公开(公告)号：US20070290705A1

公开(公告)日：2007-12-20

申请号：US11455110

申请日：2006-06-16

Applicant: Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

Inventor： Benjamin N. Eldridge ,  Roy J. Henson ,  Eric D. Hobbs ,  Peter B. Mathews ,  Makarand S. Shinde

IPC: G01R31/26

CPC classification number: G01R1/07342

Abstract: A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configuration, and then assembling the individual substrates into the final array configuration. The final array configuration of substrates with corners cut or sawed away conforms more closely to the surface area of a wafer being tested, and can easily fit within space limits of a test environment.

Abstract translation: 用于测试半导体器件的复合衬底通过选择多个基本上相同的单独衬底形成，根据它们在最终阵列构型中的位置从至少一些单个衬底切割拐角，然后将各个衬底组装成最终 阵列配置。 具有切割或锯切的角落的基底的最终阵列配置更接近于正被测试的晶片的表面积，并且可以容易地配合在测试环境的空间极限内。