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    ELECTRONIC PAPER DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    ELECTRONIC PAPER DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    电子纸显示装置及其制造方法

    公开(公告)号：US20100047528A1

    公开(公告)日：2010-02-25

    申请号：US12544524

    申请日：2009-08-20

    申请人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    发明人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    IPC分类号： B32B3/00 ,  B32B37/00

    CPC分类号： G02F1/167 ,  G02B26/026 ,  G02F2001/1672 ,  Y10T428/24612

    摘要： An electronic paper display device and a method of manufacturing the electronic paper display device are disclosed. The method can include forming a plurality of relievo patterns on a lower board, in which the relievo patterns are formed to be independent and separated from one another, disposing a display unit in between the plurality of relievo patterns, and attaching an upper board on the plurality of relievo patterns such that the display unit is covered. In accordance with an embodiment of the present invention, the method can improve the freedom of disposing the display units by allowing partition walls to form only at areas to fix the display units.

    摘要翻译： 公开了电子纸显示装置和电子纸显示装置的制造方法。 该方法可以包括在下板上形成多个减压图案，其中，所述减震图案被形成为彼此独立且分离，将显示单元设置在所述多个减速图案之间，并且将上板安装在 多个解码图案使得显示单元被覆盖。 根据本发明的一个实施例，该方法可以通过仅在限定显示单元的区域处形成分隔壁而提高布置显示单元的自由度。

    Electronic paper display device and manufacturing method thereof
    2.
    发明授权
    Electronic paper display device and manufacturing method thereof 有权
    电子纸显示装置及其制造方法

    公开(公告)号：US08159741B2

    公开(公告)日：2012-04-17

    申请号：US12544524

    申请日：2009-08-20

    申请人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    发明人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    IPC分类号： G02B26/00 ,  G03G17/04 ,  G09G3/34 ,  G02F1/133

    CPC分类号： G02F1/167 ,  G02B26/026 ,  G02F2001/1672 ,  Y10T428/24612

    摘要： An electronic paper display device and a method of manufacturing the electronic paper display device are disclosed. The method can include forming a plurality of relievo patterns on a lower board, in which the relievo patterns are formed to be independent and separated from one another, disposing a display unit in between the plurality of relievo patterns, and attaching an upper board on the plurality of relievo patterns such that the display unit is covered. In accordance with an embodiment of the present invention, the method can improve the freedom of disposing the display units by allowing partition walls to form only at areas to fix the display units.

    摘要翻译： 公开了电子纸显示装置和电子纸显示装置的制造方法。 该方法可以包括在下板上形成多个减压图案，其中，所述减震图案被形成为彼此独立且分离，将显示单元设置在所述多个减速图案之间，并且将上板安装在 多个解码图案使得显示单元被覆盖。 根据本发明的一个实施例，该方法可以通过仅在限定显示单元的区域处形成分隔壁而提高布置显示单元的自由度。

    ELECTRONIC PAPER DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    ELECTRONIC PAPER DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    电子纸显示装置及其制造方法

    公开(公告)号：US20100033805A1

    公开(公告)日：2010-02-11

    申请号：US12539127

    申请日：2009-08-11

    申请人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    发明人： Hwan-Soo Lee ,  Yongsoo Oh ,  Sang-Moon Lee ,  Jeong-Bok Kwak

    IPC分类号： G02F1/167 ,  H01J9/20

    CPC分类号： G02F1/167

    摘要： An electronic paper display device and a method of manufacturing the electronic paper display device are disclosed. The method in accordance with an embodiment of the present invention includes forming a plurality of partition walls on a lower board, in which the partition walls partition the lower board into cells, disposing a display unit in the cell, and attaching an upper board on an upper part of the plurality of partition walls such that the display unit is covered. This method can adjust a distance between display units and the shape of the display units, and the quantity of disposed display units can be made uniform, whereby the visual quality of the display can be improved by removing spots formed on a screen.

