Abstract:
A method for fabricating a thin film device includes the step of forming a sacrificial layer on a first substrate. A portion other than a region of the sacrificial layer is selectively removed. A material film is formed on the sacrificial layer to be connected to the first substrate via the selectively removed region. The material film portion filled in the selectively removed region is provided as an anchor. A thin film lamination is formed on the material film. The desired thin film device is formed by using a selective etching process. After removing the sacrificial layer, the thin film device floats over the first substrate with being supported by the anchor. A support body is temporarily attached on the thin film lamination. The thin film device is transferred to the support body onto a second substrate.
Abstract:
An electronic paper display device and a method of manufacturing the electronic paper display device are disclosed. The method in accordance with an embodiment of the present invention includes forming a plurality of partition walls on a lower board, in which the partition walls partition the lower board into cells, disposing a display unit in the cell, and attaching an upper board on an upper part of the plurality of partition walls such that the display unit is covered. This method can adjust a distance between display units and the shape of the display units, and the quantity of disposed display units can be made uniform, whereby the visual quality of the display can be improved by removing spots formed on a screen.