SYSTEMS AND METHODS FOR INKJET OR LASER BASED PICK AND PLACE MACHINE AT HIGH SPEED

    公开(公告)号:US20220071072A1

    公开(公告)日:2022-03-03

    申请号:US17305108

    申请日:2021-06-30

    Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.

    3D FABRICATION FOR DENTAL APPLICATIONS BASED ON ABLATION

    公开(公告)号:US20200261191A1

    公开(公告)日:2020-08-20

    申请号:US16774403

    申请日:2020-01-28

    Abstract: A three-dimensional dental device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the dental device will be formed. Active dental material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional dental device has been completed. Thereafter, any remaining support material is removed by water or other solvent.

    PCB production by laser systems
    6.
    发明授权

    公开(公告)号:US12238862B2

    公开(公告)日:2025-02-25

    申请号:US18678263

    申请日:2024-05-30

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

    VARIABLE AREA VACUUM CHUCK SYSTEM AND METHOD FOR OPERATING SAME

    公开(公告)号:US20230048439A1

    公开(公告)日:2023-02-16

    申请号:US17401617

    申请日:2021-08-13

    Abstract: A vacuum chuck system may include a vacuum chuck and a vacuum stopper collection and dispensing system. The vacuum chuck may include a ceramic plate with a retaining surface. The retaining surface may include a plurality of depressions and a plurality of openings, each of the openings being disposed on a bottom surface of one of the depressions and fluidly coupled to a vacuum pump. Vacuum stoppers may be used to seal one or more of the openings so as to restrict the vacuum area of the vacuum chuck. The vacuum stopper collection and dispensing system may be used to collect vacuum stoppers from and dispense vacuum stoppers onto the retaining surface. In addition or in the alternative, an electromagnet or a robotic arm may be used to move a vacuum stopper from a blocking position to a non-blocking position on the retaining surface.

    PCB PRODUCTION BY LASER SYSTEMS
    10.
    发明申请

    公开(公告)号:US20220256698A1

    公开(公告)日:2022-08-11

    申请号:US17249217

    申请日:2021-02-24

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.

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