公开(公告)号：US20160282979A1

公开(公告)日：2016-09-29

申请号：US14667873

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Shwetank Kumar ,  Anchit Dixit ,  Rohit Mittal ,  Jaroslaw J. Sydir ,  Chia-Yun Kuan

IPC: G06F3/044 ,  G09G5/00 ,  G06F3/01

CPC classification number: G06F3/044 ,  G06F1/1698 ,  G06F3/014 ,  G06F3/041 ,  G06F3/0416

Abstract: Systems, apparatuses, and methods may include a touch device having conductive traces to receive human body communication signals and user selection signals such that the human body communication signals are multiplexed with the user selection signals on the conductive traces. A processor receives the human body communication signals and the user selection signals.

Abstract translation: 系统，装置和方法可以包括具有用于接收人体通信信号和用户选择信号的导电迹线的触摸装置，使得人体通信信号与导电迹线上的用户选择信号多路复用。 处理器接收人体通信信号和用户选择信号。

公开(公告)号：US20160211925A1

公开(公告)日：2016-07-21

申请号：US14583584

申请日：2014-12-26

Applicant: Intel Corporation

Inventor： Jaroslaw J. Sydir ,  Anand S. Konanur ,  Ulun Karacaoglu ,  Anthony G. LaMarca ,  Stephen R. Wood

IPC: H04B13/00 ,  G08B1/08

CPC classification number: H04B13/005

Abstract: Data can be transferred from one device to another in the Internet of Things without using a network by a touch-based human body communication (HBC) interaction between a wearable storage module and HBC-compatible interface pads on external host devices. Information on a source host device is copied to the wearable storage module when the user touches the source device's HBC interface pad, can be stored indefinitely on the wearable module, and is copied to a destination host device when the user touches the destination devices HBC interface pad. Because the interface pads only need to be simple electrodes, their size and shape can be widely varied to fit the host devices.

Abstract translation: 通过外部主机设备上的可穿戴式存储模块与HBC兼容的接口焊盘之间的基于触摸的人体通信（HBC）交互，可以在物联网中将数据从一个设备传输到另一个设备。 当用户触摸源设备的HBC接口焊盘时，源主机设备上的信息被复制到可穿戴式存储模块，可以无限期存储在可穿戴模块上，并且当用户触摸目标设备HBC接口时被复制到目标主机设备 垫。 因为接口焊盘只需要简单的电极，它们的尺寸和形状可以被广泛地变化以适应主机设备。

公开(公告)号：US09305194B2

公开(公告)日：2016-04-05

申请号：US14227846

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Farid Adrangi ,  Anand S. Konanur

IPC: H04B7/00 ,  G06K7/10 ,  G06F3/041 ,  G06K19/07 ,  G06K19/073 ,  H04B1/68

CPC classification number: G06K7/10237 ,  G06F3/041 ,  G06K19/0718 ,  G06K19/07354

Abstract: Some demonstrative embodiments include a one-touch input interface. For example, a one-touch input interface may include a hybrid Body-Area-Network (BAN) Near-Field-Communication (NFC) module to receive NFC information from a NFC device via a body of a user; and a fingerprint sensor to sense a fingerprint of the user, wherein the hybrid BAN NFC module and the fingerprint sensor are to receive the NFC information and to sense the fingerprint during a touch of the one-touch interface by the user.

Abstract translation: 一些说明性实施例包括单触输入接口。 例如，单触式输入接口可以包括用于经由用户身体从NFC设备接收NFC信息的混合体区域网络（BAN）近场通信（NFC）模块; 以及用于感测用户的指纹的指纹传感器，其中所述混合BAN NFC模块和所述指纹传感器将接收所述NFC信息并且在所述用户触摸所述一触式界面期间感测所述指纹。

公开(公告)号：US09225388B2

公开(公告)日：2015-12-29

申请号：US13678926

申请日：2012-11-16

Applicant: Intel Corporation

Inventor： Anand S. Konanur ,  Ulun Karacaoglu ,  Songnan Yang

IPC: H04B5/00 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q7/00

CPC classification number: H04B5/0081 ,  H01Q1/2266 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q1/52 ,  H01Q1/528 ,  H01Q7/00 ,  H04B5/00

Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for reducing induced currents in a apparatus chassis. For example, a fractal slot is constructed in the apparatus chassis to reduce the induced currents, and enhance passage of magnetic fields through the apparatus chassis. In this example, the fractal slot may include a no-self loop fractal space filling curve shape to provide high impedance to the induced currents.

Abstract translation: 这里描述了与减少设备底盘中的感应电流的一个或多个系统，装置，方法等相关的技术。 例如，在设备底盘中构造分形槽以减小感应电流，并增强磁场通过设备底盘的通过。 在该示例中，分形槽可以包括非自环分形空间填充曲线形状，以向感应电流提供高阻抗。