公开(公告)号：US20160049316A1

公开(公告)日：2016-02-18

申请号：US14929046

申请日：2015-10-30

Applicant: Intel Corporation

Inventor： Tin Poay Chuah

IPC: H01L21/50 ,  H05K3/46 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01L21/50 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4644 ,  H01L2924/00

Abstract: An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device.

Abstract translation: 一种包括印刷电路板的装置，包括导电材料和绝缘材料的多个交替层的主体; 以及包括设置在印刷电路板的主体内的管芯的封装。 一种包括形成印刷电路板的方法，所述印刷电路板包括芯和积层部分，所述堆积部分包括交替的导电材料层和耦合到所述芯的绝缘材料; 以及将包括管芯的封装耦合到所述印刷电路板的芯部，使得所述封装的侧壁的至少一部分嵌入所述堆积部分的至少一部分中。 一种包括本体的印刷电路板的设备; 包括包括布置在印刷电路板的主体内的微处理器的封装的计算设备; 以及向计算设备提供输入或输出的外围设备。