，例如陶瓷衬底，金属膜上的金层和金层上的钯膜。 此外，可以在金属膜和金层之间插入钯层以促进镀金并抑制金属和金的扩散。