DEVICE FOR THE TREATMENT, PARTICULARLY GALVANIZATION, OF SUBSTRATES
    51.
    发明申请
    DEVICE FOR THE TREATMENT, PARTICULARLY GALVANIZATION, OF SUBSTRATES 有权
    用于处理,特别是基质化的装置

    公开(公告)号:US20080116059A1

    公开(公告)日:2008-05-22

    申请号:US12022452

    申请日:2008-01-30

    申请人: Heinz Kappler

    发明人: Heinz Kappler

    IPC分类号: C25D17/00 C25B9/00

    摘要: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

    摘要翻译: 用于镀锌装置的接触装置包括使辊与连续的刚性外表面接触,所述连续的刚性外表面连接到护套部分。 护套部分设置有比接触辊所在的旋转轴更宽的内部开口。 这允许接触辊在径向方向上移动,其中通过每个径向移动位置中的弹簧获得基本位置的电接触和固定。 当接触辊不均匀时,接触辊的移动性确保接触辊抵靠基板的良好接触。 接触压力可以相对较小。

    Apparatus for the galvanic treatment of articles
    52.
    发明授权
    Apparatus for the galvanic treatment of articles 失效
    用于电镀处理物品的设备

    公开(公告)号:US5326442A

    公开(公告)日:1994-07-05

    申请号:US26488

    申请日:1993-03-04

    申请人: Dieter C. Schmid

    发明人: Dieter C. Schmid

    IPC分类号: C25D17/00 H05K3/24 C25D17/28

    摘要: An electroplating apparatus (11) has a conveying system (19), which passes the printed circuit boards on a horizontal passage path through the treatment chamber (13). They are contacted by tong-like grippers (32), which run upstream of the leading edge (63) of the circuit board and in this area engage thereon from above and below. The gripers (32) are fixed to transverse beams (29), which are guided on both sides by chains (26) and electrically contacted by contact rails (39). Thus, the circuit boards (12) are moved in a horizontal, central path and simultaneously contacted. Alternatively the circuit boards (12) can be conveyed between electrically connected contact roll pairs (21), which are conveyed by an upper and lower conveyor (20a, b) and automatically rotate in order to convey the circuit boards at high speed.

    摘要翻译: 电镀设备(11)具有输送系统(19),该输送系统使经过处理室(13)的水平通道的印刷电路板通过。 它们通过钳形夹持器(32)接触,该夹持器在电路板的前缘(63)的上游延伸,并且在该区域中从上方和下方接合。 夹持器(32)固定到横梁(29)上,横梁(29)在两侧由链条(26)引导并与接触导轨(39)电接触。 因此,电路板(12)在水平的中心路径中移动并同时接触。 或者,可以在电连接的接触辊对(21)之间传送电路板(12),所述电连接的接触辊对(21)由上部和下部传送器(20a,b)输送并自动旋转以便高速地传送电路板。