EEPROM device having selecting transistors and method fabricating the same
    51.
    发明申请
    EEPROM device having selecting transistors and method fabricating the same 有权
    具有选择晶体管的EEPROM器件及其制造方法

    公开(公告)号:US20060120194A1

    公开(公告)日:2006-06-08

    申请号:US11336751

    申请日:2006-01-20

    IPC分类号: G11C7/00

    摘要: An EEPROM includes a device isolation layer for defining a plurality of active regions, a pair of control gates extending across the active regions and a pair of selection gates patterns that extend across the active regions and are interposed between the control gate patterns. A floating gate pattern is formed on intersection regions where the control gate patterns extend across the active regions. A lower gate pattern is formed on intersection regions where the selection gate patterns extend across the active regions. An inter-gate dielectric pattern is disposed between the control gate pattern and the floating gate pattern and a dummy dielectric pattern is disposed between the selection gate pattern and the lower gate pattern. The dummy dielectric pattern is substantially parallel to the selection gate pattern, and self-aligned with one sidewall of the selection gate pattern to overlap a predetermine width of the selection gate pattern.

    摘要翻译: EEPROM包括用于限定多个有源区的器件隔离层,跨越有源区延伸的一对控制栅极和跨越有源区延伸并插入在控制栅极图案之间的一对选择栅极图案。 浮动栅极图案形成在跨越有源区域的控制栅极图案延伸的交叉区域上。 在选择栅极图案跨越有源区域延伸的交叉区域上形成下部栅极图案。 栅极间电介质图案设置在控制栅极图案和浮置栅极图案之间,并且虚设电介质图案设置在选择栅极图案和下部栅极图案之间。 虚拟介质图案基本上平行于选择栅极图案,并且与选择栅极图案的一个侧壁自对准以重叠选择栅极图案的预定宽度。

    Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same
    52.
    发明申请
    Nonvolatile memory devices with trenched side-wall transistors and method of fabricating the same 有权
    具有沟槽侧壁晶体管的非易失性存储器件及其制造方法

    公开(公告)号:US20060063331A1

    公开(公告)日:2006-03-23

    申请号:US11233857

    申请日:2005-09-23

    IPC分类号: H01L21/336 H01L21/3205

    摘要: A nonvolatile memory device includes a semiconductor substrate, a device isolation layer, a tunnel insulation layer, a floating gate, a buried floating gate, and a control gate. A trench is in the substrate that defines an active region of the substrate adjacent to the trench. A device isolation layer is on the substrate along the trench. A tunnel insulation layer is on the active region of the substrate. A floating gate is on the tunnel insulation layer opposite to the active region of the substrate. A buried floating gate is on the device isolation layer in the trench. An intergate dielectric layer is on and extends across the floating gate and the buried floating gate. A control gate is on the intergate dielectric layer and extends across the floating gate and the buried floating gate.

    摘要翻译: 非易失性存储器件包括半导体衬底,器件隔离层,隧道绝缘层,浮置栅极,埋入浮栅和控制栅极。 衬底中的沟槽限定邻近沟槽的衬底的有源区。 器件隔离层沿着沟槽在衬底上。 隧道绝缘层位于衬底的有源区上。 浮动栅极位于与衬底的有源区相对的隧道绝缘层上。 埋置的浮动栅极位于沟槽中的器件隔离层上。 隔间电介质层在浮栅和埋入浮栅之间并且延伸。 控制栅极位于隔间电介质层上,并跨越浮置栅极和埋入浮栅。

    Non-volatile memory device and method for fabricating the same

    公开(公告)号:US06818510B2

    公开(公告)日:2004-11-16

    申请号:US10704285

    申请日:2003-11-06

    IPC分类号: H01L21336

    CPC分类号: H01L27/11568 H01L27/115

    摘要: A non-volatile memory device and fabrication method thereof are provided. A floating region is formed on an active region on a substrate. Trenches define the active region. The floating region is made of an ONO layer. A gate electrode is formed on the floating region. A mask is formed on the gate electrode. A thermal oxidation is performed to make a sidewall oxide and a trench oxide on the sidewall of the gate electrode and the trench, respectively. As a result, the widths of the gate electrode and the active region become less than the width of the floating region, thereby forming protrusions at ends of the floating region. Isolation regions are formed in the trenches and include the sidewall oxide and the trench oxide. The isolation regions surround the protrusions. As a result, electric field induced on the sidewall of the floating region is decreased. Moreover, the thermal oxidation cures any damage to the sidewalls of the floating region. Accordingly, leakage current can be substantially suppressed at the boundary region between the isolation region and the floating region.