METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PRINTING

    公开(公告)号:US20200350275A1

    公开(公告)日:2020-11-05

    申请号:US15929281

    申请日:2020-04-22

    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

    MULTI-MATERIAL DISPENSING AND COATING SYSTEMS

    公开(公告)号:US20200086341A1

    公开(公告)日:2020-03-19

    申请号:US16694616

    申请日:2019-11-25

    Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

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