    摘要翻译： 公开了电子纸显示装置和电子纸显示装置的制造方法。 根据本发明的实施例的方法包括在下板上形成多个分隔壁，其中隔壁将下板分隔成单元，将显示单元设置在单元中，并将上板安装在 多个分隔壁的上部，使得显示单元被覆盖。 该方法可以调节显示单元之间的距离和显示单元的形状，并且可以使排列的显示单元的数量均匀，从而可以通过去除屏幕上形成的点来提高显示器的视觉质量。

    Method for manufacturing printed circuit board using imprinting
    5.
    发明申请
    Method for manufacturing printed circuit board using imprinting 有权
    使用印记制造印刷电路板的方法

    公开(公告)号：US20080008824A1

    公开(公告)日：2008-01-10

    申请号：US11819720

    申请日：2007-06-28

    申请人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

    发明人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Senug-Hyun Ra ,  Hyuk-Soo Lee ,  Jeong-Bok Kwak ,  Jung-Woo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee

    IPC分类号： H05K3/46

    CPC分类号： H05K1/09 ,  H05K3/0014 ,  H05K3/107 ,  H05K2201/0329 ,  H05K2203/0108 ,  H05K2203/0796

    摘要： The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.

    摘要翻译： 本发明涉及一种印刷电路板的制造方法，更具体地说，涉及一种印刷电路板的制造方法，其中使用压印法在基板上选择性地标记导电聚合物聚合的氧化剂，并且导电的单体 聚合物以选定的图案填充并聚合，以提供导电聚合物布线图案。 根据如上所述的根据本发明的某些方面的印刷电路板的制造方法，印刷电路板可以被给予更细的布线宽度，以允许高度集成的高效印刷电路板。 因此，可以通过使用压印形成导电聚合物布线的新技术，制造适用于工业，文书和家用电子电子产品的印刷电路板（PCB）或柔性印刷电路板（FPCB）。

    Method for manufacturing printed circuit board
    8.
    发明申请
    Method for manufacturing printed circuit board 审中-公开
    印刷电路板制造方法

    公开(公告)号：US20080012168A1

    公开(公告)日：2008-01-17

    申请号：US11826007

    申请日：2007-07-11

    申请人： Senug-Hyun Ra ,  Myeong-Ho Hong ,  Hyuk-Soo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee ,  Jae-Choon Cho ,  Jung-Woo Lee ,  Jeong-Bok Kwak

    发明人： Senug-Hyun Ra ,  Myeong-Ho Hong ,  Hyuk-Soo Lee ,  Choon-Keun Lee ,  Sang-Moon Lee ,  Jae-Choon Cho ,  Jung-Woo Lee ,  Jeong-Bok Kwak

    IPC分类号： B29C43/20

    CPC分类号： B29C43/021 ,  B29C33/303 ,  B29C2043/025 ,  H05K3/0014 ,  H05K3/005 ,  H05K3/107 ,  H05K2203/0108 ,  H05K2203/167

    摘要： A method for manufacturing printed circuit board is disclosed. With a method for manufacturing a printed circuit board which includes: (a) stacking an insulation substrate, in which a first align hole is perforated, onto a support plate, to one side of which a guide pin is joined, such that the guide pin is inserted into the first align hole, where the first align hole is formed in correspondence with the guide pin, (b) stacking an imprinting mold, in which a second align hole is perforated, onto the support plate, such that the guide pin is inserted into the second hole formed in correspondence with the guide pin, and (c) stacking and pressing a pressing plate onto the support plate, and compressing the insulation substrate and the imprinting mold together, where an intaglio pattern is formed in a surface of the insulation substrate facing the imprinting mold, in correspondence with a circuit pattern, and a raised pattern is formed in a surface of the imprinting mold facing the insulation substrate, in correspondence with the circuit pattern, the installation of expensive aligning equipment is unnecessary in aligning an imprinting mold and an insulation substrate, and it is possible to form the intaglio patterns by imprinting on several insulation substrates at the same time by collectively stacking the several imprinting molds and the insulation substrates and compressing, and to prevent defects caused by the expansion and contraction of the insulation substrate which occur during the forming of the intaglio patterns.

    摘要翻译： 公开了印刷电路板的制造方法。 一种用于制造印刷电路板的方法，包括：（a）将其中穿过第一对准孔的绝缘基板堆叠在支撑板上，导向销的一侧被连接到导向销 插入到第一对准孔中，其中第一对准孔对应于引导销形成，（b）将其中穿过第二对准孔的压印模具堆叠到支撑板上，使得引导销 插入到与引导销对应形成的第二孔中，（c）将压板堆叠并按压到支撑板上，并将绝缘基板和压印模压在一起，在该表面上形成凹版图案 绝缘基板面对压印模具，与电路图形对应，并且凸起图案形成在压印模具的面对绝缘基板的表面中，与电路图案对应， 在对准压印模具和绝缘基板时不需要安装昂贵的对准设备，并且可以通过将多个压印模具和绝缘基板共同堆叠同时压印在几个绝缘基板上来形成凹版图案， 并且防止在形成凹版图案期间发生的绝缘基板的膨胀和收缩引起的缺陷。

    Nitride-based semiconductor substrates having hollow member pattern and methods of fabricating the same
    9.
    发明授权
    Nitride-based semiconductor substrates having hollow member pattern and methods of fabricating the same 有权
    具有中空构件图案的氮化物基半导体衬底及其制造方法

    公开(公告)号：US08698284B2

    公开(公告)日：2014-04-15

    申请号：US13078145

    申请日：2011-04-01

    申请人： Sang-Moon Lee

    发明人： Sang-Moon Lee

    IPC分类号： H01L29/06 ,  H01L29/04 ,  H01L21/00

    CPC分类号： H01L29/0657 ,  H01L21/0237 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/02647 ,  H01L29/2003 ,  H01L33/007 ,  H01S2301/173

    摘要： A nitride-based semiconductor substrate may includes a plurality of hollow member patterns arranged on a substrate, a nitride-based seed layer formed on the substrate between the plurality of hollow member patterns, and a nitride-based buffer layer on the nitride-based seed layer so as to cover the plurality of hollow member patterns, wherein the plurality of hollow member patterns contact the substrate in a first direction and both ends of each of the plurality of hollow member patterns are open in the first direction.

    摘要翻译： 氮化物系半导体衬底可以包括布置在衬底上的多个中空构件图案，形成在多个中空构件图案之间的衬底上的氮化物基种子层和氮化物基种子上的基于氮化物的缓冲层 层以覆盖多个中空构件图案，其中多个中空构件图案沿第一方向接触基板，并且多个中空构件图案中的每一个的两端在第一方向上敞开。

    Flame retardant resin composition for printed circuit board and printed circuit board using the same
    10.
    发明申请
    Flame retardant resin composition for printed circuit board and printed circuit board using the same 审中-公开
    用于印刷电路板的阻燃树脂组合物和使用其的印刷电路板

    公开(公告)号：US20080090084A1

    公开(公告)日：2008-04-17

    申请号：US11898702

    申请日：2007-09-14

    申请人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Seung-Hyun Ra ,  Jung-Woo Lee ,  Sang-Moon Lee

    发明人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Seung-Hyun Ra ,  Jung-Woo Lee ,  Sang-Moon Lee

    IPC分类号： C09K21/14 ,  B32B27/38

    CPC分类号： C09K21/14 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10T428/31511

    摘要： The present invention relates to a flame retardant resin composition for a printed circuit board and a printed circuit board using the same, in more detail, to a flame retardant resin composition which includes: (a) a complex epoxy resin (b) an amino triazine type curing agent; (c) a curing accelerator; and (d) an inorganic filler, so that the flame retardant resin composition not only can show an excellent thermal stability, an excellent mechanical strength and a suitability for the imprinting lithography method but also can improve the reliability of a substrate by reducing a thermal expansion ratio, and to a printed circuit board using the same.

    摘要翻译： 本发明涉及一种用于印刷电路板的阻燃树脂组合物和使用该阻燃树脂的印刷电路板，更详细地涉及一种阻燃树脂组合物，其包括：（a）复合环氧树脂（b）氨基三嗪 型固化剂; （c）固化促进剂; 和（d）无机填料，使得阻燃性树脂组合物不仅能够显示优异的热稳定性，优异的机械强度和适用于压印光刻方法，而且还可以通过降低热膨胀来提高基板的可靠性 比例和使用该印刷电路板的印刷电路板。